SG158917A1 - Method of retaining a substrate to a wafer chuck - Google Patents

Method of retaining a substrate to a wafer chuck

Info

Publication number
SG158917A1
SG158917A1 SG201000531-2A SG2010005312A SG158917A1 SG 158917 A1 SG158917 A1 SG 158917A1 SG 2010005312 A SG2010005312 A SG 2010005312A SG 158917 A1 SG158917 A1 SG 158917A1
Authority
SG
Singapore
Prior art keywords
substrate
wafer chuck
retaining
velocity
chuck
Prior art date
Application number
SG201000531-2A
Other languages
English (en)
Inventor
Byung-Jin Choi
Anshuman Cherala
Yeong-Jun Choi
Mario J Meissl
Sidlgata V Sreenivasan
Norman E Schumaker
Xiaoming Lu
Ian M Mcmackin
Daniel A Babbs
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of SG158917A1 publication Critical patent/SG158917A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y10T29/4978—Assisting assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manipulator (AREA)
SG201000531-2A 2005-01-31 2006-01-12 Method of retaining a substrate to a wafer chuck SG158917A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate

Publications (1)

Publication Number Publication Date
SG158917A1 true SG158917A1 (en) 2010-02-26

Family

ID=39730623

Family Applications (2)

Application Number Title Priority Date Filing Date
SG201000531-2A SG158917A1 (en) 2005-01-31 2006-01-12 Method of retaining a substrate to a wafer chuck
SG201000535-3A SG159498A1 (en) 2005-01-31 2006-01-12 Chucking system for nano-manufacturing

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG201000535-3A SG159498A1 (en) 2005-01-31 2006-01-12 Chucking system for nano-manufacturing

Country Status (4)

Country Link
US (1) US7636999B2 (fr)
JP (3) JP5247153B2 (fr)
SG (2) SG158917A1 (fr)
TW (1) TWI327351B (fr)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7162035B1 (en) 2000-05-24 2007-01-09 Tracer Detection Technology Corp. Authentication method and system
AU2001277907A1 (en) 2000-07-17 2002-01-30 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
FR2869601B1 (fr) * 2004-04-28 2006-06-09 Commissariat Energie Atomique Moule pour la nano-impression, procede de fabrication d'un tel moule et utilisation d'un tel moule
US8334967B2 (en) * 2004-05-28 2012-12-18 Board Of Regents, The University Of Texas System Substrate support system having a plurality of contact lands
US7504268B2 (en) * 2004-05-28 2009-03-17 Board Of Regents, The University Of Texas System Adaptive shape substrate support method
US20060177535A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
US20060177532A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography method to control extrusion of a liquid from a desired region on a substrate
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
JP2007134368A (ja) * 2005-11-08 2007-05-31 Nikon Corp パターン転写装置、露光装置及びパターン転写方法
MY144847A (en) 2005-12-08 2011-11-30 Molecular Imprints Inc Method and system for double-sided patterning of substrates
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
KR100689843B1 (ko) * 2006-01-03 2007-03-08 삼성전자주식회사 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법
JP2007250685A (ja) * 2006-03-14 2007-09-27 Engineering System Kk ナノインプリント装置の型押し機構
US20070231422A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. System to vary dimensions of a thin template
JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8377361B2 (en) * 2006-11-28 2013-02-19 Wei Zhang Imprint lithography with improved substrate/mold separation
TW200902332A (en) * 2007-03-26 2009-01-16 Hitachi Maxell Imprinting jig and imprinting apparatus
DE102007032608B4 (de) * 2007-07-11 2009-05-07 Schenck Rotec Gmbh Verfahren und Vorrichtung zum Zentrieren und Spannen eines Werkstücks in einer Auswuchtmaschine
JP5069979B2 (ja) * 2007-09-03 2012-11-07 東芝機械株式会社 離型装置、給排システムおよび離型方法
KR101503331B1 (ko) * 2007-09-28 2015-03-17 도레이 카부시키가이샤 미세 형상 전사시트의 제조방법 및 제조장치
US8945444B2 (en) * 2007-12-04 2015-02-03 Canon Nanotechnologies, Inc. High throughput imprint based on contact line motion tracking control
US7995196B1 (en) 2008-04-23 2011-08-09 Tracer Detection Technology Corp. Authentication method and system
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
NL2003380A (en) * 2008-10-17 2010-04-20 Asml Netherlands Bv Imprint lithography apparatus and method.
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
JP5288191B2 (ja) * 2009-03-17 2013-09-11 大日本印刷株式会社 基板固定装置
SG174889A1 (en) 2009-03-23 2011-11-28 Intevac Inc A process for optimization of island to trench ratio in patterned media
JP5363165B2 (ja) * 2009-03-31 2013-12-11 富士フイルム株式会社 微細凹凸パターンの形成方法及び形成装置
JP5377053B2 (ja) * 2009-04-17 2013-12-25 株式会社東芝 テンプレート及びその製造方法、並びにパターン形成方法
US8802747B2 (en) * 2009-08-26 2014-08-12 Molecular Imprints, Inc. Nanoimprint lithography processes for forming nanoparticles
JP2013503057A (ja) * 2009-08-26 2013-01-31 モレキュラー・インプリンツ・インコーポレーテッド 機能ナノ粒子
US20110084417A1 (en) * 2009-10-08 2011-04-14 Molecular Imprints, Inc. Large area linear array nanoimprinting
US8747092B2 (en) 2010-01-22 2014-06-10 Nanonex Corporation Fast nanoimprinting apparatus using deformale mold
JP5438578B2 (ja) 2010-03-29 2014-03-12 富士フイルム株式会社 微細凹凸パターンの形成方法及び形成装置
KR20130073890A (ko) * 2010-04-27 2013-07-03 몰레큘러 임프린츠 인코퍼레이티드 나노임프린트 리소그래피를 위한 기판/주형의 분리 제어
US8916200B2 (en) 2010-11-05 2014-12-23 Molecular Imprints, Inc. Nanoimprint lithography formation of functional nanoparticles using dual release layers
DE102010063887B4 (de) * 2010-12-22 2012-07-19 BSH Bosch und Siemens Hausgeräte GmbH Verfahren zum Herstellen eines pyrolysetauglichen Bauteils eines Gargeräts sowie pyrolysetaugliches Bauteil für ein Gargerät
JP5875250B2 (ja) * 2011-04-28 2016-03-02 キヤノン株式会社 インプリント装置、インプリント方法及びデバイス製造方法
JP2014528177A (ja) * 2011-09-23 2014-10-23 １３６６ テクノロジーズ インク． 基板移送、ツール押下、ツール伸張、ツール撤退など、熱流動性材料コーティングにおいてツールによってパターンが形成される基板を取り扱い、加熱し、冷却する方法および装置
JP5759348B2 (ja) 2011-11-30 2015-08-05 株式会社Ｓｃｒｅｅｎホールディングス パターン形成装置およびパターン形成方法
JP6086675B2 (ja) 2011-11-30 2017-03-01 株式会社Ｓｃｒｅｅｎホールディングス 印刷装置および印刷方法
DE102012111114B4 (de) 2012-11-19 2018-10-04 Ev Group E. Thallner Gmbh Halbleiterbearbeitungsvorrichtung und -verfahren
WO2014145826A2 (fr) 2013-03-15 2014-09-18 Nanonex Corporation Système et procédés de séparation moule/substrat pour lithographie par impression
US10105883B2 (en) 2013-03-15 2018-10-23 Nanonex Corporation Imprint lithography system and method for manufacturing
JP6242099B2 (ja) * 2013-07-23 2017-12-06 キヤノン株式会社 インプリント方法、インプリント装置およびデバイス製造方法
US9771998B1 (en) 2014-02-13 2017-09-26 Hrl Laboratories, Llc Hierarchical branched micro-truss structure and methods of manufacturing the same
JP6333031B2 (ja) * 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
US9733429B2 (en) * 2014-08-18 2017-08-15 Hrl Laboratories, Llc Stacked microlattice materials and fabrication processes
JP7071118B2 (ja) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ
JP6553926B2 (ja) * 2015-04-09 2019-07-31 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
CN107924865B (zh) * 2015-05-13 2022-03-11 亮锐控股有限公司 用于减少在管芯水平激光剥离期间机械损伤的蓝宝石收集器
JP6774178B2 (ja) * 2015-11-16 2020-10-21 キヤノン株式会社 基板を処理する装置、及び物品の製造方法
US11104057B2 (en) * 2015-12-11 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus and method of imprinting a partial field
JP6700936B2 (ja) * 2016-04-25 2020-05-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6762853B2 (ja) 2016-11-11 2020-09-30 キヤノン株式会社 装置、方法、及び物品製造方法
TWI620351B (zh) * 2017-04-28 2018-04-01 光寶光電（常州）有限公司 紫外光發光二極體封裝結構、紫外光發光單元、及紫外光發光單元的製造方法
JP6995530B2 (ja) * 2017-08-29 2022-01-14 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置及び物品の製造方法
EP3756215B1 (fr) * 2018-02-20 2024-08-07 Applied Materials, Inc. Méthode utilisant un mandrin sous vide à motifs pour le traitement double face
JP7071231B2 (ja) * 2018-06-28 2022-05-18 キヤノン株式会社 平坦化装置、平坦化方法、物品製造方法及び液滴配置パターンデータの作成方法
JP7218114B2 (ja) * 2018-07-12 2023-02-06 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
JP7284639B2 (ja) 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法
JP7507641B2 (ja) 2020-09-08 2024-06-28 キヤノン株式会社 成形装置及び物品の製造方法
KR20240122512A (ko) * 2021-12-11 2024-08-12 램 리써치 코포레이션 고 보우 기판들에 대한 소킹 (soaking) 및 esc 클램핑 시퀀스

Family Cites Families (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7710555A (nl) * 1977-09-28 1979-03-30 Philips Nv Werkwijze en inrichting voor het vervaardigen van informatie bevattende platen.
DE3110341C2 (de) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
FR2513934A1 (fr) * 1981-10-06 1983-04-08 Thomson Csf Procede de demoulage de disque porteur d'informations et dispositif mettant en oeuvre un tel procede
US4551192A (en) 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
US4512848A (en) * 1984-02-06 1985-04-23 Exxon Research And Engineering Co. Procedure for fabrication of microstructures over large areas using physical replication
US4559717A (en) 1984-02-21 1985-12-24 The United States Of America As Represented By The Secretary Of Commerce Flexure hinge
KR900004269B1 (ko) * 1986-06-11 1990-06-18 가부시기가이샤 도시바 제 1물체와 제 2 물체와의 위치 맞추는 방법 및 장치
FR2604553A1 (fr) 1986-09-29 1988-04-01 Rhone Poulenc Chimie Substrat polymere rigide pour disque optique et les disques optiques obtenus a partir dudit substrat
JPS63131352A (ja) * 1986-11-21 1988-06-03 Canon Inc 光学的記録媒体用基板の製造方法
US4731155A (en) * 1987-04-15 1988-03-15 General Electric Company Process for forming a lithographic mask
US5028361A (en) * 1987-11-09 1991-07-02 Takeo Fujimoto Method for molding a photosensitive composition
US5028366A (en) * 1988-01-12 1991-07-02 Air Products And Chemicals, Inc. Water based mold release compositions for making molded polyurethane foam
JP2546350B2 (ja) 1988-09-09 1996-10-23 キヤノン株式会社 位置合わせ装置
JPH02166645A (ja) * 1988-12-21 1990-06-27 Canon Inc 光学的記録媒体用基板の製造方法
US5110514A (en) * 1989-05-01 1992-05-05 Soane Technologies, Inc. Controlled casting of a shrinkable material
US4932358A (en) * 1989-05-18 1990-06-12 Genus, Inc. Perimeter wafer seal
US5151754A (en) 1989-10-06 1992-09-29 Kabushiki Kaisha Toshiba Method and an apparatus for measuring a displacement between two objects and a method and an apparatus for measuring a gap distance between two objects
DE4029912A1 (de) * 1990-09-21 1992-03-26 Philips Patentverwaltung Verfahren zur bildung mindestens eines grabens in einer substratschicht
US5331371A (en) * 1990-09-26 1994-07-19 Canon Kabushiki Kaisha Alignment and exposure method
US5362940A (en) 1990-11-09 1994-11-08 Litel Instruments Use of Fresnel zone plates for material processing
JPH0521584A (ja) * 1991-07-16 1993-01-29 Nikon Corp 保持装置
JPH0580530A (ja) 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
JP2867194B2 (ja) 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
US5545367A (en) * 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
US5371822A (en) 1992-06-09 1994-12-06 Digital Equipment Corporation Method of packaging and assembling opto-electronic integrated circuits
US5601641A (en) * 1992-07-21 1997-02-11 Tse Industries, Inc. Mold release composition with polybutadiene and method of coating a mold core
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
DE69405451T2 (de) * 1993-03-16 1998-03-12 Koninkl Philips Electronics Nv Verfahren und Vorrichtung zur Herstellung eines strukturierten Reliefbildes aus vernetztem Photoresist auf einer flachen Substratoberfläche
JP2837063B2 (ja) * 1993-06-04 1998-12-14 シャープ株式会社 レジストパターンの形成方法
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5776748A (en) * 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
DE4408537A1 (de) * 1994-03-14 1995-09-21 Leybold Ag Vorrichtung für den Transport von Substraten
US5573877A (en) * 1994-03-15 1996-11-12 Matsushita Electric Industrial Co., Ltd. Exposure method and exposure apparatus
US5515167A (en) * 1994-09-13 1996-05-07 Hughes Aircraft Company Transparent optical chuck incorporating optical monitoring
US5563684A (en) 1994-11-30 1996-10-08 Sgs-Thomson Microelectronics, Inc. Adaptive wafer modulator for placing a selected pattern on a semiconductor wafer
US5849209A (en) 1995-03-31 1998-12-15 Johnson & Johnson Vision Products, Inc. Mold material made with additives
GB9509487D0 (en) * 1995-05-10 1995-07-05 Ici Plc Micro relief element & preparation thereof
US5820769A (en) 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
JP2976862B2 (ja) * 1995-09-28 1999-11-10 日本電気株式会社 研磨装置
US5849222A (en) 1995-09-29 1998-12-15 Johnson & Johnson Vision Products, Inc. Method for reducing lens hole defects in production of contact lens blanks
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US20040036201A1 (en) * 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US20040137734A1 (en) * 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US6518189B1 (en) 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US7758794B2 (en) * 2001-10-29 2010-07-20 Princeton University Method of making an article comprising nanoscale patterns with reduced edge roughness
US20030080471A1 (en) * 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method for molding pattern with nanoscale features
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US5669303A (en) 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US6355198B1 (en) * 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
US5942443A (en) * 1996-06-28 1999-08-24 Caliper Technologies Corporation High throughput screening assay systems in microscale fluidic devices
US5888650A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US6074827A (en) * 1996-07-30 2000-06-13 Aclara Biosciences, Inc. Microfluidic method for nucleic acid purification and processing
US5858580A (en) * 1997-09-17 1999-01-12 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
JPH10172897A (ja) 1996-12-05 1998-06-26 Nikon Corp 基板アダプタ，基板保持装置及び基板保持方法
US5948470A (en) 1997-04-28 1999-09-07 Harrison; Christopher Method of nanoscale patterning and products made thereby
US5996415A (en) * 1997-04-30 1999-12-07 Sensys Instruments Corporation Apparatus and method for characterizing semiconductor wafers during processing
US5812629A (en) 1997-04-30 1998-09-22 Clauser; John F. Ultrahigh resolution interferometric x-ray imaging
US5974150A (en) 1997-09-30 1999-10-26 Tracer Detection Technology Corp. System and method for authentication of goods
US6019166A (en) * 1997-12-30 2000-02-01 Intel Corporation Pickup chuck with an integral heatsink
US6198616B1 (en) * 1998-04-03 2001-03-06 Applied Materials, Inc. Method and apparatus for supplying a chucking voltage to an electrostatic chuck within a semiconductor wafer processing system
US6304424B1 (en) * 1998-04-03 2001-10-16 Applied Materials Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
JP3780700B2 (ja) 1998-05-26 2006-05-31 セイコーエプソン株式会社 パターン形成方法、パターン形成装置、パターン形成用版、パターン形成用版の製造方法、カラーフィルタの製造方法、導電膜の製造方法及び液晶パネルの製造方法
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6713238B1 (en) * 1998-10-09 2004-03-30 Stephen Y. Chou Microscale patterning and articles formed thereby
US6726195B1 (en) * 1998-10-13 2004-04-27 Dek International Gmbh Method for ensuring planarity when using a flexible, self conforming, workpiece support system
US6218316B1 (en) * 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
JP4204128B2 (ja) * 1999-01-18 2009-01-07 東京応化工業株式会社 基板搬送装置及び基板搬送方法
US6274294B1 (en) * 1999-02-03 2001-08-14 Electroformed Stents, Inc. Cylindrical photolithography exposure process and apparatus
JP2000243806A (ja) * 1999-02-22 2000-09-08 Tamagawa Machinery Co Ltd ウエハの加熱処理装置
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6160430A (en) 1999-03-22 2000-12-12 Ati International Srl Powerup sequence artificial voltage supply circuit
US6305677B1 (en) 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
US6220561B1 (en) * 1999-06-30 2001-04-24 Sandia Corporation Compound floating pivot micromechanisms
WO2001011431A2 (fr) * 1999-08-06 2001-02-15 Applied Materials, Inc. Procede et dispositif de tenue des plaquettes a semi-conducteurs pour des traitements tels que la lithogravure
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
US6809802B1 (en) 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
JP4298078B2 (ja) * 1999-08-20 2009-07-15 キヤノン株式会社 基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイスの製造方法
US6589889B2 (en) * 1999-09-09 2003-07-08 Alliedsignal Inc. Contact planarization using nanoporous silica materials
US6512401B2 (en) 1999-09-10 2003-01-28 Intel Corporation Output buffer for high and low voltage bus
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
EP1251974B1 (fr) * 1999-12-23 2005-05-04 University of Massachusetts Procedes de formation de motifs inferieurs au micron sur des films
US6498640B1 (en) 1999-12-30 2002-12-24 Koninklijke Philips Electronics N.V. Method to measure alignment using latent image grating structures
JP2001239487A (ja) * 2000-02-29 2001-09-04 Nippei Toyama Corp ウェーハの搬送装置における真空保持装置および真空保持解除方法
US6313567B1 (en) 2000-04-10 2001-11-06 Motorola, Inc. Lithography chuck having piezoelectric elements, and method
US7859519B2 (en) * 2000-05-01 2010-12-28 Tulbert David J Human-machine interface
JP4640876B2 (ja) * 2000-06-13 2011-03-02 株式会社アルバック 基板搬送装置
JP2001358056A (ja) * 2000-06-15 2001-12-26 Canon Inc 露光装置
EP2264524A3 (fr) * 2000-07-16 2011-11-30 The Board of Regents of The University of Texas System Procédés d'alignement à haute résolution et systèmes correspondants pour la lithographie par embossage
US20050037143A1 (en) * 2000-07-18 2005-02-17 Chou Stephen Y. Imprint lithography with improved monitoring and control and apparatus therefor
US7211214B2 (en) * 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
US7635262B2 (en) * 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US6326627B1 (en) 2000-08-02 2001-12-04 Archimedes Technology Group, Inc. Mass filtering sputtered ion source
US6718630B2 (en) * 2000-09-18 2004-04-13 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting components on substrate
EP1352295B1 (fr) * 2000-10-12 2015-12-23 Board of Regents, The University of Texas System Gabarit pour photolithographie a temperature ambiante et basse pression produisant des empreintes de l'ordre du micron et du nanometre
JP3834469B2 (ja) * 2000-11-15 2006-10-18 富士写真フイルム株式会社 基板搬送システム及びそれを用いた基板搬送方法
WO2002047139A2 (fr) * 2000-12-04 2002-06-13 Ebara Corporation Procede de traitement de substrat
US6612590B2 (en) 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
US6387787B1 (en) * 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US6955767B2 (en) 2001-03-22 2005-10-18 Hewlett-Packard Development Company, Lp. Scanning probe based lithographic alignment
US6517977B2 (en) * 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
US6964793B2 (en) 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
US6847433B2 (en) * 2001-06-01 2005-01-25 Agere Systems, Inc. Holder, system, and process for improving overlay in lithography
US6678038B2 (en) * 2001-08-03 2004-01-13 Nikon Corporation Apparatus and methods for detecting tool-induced shift in microlithography apparatus
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
WO2003035932A1 (fr) * 2001-09-25 2003-05-01 Minuta Technology Co., Ltd. Procede de formation d'un micromotif sur un substrat, par force capillaire
US6771372B1 (en) * 2001-11-01 2004-08-03 Therma-Wave, Inc. Rotational stage with vertical axis adjustment
US6621960B2 (en) 2002-01-24 2003-09-16 Oplink Communications, Inc. Method of fabricating multiple superimposed fiber Bragg gratings
US6736408B2 (en) * 2002-01-25 2004-05-18 Applied Materials Inc. Rotary vacuum-chuck with venturi formed at base of rotating shaft
US6759180B2 (en) 2002-04-23 2004-07-06 Hewlett-Packard Development Company, L.P. Method of fabricating sub-lithographic sized line and space patterns for nano-imprinting lithography
US6849558B2 (en) * 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
EP1511632B1 (fr) * 2002-05-27 2011-11-02 Koninklijke Philips Electronics N.V. Procede et systeme de transfert d'un motif d'une surface d'estampage vers un substrat
US6932934B2 (en) * 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7077992B2 (en) * 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US7019819B2 (en) * 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US6900881B2 (en) * 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US6908861B2 (en) * 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US6936194B2 (en) 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
US6980282B2 (en) 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
US7750059B2 (en) * 2002-12-04 2010-07-06 Hewlett-Packard Development Company, L.P. Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US6805054B1 (en) * 2003-05-14 2004-10-19 Molecular Imprints, Inc. Method, system and holder for transferring templates during imprint lithography processes
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
JP4090416B2 (ja) * 2003-09-30 2008-05-28 日東電工株式会社 粘着テープ付ワークの離脱方法及び離脱装置
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
US20060177532A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography method to control extrusion of a liquid from a desired region on a substrate
US20060177535A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
US7670530B2 (en) * 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks

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US7636999B2 (en) 2009-12-29
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JP5247153B2 (ja) 2013-07-24
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JP2008532263A (ja) 2008-08-14
JP2008537513A (ja) 2008-09-18
US20060172553A1 (en) 2006-08-03
JP4648408B2 (ja) 2011-03-09
TW200636901A (en) 2006-10-16

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