EP3118236A4 - Resin composition and cured product thereof - Google Patents

Resin composition and cured product thereof Download PDF

Info

Publication number
EP3118236A4
EP3118236A4 EP14885174.4A EP14885174A EP3118236A4 EP 3118236 A4 EP3118236 A4 EP 3118236A4 EP 14885174 A EP14885174 A EP 14885174A EP 3118236 A4 EP3118236 A4 EP 3118236A4
Authority
EP
European Patent Office
Prior art keywords
resin composition
cured product
cured
product
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14885174.4A
Other languages
German (de)
French (fr)
Other versions
EP3118236B1 (en
EP3118236A1 (en
Inventor
Seiji Nakajima
Yosuke Tatsuno
Mitsuo Ito
Satoshi Hirono
Yuzo Morisaki
Junji Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of EP3118236A1 publication Critical patent/EP3118236A1/en
Publication of EP3118236A4 publication Critical patent/EP3118236A4/en
Application granted granted Critical
Publication of EP3118236B1 publication Critical patent/EP3118236B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C08K7/20—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/02—Polyglycidyl ethers of bis-phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
EP14885174.4A 2014-03-14 2014-11-06 Resin composition and cured product thereof Active EP3118236B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014052106A JP6331526B2 (en) 2014-03-14 2014-03-14 Resin composition and cured product thereof
PCT/JP2014/079460 WO2015136771A1 (en) 2014-03-14 2014-11-06 Resin composition and cured product thereof

Publications (3)

Publication Number Publication Date
EP3118236A1 EP3118236A1 (en) 2017-01-18
EP3118236A4 true EP3118236A4 (en) 2017-10-25
EP3118236B1 EP3118236B1 (en) 2020-07-01

Family

ID=54071237

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14885174.4A Active EP3118236B1 (en) 2014-03-14 2014-11-06 Resin composition and cured product thereof

Country Status (6)

Country Link
US (1) US10138348B2 (en)
EP (1) EP3118236B1 (en)
JP (1) JP6331526B2 (en)
KR (1) KR20160113290A (en)
CN (1) CN106062028B (en)
WO (1) WO2015136771A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6274707B2 (en) * 2014-05-22 2018-02-07 株式会社デンソー Photo-curing adhesive
JP7129414B2 (en) * 2017-08-24 2022-09-01 古河電気工業株式会社 Coating material for optical fiber, coated optical fiber, and method for producing coated optical fiber
MX2021004184A (en) * 2018-10-12 2021-09-08 Ppg Ind Ohio Inc Compositions containing thermally conductive fillers.
JP7295768B2 (en) * 2019-10-02 2023-06-21 東京応化工業株式会社 Curable composition, cured product, and method for forming cured product
JP2022090522A (en) * 2020-12-07 2022-06-17 株式会社東芝 Insulating resin composition, insulating member comprising the cured material, and electrical machine
KR102536114B1 (en) * 2022-12-29 2023-05-26 (재)한국건설생활환경시험연구원 Output material composition for 3D printer using UV resin and ceramic powder, and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1348742A2 (en) * 2002-03-28 2003-10-01 Rohm And Haas Company Coating powders, methods of manufacture thereof, and articles formed therefrom
JP2004331728A (en) * 2003-05-01 2004-11-25 Nippon Steel Chem Co Ltd Adhesive film for covering electronic component
JP2008247951A (en) * 2007-03-29 2008-10-16 Nippon Steel Chem Co Ltd Liquid epoxy resin composition for protecting semiconductor device, cured epoxy resin, method for producing semiconductor device and semiconductor device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855970B2 (en) 1975-08-09 1983-12-13 旭化成株式会社 Ichiekigata epoxy resin
JPS5959720A (en) 1982-09-29 1984-04-05 Asahi Chem Ind Co Ltd New one-component curing agent for epoxy resin
JPS62285913A (en) 1986-06-05 1987-12-11 Ajinomoto Co Inc Epoxy resin composition
JPH03139517A (en) 1989-10-25 1991-06-13 Ajinomoto Co Inc One-pack epoxy rein composition
JPH066621B2 (en) 1990-04-16 1994-01-26 富士化成工業株式会社 One-component heat-curable epoxide composition
JP3261749B2 (en) 1992-08-04 2002-03-04 味の素株式会社 One-part epoxy resin composition
JP3367531B2 (en) 1992-10-22 2003-01-14 味の素株式会社 Epoxy resin composition
JP3391074B2 (en) 1994-01-07 2003-03-31 味の素株式会社 Epoxy resin composition
JP3527341B2 (en) * 1995-12-13 2004-05-17 株式会社大林組 Seismic retrofitting method for existing structures and fiber sheet used in the method
JP2001207029A (en) * 2000-01-27 2001-07-31 Sumitomo Bakelite Co Ltd One-component liquid epoxy resin composition
US6936644B2 (en) 2002-10-16 2005-08-30 Cookson Electronics, Inc. Releasable microcapsule and adhesive curing system using the same
JP2007023191A (en) * 2005-07-19 2007-02-01 Sumitomo Bakelite Co Ltd One-pack type epoxy resin composition
EP1980580A1 (en) * 2006-02-03 2008-10-15 Asahi Kasei Chemicals Corporation Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article
JP5227119B2 (en) * 2007-09-03 2013-07-03 ナミックス株式会社 Light-heat combination type latent curable epoxy resin composition
JP5754073B2 (en) 2010-03-17 2015-07-22 株式会社デンソー Method for producing cured composite and cured composite
JP5273745B2 (en) * 2010-09-10 2013-08-28 信越化学工業株式会社 Overcoat material and semiconductor device using the same
JP2012224733A (en) 2011-04-19 2012-11-15 Mitsui Chemicals Inc Adhesive composition, production method of the same, cured material of the same, and electronic device using the same
TWI545155B (en) * 2012-06-05 2016-08-11 三菱麗陽股份有限公司 Epoxy resin composition, tow prepreg, pressure vessel reinforced by composite material and tendon

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1348742A2 (en) * 2002-03-28 2003-10-01 Rohm And Haas Company Coating powders, methods of manufacture thereof, and articles formed therefrom
JP2004331728A (en) * 2003-05-01 2004-11-25 Nippon Steel Chem Co Ltd Adhesive film for covering electronic component
JP2008247951A (en) * 2007-03-29 2008-10-16 Nippon Steel Chem Co Ltd Liquid epoxy resin composition for protecting semiconductor device, cured epoxy resin, method for producing semiconductor device and semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015136771A1 *

Also Published As

Publication number Publication date
JP6331526B2 (en) 2018-05-30
US20170066899A1 (en) 2017-03-09
WO2015136771A1 (en) 2015-09-17
JP2015174912A (en) 2015-10-05
CN106062028A (en) 2016-10-26
EP3118236B1 (en) 2020-07-01
KR20160113290A (en) 2016-09-28
CN106062028B (en) 2018-09-14
US10138348B2 (en) 2018-11-27
EP3118236A1 (en) 2017-01-18

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