SG11201704514XA - Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material - Google Patents
Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing materialInfo
- Publication number
- SG11201704514XA SG11201704514XA SG11201704514XA SG11201704514XA SG11201704514XA SG 11201704514X A SG11201704514X A SG 11201704514XA SG 11201704514X A SG11201704514X A SG 11201704514XA SG 11201704514X A SG11201704514X A SG 11201704514XA SG 11201704514X A SG11201704514X A SG 11201704514XA
- Authority
- SG
- Singapore
- Prior art keywords
- epoxy resin
- sealing material
- cured product
- semiconductor sealing
- resin composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Compounds (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014246000 | 2014-12-04 | ||
| PCT/JP2015/083939 WO2016088815A1 (ja) | 2014-12-04 | 2015-12-02 | テトラメチルビフェノール型エポキシ樹脂、エポキシ樹脂組成物、硬化物及び半導体封止材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201704514XA true SG11201704514XA (en) | 2017-07-28 |
Family
ID=56091755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201704514XA SG11201704514XA (en) | 2014-12-04 | 2015-12-02 | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10381282B2 (zh) |
| JP (1) | JP6607009B2 (zh) |
| KR (1) | KR102466597B1 (zh) |
| CN (2) | CN107001580A (zh) |
| MY (1) | MY181374A (zh) |
| SG (1) | SG11201704514XA (zh) |
| TW (1) | TWI739731B (zh) |
| WO (1) | WO2016088815A1 (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108693709A (zh) * | 2017-03-29 | 2018-10-23 | 株式会社田村制作所 | 感光性树脂组合物 |
| WO2018225411A1 (ja) * | 2017-06-07 | 2018-12-13 | Dic株式会社 | エポキシ樹脂、製造方法、エポキシ樹脂組成物及びその硬化物 |
| KR102244206B1 (ko) * | 2017-12-06 | 2021-04-26 | 스미또모 베이크라이트 가부시키가이샤 | 에폭시 수지 조성물 및 전자 장치 |
| WO2021187235A1 (ja) * | 2020-03-16 | 2021-09-23 | 三菱ケミカル株式会社 | エポキシ樹脂組成物、硬化物及び電気・電子部品 |
| KR102473850B1 (ko) * | 2022-06-14 | 2022-12-05 | 주식회사 신아티앤씨 | 테트라메틸비페놀형 에폭시 수지 및 이의 제조방법 |
| TW202402865A (zh) * | 2022-06-14 | 2024-01-16 | 南韓商新亚Ｔ&Ｃ公司 | 四甲基雙酚型環氧樹脂以及其製備方法，四甲基雙酚型環氧樹脂組成物，固化物 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5839677A (ja) | 1981-09-02 | 1983-03-08 | Mitsubishi Petrochem Co Ltd | 新規ポリエポキシ化合物 |
| JPS6067475A (ja) * | 1983-09-22 | 1985-04-17 | Mitsubishi Petrochem Co Ltd | ビスヒドロキシビフエニル誘導体系ジエポキシ化合物の精製法 |
| US5104604A (en) | 1989-10-05 | 1992-04-14 | Dexter Electronic Materials Div. Of Dexter Corp. | Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound |
| JP2747930B2 (ja) * | 1989-10-11 | 1998-05-06 | 油化シエルエポキシ株式会社 | 半導体封止用エポキシ樹脂組成物 |
| JP2767310B2 (ja) * | 1990-02-16 | 1998-06-18 | 油化シエルエポキシ株式会社 | 半導体封止用エポキシ樹脂組成物 |
| JP2511316B2 (ja) * | 1990-06-25 | 1996-06-26 | 油化シエルエポキシ株式会社 | 半導体封止用エポキシ樹脂組成物 |
| DE69118746T2 (de) | 1990-05-23 | 1996-10-31 | Shell Int Research | Addukte phenolischer Verbindungen und cyclische Terpene und Derivate dieser Addukte |
| JP2566178B2 (ja) * | 1990-11-08 | 1996-12-25 | 油化シエルエポキシ株式会社 | エポキシ樹脂粉体組成物 |
| JPH0586171A (ja) * | 1991-09-27 | 1993-04-06 | Yuka Shell Epoxy Kk | 半導体封止用のエポキシ樹脂組成物 |
| JPH0586170A (ja) * | 1991-09-27 | 1993-04-06 | Yuka Shell Epoxy Kk | 半導体封止用エポキシ樹脂組成物 |
| JPH05136297A (ja) * | 1991-11-14 | 1993-06-01 | Nippon Kayaku Co Ltd | 電子部品封止用樹脂組成物及びその硬化物 |
| JP3484681B2 (ja) * | 1994-03-10 | 2004-01-06 | 大日本インキ化学工業株式会社 | エポキシ樹脂組成物、エポキシ樹脂混合物の製造方法及び半導体封止材料 |
| JPH1129694A (ja) | 1997-07-09 | 1999-02-02 | Nippon Steel Chem Co Ltd | エポキシ樹脂組成物及びその硬化物 |
| JP2002104857A (ja) * | 2000-09-26 | 2002-04-10 | Matsushita Electric Works Ltd | 人造大理石の製造方法 |
| JP2002128861A (ja) * | 2000-10-23 | 2002-05-09 | Japan Epoxy Resin Kk | エポキシ樹脂組成物及びその製法 |
| JP3712610B2 (ja) | 2000-12-28 | 2005-11-02 | ジャパンエポキシレジン株式会社 | エポキシ樹脂結晶化物、硬化性組成物及び硬化物 |
| JP2002212268A (ja) * | 2001-01-19 | 2002-07-31 | Japan Epoxy Resin Kk | 半導体封止用エポキシ樹脂組成物 |
| JP3947490B2 (ja) * | 2002-04-23 | 2007-07-18 | 三菱化学株式会社 | ３，３’，５，５’−テトラメチル−４，４’−ビフェノール及びその製造方法ならびにエポキシ樹脂組成物の製造方法 |
| JP2003327554A (ja) * | 2002-05-09 | 2003-11-19 | Mitsubishi Chemicals Corp | ３，３’，５，５’−テトラメチル−４，４’−ビフェノール及びその製造方法 |
| JP3986445B2 (ja) * | 2003-02-17 | 2007-10-03 | 東都化成株式会社 | 高純度エポキシ樹脂の製造方法およびエポキシ樹脂組成物 |
| JP3731585B2 (ja) * | 2003-04-21 | 2006-01-05 | 大日本インキ化学工業株式会社 | エポキシ樹脂の製造方法 |
| JP4271632B2 (ja) * | 2004-08-13 | 2009-06-03 | ジャパンエポキシレジン株式会社 | エポキシ樹脂結晶化物 |
| JP2004315831A (ja) * | 2004-08-13 | 2004-11-11 | Japan Epoxy Resin Kk | エポキシ樹脂組成物の製造方法 |
| JP4271631B2 (ja) * | 2004-08-13 | 2009-06-03 | ジャパンエポキシレジン株式会社 | エポキシ樹脂結晶化物の製造方法 |
| JP2005002351A (ja) * | 2004-08-13 | 2005-01-06 | Japan Epoxy Resin Kk | 半導体封止用硬化性エポキシ樹脂組成物 |
| JP4945958B2 (ja) * | 2005-08-23 | 2012-06-06 | 三菱化学株式会社 | 精製エポキシ樹脂の製造方法 |
| JP4826301B2 (ja) | 2006-03-15 | 2011-11-30 | 住友ベークライト株式会社 | 潜伏性触媒の製造方法およびエポキシ樹脂組成物 |
| JP2008045075A (ja) | 2006-08-21 | 2008-02-28 | Sumitomo Bakelite Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
| CN101724137B (zh) * | 2009-07-13 | 2011-08-31 | 北京石油化工学院 | 含联苯结构环氧树脂的制备方法 |
| JP5584301B2 (ja) | 2009-09-30 | 2014-09-03 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂組成物 |
| JP2011207932A (ja) * | 2010-03-29 | 2011-10-20 | Mitsubishi Chemicals Corp | エポキシ樹脂及びエポキシ樹脂組成物 |
| JP5552089B2 (ja) | 2011-04-21 | 2014-07-16 | 京セラケミカル株式会社 | 封止用樹脂組成物及び半導体装置 |
| JP5933954B2 (ja) * | 2011-10-17 | 2016-06-15 | 新日鉄住金化学株式会社 | エポキシ樹脂組成物及び硬化物 |
| KR102047682B1 (ko) * | 2012-11-08 | 2019-11-22 | 닛뽄 가야쿠 가부시키가이샤 | 에폭시 수지 혼합물, 에폭시 수지 조성물 및 그 경화물 |
-
2015
- 2015-12-02 SG SG11201704514XA patent/SG11201704514XA/en unknown
- 2015-12-02 MY MYPI2017702006A patent/MY181374A/en unknown
- 2015-12-02 WO PCT/JP2015/083939 patent/WO2016088815A1/ja active Application Filing
- 2015-12-02 CN CN201580065745.9A patent/CN107001580A/zh active Pending
- 2015-12-02 KR KR1020177015251A patent/KR102466597B1/ko active IP Right Grant
- 2015-12-02 CN CN201910795156.6A patent/CN110483741B/zh active Active
- 2015-12-02 JP JP2015235746A patent/JP6607009B2/ja active Active
- 2015-12-04 TW TW104140767A patent/TWI739731B/zh active
-
2017
- 2017-06-02 US US15/612,609 patent/US10381282B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016108562A (ja) | 2016-06-20 |
| CN110483741A (zh) | 2019-11-22 |
| JP6607009B2 (ja) | 2019-11-20 |
| CN107001580A (zh) | 2017-08-01 |
| US20170271226A1 (en) | 2017-09-21 |
| KR20170091622A (ko) | 2017-08-09 |
| KR102466597B1 (ko) | 2022-11-11 |
| US10381282B2 (en) | 2019-08-13 |
| TW201627393A (zh) | 2016-08-01 |
| TWI739731B (zh) | 2021-09-21 |
| MY181374A (en) | 2020-12-21 |
| CN110483741B (zh) | 2022-07-12 |
| WO2016088815A1 (ja) | 2016-06-09 |
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