SG11201506001VA - Polishing composition, method for producing polishing composition and method for producing polished article - Google Patents

Polishing composition, method for producing polishing composition and method for producing polished article

Info

Publication number
SG11201506001VA
SG11201506001VA SG11201506001VA SG11201506001VA SG11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA
Authority
SG
Singapore
Prior art keywords
polishing composition
producing
polished article
article
producing polished
Prior art date
Application number
SG11201506001VA
Other languages
English (en)
Inventor
Kohsuke Tsuchiya
Hisanori Tansho
Maki Asada
Yusuke Suga
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG11201506001VA publication Critical patent/SG11201506001VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201506001VA 2013-02-13 2014-02-10 Polishing composition, method for producing polishing composition and method for producing polished article SG11201506001VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013026020 2013-02-13
PCT/JP2014/053065 WO2014126051A1 (ja) 2013-02-13 2014-02-10 研磨用組成物、研磨用組成物製造方法および研磨物製造方法

Publications (1)

Publication Number Publication Date
SG11201506001VA true SG11201506001VA (en) 2015-09-29

Family

ID=51354053

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201506001VA SG11201506001VA (en) 2013-02-13 2014-02-10 Polishing composition, method for producing polishing composition and method for producing polished article

Country Status (8)

Country Link
US (1) US20150376464A1 (enrdf_load_stackoverflow)
EP (1) EP2957613B1 (enrdf_load_stackoverflow)
JP (2) JP5897200B2 (enrdf_load_stackoverflow)
KR (1) KR102226441B1 (enrdf_load_stackoverflow)
CN (1) CN104995277B (enrdf_load_stackoverflow)
SG (1) SG11201506001VA (enrdf_load_stackoverflow)
TW (1) TWI624536B (enrdf_load_stackoverflow)
WO (1) WO2014126051A1 (enrdf_load_stackoverflow)

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WO2014148399A1 (ja) 2013-03-19 2014-09-25 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット
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BR112017011562A2 (pt) * 2014-12-05 2018-01-02 3M Innovative Properties Co composição abrasiva
JP6829191B2 (ja) * 2015-05-08 2021-02-10 株式会社フジミインコーポレーテッド 研磨方法
JP6582601B2 (ja) * 2015-06-22 2019-10-02 日立化成株式会社 研磨液、貯蔵液及び研磨方法
JP6797796B2 (ja) * 2015-07-01 2020-12-09 東亞合成株式会社 研磨用濡れ剤及び研磨液組成物
EP3448673B1 (en) 2016-04-28 2022-06-08 NatureWorks LLC Polymer foam insulation structure having a facing of a multi-layer sheet that contains a heat resistant polymer layer and a polylactide resin layer
KR102498010B1 (ko) * 2016-09-28 2023-02-10 가부시키가이샤 후지미인코퍼레이티드 표면 처리 조성물
CN110167879A (zh) * 2016-10-28 2019-08-23 株式会社德山 气相二氧化硅及其制备方法
JP6792413B2 (ja) * 2016-10-31 2020-11-25 花王株式会社 シリコンウェーハ用研磨液組成物
US11130883B2 (en) 2016-11-22 2021-09-28 Fujimi Incorporated Polishing composition
KR102565682B1 (ko) * 2017-02-20 2023-08-11 가부시키가이샤 후지미인코퍼레이티드 실리콘 기판 중간 연마용 조성물 및 실리콘 기판 연마용 조성물 세트
JP6879798B2 (ja) * 2017-03-30 2021-06-02 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP7074525B2 (ja) * 2017-03-30 2022-05-24 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
CN110462797B (zh) * 2017-03-31 2023-09-22 福吉米株式会社 研磨用组合物
WO2018216733A1 (ja) * 2017-05-26 2018-11-29 株式会社フジミインコーポレーテッド 研磨用組成物およびこれを用いた研磨方法
EP3410236B1 (fr) * 2017-05-29 2021-02-17 The Swatch Group Research and Development Ltd Dispositif et procede d'ajustement de marche et correction d'etat d'une montre
EP3657533A4 (en) * 2017-07-21 2021-05-05 Fujimi Incorporated SUBSTRATE POLISHING PROCESS, AND POLISHING COMPOSITION KIT
SG11202001013YA (en) * 2017-08-14 2020-03-30 Hitachi Chemical Co Ltd Polishing liquid, polishing liquid set and polishing method
JP6929239B2 (ja) * 2018-03-30 2021-09-01 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
EP3819353A4 (en) * 2018-07-04 2022-03-30 Sumitomo Seika Chemicals Co., Ltd. POLISHING COMPOSITION
JP7424768B2 (ja) * 2019-08-08 2024-01-30 株式会社フジミインコーポレーテッド 研磨用添加剤含有液の濾過方法、研磨用添加剤含有液、研磨用組成物、研磨用組成物の製造方法およびフィルタ
EP3792327B1 (en) * 2019-09-11 2025-05-28 Fujimi Incorporated Polishing composition, polishing method and method for manufacturing semiconductor substrate
CN112175524B (zh) * 2020-09-21 2022-02-15 万华化学集团电子材料有限公司 一种蓝宝石抛光组合物及其应用
KR102492236B1 (ko) * 2020-12-17 2023-01-26 에스케이실트론 주식회사 연마장치 및 웨이퍼의 연마방법
EP4498403A1 (en) 2022-03-23 2025-01-29 Fujimi Incorporated Polishing composition

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Also Published As

Publication number Publication date
JP5897200B2 (ja) 2016-03-30
EP2957613A1 (en) 2015-12-23
EP2957613A4 (en) 2016-11-09
WO2014126051A1 (ja) 2014-08-21
TWI624536B (zh) 2018-05-21
US20150376464A1 (en) 2015-12-31
JPWO2014126051A1 (ja) 2017-02-02
EP2957613B1 (en) 2020-11-18
CN104995277B (zh) 2018-05-08
JP2016138278A (ja) 2016-08-04
KR20150119062A (ko) 2015-10-23
TW201443212A (zh) 2014-11-16
JP6387032B2 (ja) 2018-09-05
KR102226441B1 (ko) 2021-03-12
CN104995277A (zh) 2015-10-21

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