PT3450499T - Composição de resina curável e produto curado obtido a partir da mesma - Google Patents
Composição de resina curável e produto curado obtido a partir da mesmaInfo
- Publication number
- PT3450499T PT3450499T PT177897295T PT17789729T PT3450499T PT 3450499 T PT3450499 T PT 3450499T PT 177897295 T PT177897295 T PT 177897295T PT 17789729 T PT17789729 T PT 17789729T PT 3450499 T PT3450499 T PT 3450499T
- Authority
- PT
- Portugal
- Prior art keywords
- composition
- curable resin
- cured product
- cured
- curable
- Prior art date
Links
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0233—Polyamines derived from (poly)oxazolines, (poly)oxazines or having pendant acyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/64—Amino alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016091115 | 2016-04-28 | ||
JP2016188911 | 2016-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
PT3450499T true PT3450499T (pt) | 2024-01-12 |
Family
ID=60160774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT177897295T PT3450499T (pt) | 2016-04-28 | 2017-04-28 | Composição de resina curável e produto curado obtido a partir da mesma |
Country Status (8)
Country | Link |
---|---|
US (1) | US20190119447A1 (pt) |
EP (1) | EP3450499B1 (pt) |
JP (1) | JP6952684B2 (pt) |
KR (1) | KR102324393B1 (pt) |
CN (1) | CN109071918B (pt) |
PT (1) | PT3450499T (pt) |
TW (1) | TWI762483B (pt) |
WO (1) | WO2017188448A1 (pt) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6946088B2 (ja) * | 2017-07-14 | 2021-10-06 | Eneos株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
WO2019083002A1 (ja) * | 2017-10-27 | 2019-05-02 | Jxtgエネルギー株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
TWI794314B (zh) * | 2017-10-27 | 2023-03-01 | 日商Jxtg能源股份有限公司 | 硬化樹脂用組合物、該組合物之硬化物、該組合物及該硬化物之製造方法、與半導體裝置 |
EP3702390B1 (en) | 2017-10-27 | 2023-12-27 | ENEOS Corporation | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
US20210024748A1 (en) * | 2018-03-30 | 2021-01-28 | Toray Industries, Inc. | Benzoxazine resin composition, prepreg, and fiber-reinforced composite material |
US10487077B1 (en) | 2018-06-14 | 2019-11-26 | Sabic Global Technologies B.V. | Bis(benzoxazinyl)phthalimidine and associated curable composition and composite |
WO2020027257A1 (ja) * | 2018-08-03 | 2020-02-06 | Jxtgエネルギー株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
TW202031786A (zh) * | 2018-12-10 | 2020-09-01 | 日商Jxtg能源股份有限公司 | 硬化樹脂用組合物、該組合物之硬化物、該組合物及該硬化物之製造方法、與半導體裝置 |
WO2020175520A1 (ja) * | 2019-02-26 | 2020-09-03 | ナガセケムテックス株式会社 | 硬化性材料の硬化物、硬化物の製造方法、およびポリマー組成物 |
WO2020218457A1 (ja) * | 2019-04-26 | 2020-10-29 | Jxtgエネルギー株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
JP2022118627A (ja) * | 2021-02-02 | 2022-08-15 | Eneos株式会社 | 硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置 |
CN114573842B (zh) * | 2022-03-14 | 2023-09-26 | 山东大学 | 耐高温、可再加工的苯并噁嗪热固性树脂及其合成方法与应用 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05230168A (ja) * | 1992-02-18 | 1993-09-07 | Nippon Oil Co Ltd | エポキシ樹脂の製造方法 |
JP2006233188A (ja) * | 2005-01-31 | 2006-09-07 | Toray Ind Inc | 複合材料用プリプレグ、および複合材料 |
US8431655B2 (en) * | 2007-04-09 | 2013-04-30 | Designer Molecules, Inc. | Curatives for epoxy compositions |
EP2254875A4 (en) * | 2008-02-21 | 2012-10-10 | Huntsman Adv Mat Americas Inc | HALOGEN-FREE, BENZOXAZINE-BASED HARDENABLE COMPOSITIONS FOR HIGH-TIER APPLICATIONS |
JP2010174073A (ja) * | 2009-01-27 | 2010-08-12 | Mitsubishi Rayon Co Ltd | 繊維強化複合材料用エポキシ樹脂組成物およびそれを用いた繊維強化複合材料 |
US20110313080A1 (en) * | 2009-02-12 | 2011-12-22 | Benzoxazine Resin Composition | Benzoxazine resin composition |
JP5837872B2 (ja) * | 2009-05-14 | 2015-12-24 | ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー | モノベンズオキサジンに基づく液体樹脂組成物 |
CN102206397B (zh) * | 2010-03-29 | 2012-11-28 | 台光电子材料股份有限公司 | 树脂组合物及包含其的半固化胶片、层合板和电路板 |
WO2012015604A1 (en) * | 2010-07-28 | 2012-02-02 | Huntsman Advanced Materials Americas Llc | Solvent-free benzoxazine based thermosetting resin composition |
JP2012036318A (ja) | 2010-08-10 | 2012-02-23 | Gun Ei Chem Ind Co Ltd | 熱硬化性樹脂 |
JP2013253123A (ja) * | 2011-07-29 | 2013-12-19 | Sumitomo Osaka Cement Co Ltd | 複合磁性体とそれを備えたアンテナ及び通信装置並びに複合磁性体の製造方法 |
JP2013060407A (ja) | 2011-09-15 | 2013-04-04 | Sumitomo Chemical Co Ltd | ベンゾオキサジン化合物およびその製造方法 |
ES2853948T3 (es) * | 2012-02-17 | 2021-09-20 | Huntsman Advanced Mat Americas Llc | Mezcla de benzoxazina, epoxi y anhídrido |
CN103421273B (zh) * | 2012-05-22 | 2016-02-10 | 中山台光电子材料有限公司 | 无卤素树脂组成物 |
CN103540101B (zh) * | 2012-07-17 | 2016-01-20 | 台光电子材料(昆山)有限公司 | 无卤素树脂组合物及应用其的铜箔基板及印刷电路板 |
CN103265791B (zh) * | 2013-05-29 | 2015-04-08 | 苏州生益科技有限公司 | 一种用于集成电路的热固性树脂组合物及使用其制作的半固化片及层压板 |
KR101671877B1 (ko) * | 2013-08-23 | 2016-11-03 | 엘리트 일렉트로닉 메터리얼 (쿤샨) 컴퍼니 리미티드 | 수지조성물, 이를 사용한 동박기판 및 인쇄회로 |
CN103554834B (zh) * | 2013-09-04 | 2016-04-20 | 东莞联茂电子科技有限公司 | 一种无卤高频树脂组合物 |
CN103937157A (zh) * | 2014-03-05 | 2014-07-23 | 浙江华正新材料股份有限公司 | 无卤树脂组合物及采用其制造半固化片及层压板的方法 |
EP3135677B1 (en) * | 2014-04-25 | 2018-10-10 | JX Nippon Oil & Energy Corporation | Alicyclic diepoxy compound having bis-spironorbornane structure, method for producing same, and use for same |
CN103965624B (zh) * | 2014-05-28 | 2016-08-31 | 苏州生益科技有限公司 | 一种无卤树脂组合物、由其制备的预浸料及层压板 |
CN103980704B (zh) * | 2014-05-28 | 2016-09-14 | 苏州生益科技有限公司 | 用于高频高速基板的无卤树脂组合物、半固化片及层压板 |
CN105131597B (zh) * | 2014-06-05 | 2017-11-21 | 广东生益科技股份有限公司 | 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板 |
JP2016047903A (ja) * | 2014-08-28 | 2016-04-07 | Jx日鉱日石エネルギー株式会社 | 熱硬化性樹脂組成物及び樹脂硬化物 |
CN104817823A (zh) * | 2015-05-19 | 2015-08-05 | 广州宏仁电子工业有限公司 | 有卤树脂组合物及其应用 |
MX2018000762A (es) * | 2015-07-23 | 2018-05-15 | Huntsman Advanced Mat Americas Llc | Composiciones curables de benzoxazina. |
CN105482452A (zh) * | 2015-12-25 | 2016-04-13 | 广东生益科技股份有限公司 | 一种无卤树脂组合物以及含有它的预浸料、层压板和印制电路板 |
US20200095422A1 (en) * | 2016-12-09 | 2020-03-26 | Jxtg Nippon Oil & Energy Corporation | Curable resin composition, cured product obtained from the same, method for hardening the same, and semiconductor device |
US11560465B2 (en) * | 2017-03-31 | 2023-01-24 | Eneos Corporation | Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device |
-
2017
- 2017-04-28 US US16/096,969 patent/US20190119447A1/en not_active Abandoned
- 2017-04-28 JP JP2018514742A patent/JP6952684B2/ja active Active
- 2017-04-28 KR KR1020187033627A patent/KR102324393B1/ko active IP Right Grant
- 2017-04-28 EP EP17789729.5A patent/EP3450499B1/en active Active
- 2017-04-28 CN CN201780026301.3A patent/CN109071918B/zh active Active
- 2017-04-28 TW TW106114324A patent/TWI762483B/zh active
- 2017-04-28 WO PCT/JP2017/017066 patent/WO2017188448A1/ja unknown
- 2017-04-28 PT PT177897295T patent/PT3450499T/pt unknown
Also Published As
Publication number | Publication date |
---|---|
TWI762483B (zh) | 2022-05-01 |
CN109071918A (zh) | 2018-12-21 |
JP6952684B2 (ja) | 2021-10-20 |
EP3450499B1 (en) | 2023-11-01 |
CN109071918B (zh) | 2022-04-15 |
EP3450499A4 (en) | 2019-10-09 |
KR20190003590A (ko) | 2019-01-09 |
US20190119447A1 (en) | 2019-04-25 |
WO2017188448A1 (ja) | 2017-11-02 |
KR102324393B1 (ko) | 2021-11-10 |
JPWO2017188448A1 (ja) | 2019-03-07 |
TW201803859A (zh) | 2018-02-01 |
EP3450499A1 (en) | 2019-03-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PT3450499T (pt) | Composição de resina curável e produto curado obtido a partir da mesma | |
EP3165549A4 (en) | Epoxy resin composition for electronic material, cured product thereof and electronic member | |
EP3239206A4 (en) | Epoxy resin, epoxy resin composition, inorganic-filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound | |
EP3434709A4 (en) | HARDENED COMPOSITION AND CURED PRODUCT MADE BY HARDENING | |
EP3165572A4 (en) | Curable composition and cured object obtained therefrom | |
EP2944675A4 (en) | HARDENABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | |
EP3235845A4 (en) | Photocurable and thermosetting resin composition, cured product and laminate | |
EP3345951A4 (en) | HARDENABLE COMPOSITION AND HARDENED ARTICLE THEREWITH | |
EP3006504A4 (en) | VULCANIZABLE COMPOSITION AND VULCANIZED PRODUCT OBTAINED | |
EP3378898A4 (en) | Curable composition and cured product thereof | |
SG11201901693YA (en) | Resin composition | |
EP3246364A4 (en) | Curable composition and cured article obtained therefrom | |
EP3202796A4 (en) | Curable resin composition | |
EP3336121A4 (en) | CURABLE COMPOSITION AND CURED PRODUCT THEREOF | |
EP3184598A4 (en) | Anti-static agent, anti-static agent composition, anti-static resin composition, and molding | |
EP3527620C0 (en) | CURED RESIN COMPOSITION | |
EP3546494A4 (en) | CURING AGENT FOR AQUEOUS-BASED EPOXY RESIN, AQUEOUS-BASED EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF | |
EP3613781A4 (en) | COMPOSITION OF HARDENABLE RESIN, ASSOCIATED HARDENED OBJECT, AND STRUCTURE CONTAINING THIS HARDENED OBJECT | |
EP3336122A4 (en) | CURABLE COMPOSITION AND CURED PRODUCT THEREOF | |
EP3345950A4 (en) | FIBER REINFORCED PLASTIC RESIN COMPOSITION, HARDENED FIBER-REINFORCED PLASTIC PRODUCT CONTAINING THE SAME, AND METHOD FOR MANUFACTURING THE FIBER-REINFORCED PLASTIC | |
EP3137930A4 (en) | Bicarbazole compound, photo-curable composition, cured produc thereof, curable composition for plastic lens, and plastic lens | |
EP3275351A4 (en) | Ovenware, and resin composition for molding ovenware | |
EP3374433A4 (en) | HARDENABLE ORGANOPOLYSILOXANE COMPOSITION AND CURED PRODUCT THEREOF | |
EP3118236A4 (en) | Resin composition and cured product thereof | |
EP3335859A4 (en) | RESIN COMPOSITION, CURED PRODUCT AND REINFORCED WELDING METHOD |