SE0103036D0 - Semiconductor process and integrated circuit - Google Patents

Semiconductor process and integrated circuit

Info

Publication number
SE0103036D0
SE0103036D0 SE0103036A SE0103036A SE0103036D0 SE 0103036 D0 SE0103036 D0 SE 0103036D0 SE 0103036 A SE0103036 A SE 0103036A SE 0103036 A SE0103036 A SE 0103036A SE 0103036 D0 SE0103036 D0 SE 0103036D0
Authority
SE
Sweden
Prior art keywords
substrate
trench
bipolar transistor
epitaxially grown
silicon layer
Prior art date
Application number
SE0103036A
Other languages
English (en)
Swedish (sv)
Inventor
Ted Johansson
Hans Norstroem
Patrik Algotsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE0101567A external-priority patent/SE522527C2/sv
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0103036A priority Critical patent/SE0103036D0/xx
Publication of SE0103036D0 publication Critical patent/SE0103036D0/xx
Priority to CNB02809395XA priority patent/CN1328782C/zh
Priority to PCT/SE2002/000838 priority patent/WO2002091463A1/en
Priority to EP02728284A priority patent/EP1384258A1/en
Priority to JP2002588620A priority patent/JP2005509273A/ja
Priority to KR1020037013854A priority patent/KR100918716B1/ko
Priority to US10/699,222 priority patent/US20050020003A1/en
Priority to JP2008332746A priority patent/JP2009141375A/ja
Priority to US12/561,628 priority patent/US20100055860A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401Combinations of FETs or IGBTs with BJTs
    • H10D84/403Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
    • H10P10/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0107Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs
    • H10D84/0109Integrating at least one component covered by H10D12/00 or H10D30/00 with at least one component covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating IGFETs with BJTs the at least one component covered by H10D12/00 or H10D30/00 being a MOS device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
SE0103036A 2001-05-04 2001-09-13 Semiconductor process and integrated circuit SE0103036D0 (sv)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SE0103036A SE0103036D0 (sv) 2001-05-04 2001-09-13 Semiconductor process and integrated circuit
CNB02809395XA CN1328782C (zh) 2001-05-04 2002-04-29 半导体工艺与集成电路
PCT/SE2002/000838 WO2002091463A1 (en) 2001-05-04 2002-04-29 Semiconductor process and integrated circuit
EP02728284A EP1384258A1 (en) 2001-05-04 2002-04-29 Semiconductor process and integrated circuit
JP2002588620A JP2005509273A (ja) 2001-05-04 2002-04-29 半導体プロセスおよび集積回路
KR1020037013854A KR100918716B1 (ko) 2001-05-04 2002-04-29 반도체 공정 및 집적회로
US10/699,222 US20050020003A1 (en) 2001-05-04 2003-10-31 Semiconductor process and integrated circuit
JP2008332746A JP2009141375A (ja) 2001-05-04 2008-12-26 半導体プロセスおよび集積回路
US12/561,628 US20100055860A1 (en) 2001-05-04 2009-09-17 Semiconductor Process and Integrated Circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0101567A SE522527C2 (sv) 2001-05-04 2001-05-04 Halvledarprocess och integrerad krets
SE0103036A SE0103036D0 (sv) 2001-05-04 2001-09-13 Semiconductor process and integrated circuit

Publications (1)

Publication Number Publication Date
SE0103036D0 true SE0103036D0 (sv) 2001-09-13

Family

ID=26655455

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0103036A SE0103036D0 (sv) 2001-05-04 2001-09-13 Semiconductor process and integrated circuit

Country Status (7)

Country Link
US (2) US20050020003A1 (enExample)
EP (1) EP1384258A1 (enExample)
JP (2) JP2005509273A (enExample)
KR (1) KR100918716B1 (enExample)
CN (1) CN1328782C (enExample)
SE (1) SE0103036D0 (enExample)
WO (1) WO2002091463A1 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849518B2 (en) * 2002-05-07 2005-02-01 Intel Corporation Dual trench isolation using single critical lithographic patterning
KR100538810B1 (ko) * 2003-12-29 2005-12-23 주식회사 하이닉스반도체 반도체소자의 소자분리 방법
SE527487C2 (sv) * 2004-03-02 2006-03-21 Infineon Technologies Ag En metod för framställning av en kondensator och en monolitiskt integrerad krets innefattande en sådan kondensator
JP2006049685A (ja) * 2004-08-06 2006-02-16 Sanyo Electric Co Ltd 半導体装置の製造方法
WO2006018974A1 (ja) * 2004-08-17 2006-02-23 Rohm Co., Ltd. 半導体装置およびその製造方法
EP1630863B1 (en) 2004-08-31 2014-05-14 Infineon Technologies AG Method of fabricating a monolithically integrated vertical semiconducting device in an soi substrate
WO2006025037A1 (en) * 2004-09-02 2006-03-09 Koninklijke Philips Electronics, N.V. Contacting and filling deep-trench-isolation with tungsten
EP1646084A1 (en) 2004-10-06 2006-04-12 Infineon Technologies AG A method in the fabrication of an integrated injection logic circuit
US7638385B2 (en) * 2005-05-02 2009-12-29 Semiconductor Components Industries, Llc Method of forming a semiconductor device and structure therefor
US20070069295A1 (en) * 2005-09-28 2007-03-29 Kerr Daniel C Process to integrate fabrication of bipolar devices into a CMOS process flow
US20070158779A1 (en) * 2006-01-12 2007-07-12 International Business Machines Corporation Methods and semiconductor structures for latch-up suppression using a buried damage layer
US7648869B2 (en) * 2006-01-12 2010-01-19 International Business Machines Corporation Method of fabricating semiconductor structures for latch-up suppression
US7276768B2 (en) * 2006-01-26 2007-10-02 International Business Machines Corporation Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures
US7491618B2 (en) * 2006-01-26 2009-02-17 International Business Machines Corporation Methods and semiconductor structures for latch-up suppression using a conductive region
US20070194403A1 (en) * 2006-02-23 2007-08-23 International Business Machines Corporation Methods for fabricating semiconductor device structures with reduced susceptibility to latch-up and semiconductor device structures formed by the methods
US7439119B2 (en) * 2006-02-24 2008-10-21 Agere Systems Inc. Thermally stable BiCMOS fabrication method and bipolar junction transistors formed according to the method
JP2007266491A (ja) * 2006-03-29 2007-10-11 Fujitsu Ltd 半導体装置の製造方法及び半導体装置
US7629676B2 (en) 2006-09-07 2009-12-08 Infineon Technologies Ag Semiconductor component having a semiconductor die and a leadframe
US7754513B2 (en) * 2007-02-28 2010-07-13 International Business Machines Corporation Latch-up resistant semiconductor structures on hybrid substrates and methods for forming such semiconductor structures
US7818702B2 (en) * 2007-02-28 2010-10-19 International Business Machines Corporation Structure incorporating latch-up resistant semiconductor device structures on hybrid substrates
KR20090051894A (ko) * 2007-11-20 2009-05-25 주식회사 동부하이텍 반도체 소자의 제조 방법
DE102008062693B4 (de) * 2008-12-17 2017-02-09 Texas Instruments Deutschland Gmbh Halbleiterbauelement und Verfahren zu dessen Herstellung
GB2479372B (en) 2010-04-07 2013-07-24 Ge Aviat Systems Ltd Power switches for aircraft
CN102270576A (zh) * 2011-09-01 2011-12-07 上海宏力半导体制造有限公司 Mos晶体管制造方法
KR101821413B1 (ko) * 2011-09-26 2018-01-24 매그나칩 반도체 유한회사 소자분리구조물, 이를 포함하는 반도체 소자 및 그의 소자분리 구조물 제조 방법
US8956938B2 (en) 2012-05-16 2015-02-17 International Business Machines Corporation Epitaxial semiconductor resistor with semiconductor structures on same substrate
US9076863B2 (en) * 2013-07-17 2015-07-07 Texas Instruments Incorporated Semiconductor structure with a doped region between two deep trench isolation structures
US10468484B2 (en) * 2014-05-21 2019-11-05 Analog Devices Global Bipolar transistor
CN104269413B (zh) 2014-09-22 2017-08-11 京东方科技集团股份有限公司 阵列基板及其制作方法、液晶显示装置
US9502283B2 (en) * 2015-02-20 2016-11-22 Qualcomm Incorporated Electron-beam (E-beam) based semiconductor device features
US9768218B2 (en) * 2015-08-26 2017-09-19 Taiwan Semiconductor Manufacturing Co., Ltd. Self-aligned back side deep trench isolation structure
US10128113B2 (en) * 2016-01-12 2018-11-13 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
US9825157B1 (en) * 2016-06-29 2017-11-21 Globalfoundries Inc. Heterojunction bipolar transistor with stress component
US9923083B1 (en) 2016-09-09 2018-03-20 International Business Machines Corporation Embedded endpoint fin reveal
CN110416152A (zh) * 2019-07-26 2019-11-05 上海华虹宏力半导体制造有限公司 深槽隔离结构及工艺方法
CN115166461A (zh) * 2022-06-30 2022-10-11 上海积塔半导体有限公司 测试器件结构单元、并行测试器件结构及晶圆

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622735A (en) * 1980-12-12 1986-11-18 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a semiconductor device utilizing self-aligned silicide regions
JPS5872139A (ja) * 1981-10-26 1983-04-30 Tokyo Ohka Kogyo Co Ltd 感光性材料
US5280188A (en) * 1985-03-07 1994-01-18 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor integrated circuit device having at least one bipolar transistor and a plurality of MOS transistors
US4789995A (en) * 1987-05-01 1988-12-06 Silicon Systems Inc. Synchronous timer anti-alias filter and gain stage
US5006476A (en) * 1988-09-07 1991-04-09 North American Philips Corp., Signetics Division Transistor manufacturing process using three-step base doping
US5015594A (en) * 1988-10-24 1991-05-14 International Business Machines Corporation Process of making BiCMOS devices having closely spaced device regions
US4997776A (en) * 1989-03-06 1991-03-05 International Business Machines Corp. Complementary bipolar transistor structure and method for manufacture
US5171702A (en) * 1989-07-21 1992-12-15 Texas Instruments Incorporated Method for forming a thick base oxide in a BiCMOS process
JPH03196562A (ja) * 1989-12-26 1991-08-28 Oki Electric Ind Co Ltd 半導体装置の製造方法
US5124271A (en) * 1990-06-20 1992-06-23 Texas Instruments Incorporated Process for fabricating a BiCMOS integrated circuit
GB2248142A (en) * 1990-09-19 1992-03-25 Koninkl Philips Electronics Nv A method of manufacturing a semiconductor device
JP2748988B2 (ja) * 1991-03-13 1998-05-13 三菱電機株式会社 半導体装置とその製造方法
US5187109A (en) * 1991-07-19 1993-02-16 International Business Machines Corporation Lateral bipolar transistor and method of making the same
US5266504A (en) * 1992-03-26 1993-11-30 International Business Machines Corporation Low temperature emitter process for high performance bipolar devices
JP2740087B2 (ja) * 1992-08-15 1998-04-15 株式会社東芝 半導体集積回路装置の製造方法
JPH07106412A (ja) * 1993-10-07 1995-04-21 Toshiba Corp 半導体装置およびその製造方法
JPH07176621A (ja) * 1993-12-17 1995-07-14 Hitachi Ltd 半導体装置及びその製造方法
JPH07335774A (ja) * 1994-06-03 1995-12-22 Sony Corp BiMOS半導体装置及びその製造方法
US5620908A (en) * 1994-09-19 1997-04-15 Kabushiki Kaisha Toshiba Manufacturing method of semiconductor device comprising BiCMOS transistor
JPH09115998A (ja) * 1995-10-16 1997-05-02 Toshiba Corp 半導体集積回路の素子分離構造及び素子分離方法
US6077752A (en) * 1995-11-20 2000-06-20 Telefonaktiebolaget Lm Ericsson Method in the manufacturing of a semiconductor device
JPH09252061A (ja) * 1996-03-15 1997-09-22 Toshiba Corp 半導体装置及びその製造方法
JP3583228B2 (ja) * 1996-06-07 2004-11-04 株式会社ルネサステクノロジ 半導体装置およびその製造方法
FR2756103B1 (fr) * 1996-11-19 1999-05-14 Sgs Thomson Microelectronics Fabrication de circuits integres bipolaires/cmos et d'un condensateur
FR2756104B1 (fr) * 1996-11-19 1999-01-29 Sgs Thomson Microelectronics Fabrication de circuits integres bipolaires/cmos
FR2758004B1 (fr) * 1996-12-27 1999-03-05 Sgs Thomson Microelectronics Transistor bipolaire a isolement dielectrique
SE520173C2 (sv) * 1997-04-29 2003-06-03 Ericsson Telefon Ab L M Förfarande för tillverkning av en kondensator i en integrerad krets
JP3919885B2 (ja) * 1997-06-18 2007-05-30 株式会社ルネサステクノロジ 半導体装置の製造方法
JP3189743B2 (ja) * 1997-06-26 2001-07-16 日本電気株式会社 半導体集積回路装置及びその製造方法
CN1263637A (zh) * 1997-07-11 2000-08-16 艾利森电话股份有限公司 制作用于射频的集成电路器件的工艺
SE511891C2 (sv) * 1997-08-29 1999-12-13 Ericsson Telefon Ab L M Bipolär effekttransistor och framställningsförfarande
US6137154A (en) * 1998-02-02 2000-10-24 Motorola, Inc. Bipolar transistor with increased early voltage
FR2779572B1 (fr) * 1998-06-05 2003-10-17 St Microelectronics Sa Transistor bipolaire vertical a faible bruit et procede de fabrication correspondant
US6611044B2 (en) * 1998-09-11 2003-08-26 Koninklijke Philips Electronics N.V. Lateral bipolar transistor and method of making same
JP2000124336A (ja) 1998-10-12 2000-04-28 Sony Corp 半導体装置及び半導体装置の製造方法
EP1037284A3 (en) * 1999-03-15 2002-10-30 Matsushita Electric Industrial Co., Ltd. Heterojunction bipolar transistor and method for fabricating the same
US6432791B1 (en) * 1999-04-14 2002-08-13 Texas Instruments Incorporated Integrated circuit capacitor and method
JP2000311958A (ja) * 1999-04-27 2000-11-07 Hitachi Ltd 半導体集積回路装置の製造方法
US6043130A (en) * 1999-05-17 2000-03-28 National Semiconductor Corporation Process for forming bipolar transistor compatible with CMOS utilizing tilted ion implanted base
US6351021B1 (en) 1999-07-01 2002-02-26 Intersil Americas Inc. Low temperature coefficient resistor (TCRL)
WO2001004960A1 (en) * 1999-07-07 2001-01-18 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for the same manufacturing
CN1252809C (zh) 1999-09-17 2006-04-19 因芬尼昂技术股份公司 在浅槽中形成深槽以隔离半导体器件的自对准方法
JP3748744B2 (ja) * 1999-10-18 2006-02-22 Necエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
US20100055860A1 (en) 2010-03-04
CN1507656A (zh) 2004-06-23
EP1384258A1 (en) 2004-01-28
WO2002091463A1 (en) 2002-11-14
JP2009141375A (ja) 2009-06-25
KR100918716B1 (ko) 2009-09-24
CN1328782C (zh) 2007-07-25
KR20030092097A (ko) 2003-12-03
US20050020003A1 (en) 2005-01-27
JP2005509273A (ja) 2005-04-07

Similar Documents

Publication Publication Date Title
SE0103036D0 (sv) Semiconductor process and integrated circuit
US6420771B2 (en) Trench isolated bipolar transistor structure integrated with CMOS technology
TWI267164B (en) Bipolar transistor structure and methods using shallow isolation extension to reduce parasitic capacitance
GB2383190B (en) Bipolar junction transistor compatible with vertical replacement gate transistors
US7898008B2 (en) Vertical-type, integrated bipolar device and manufacturing process thereof
JP2005509273A5 (enExample)
US20040048428A1 (en) Semiconductor device and method of manufacturing the same
KR970053503A (ko) 게이트 전극 및 소스와 드레인 영역 사이의 단락을 없애는 얕은 불순물 영역을 구비한 반도체 디바이스 및 이를 제조하는 공정
KR20020019560A (ko) 바이폴라 트랜지스터 및 그 제조방법
KR970054342A (ko) 베이스 결정박막 바이폴러 트랜지스터의 소자격리와 컬렉터-베이스 자기정렬의 동시 형성방법
US7772100B2 (en) Method of manufacturing a semiconductor device having a buried doped region
US5714793A (en) Complementary vertical bipolar junction transistors formed in silicon-on-saphire
US10665703B2 (en) Silicon carbide transistor
SE0200414D0 (sv) Semiconductor fabrication process lateral pnp transistor, and integrated circuit
GB1456376A (en) Semiconductor devices
US11626325B2 (en) Method of making a silicon carbide integrated circuit
KR20030091523A (ko) 웨이퍼 본딩을 이용한 soi 기판 제조 방법과 이 soi기판을 사용한 상보형 고전압 바이폴라 트랜지스터 제조방법
AU2002357125A1 (en) Super self-aligned collector device for mono-and hetero bipolar junction transistors, and method of making same
US10522663B2 (en) Integrated JFET structure with implanted backgate
TW200629466A (en) Semiconductor device having a frontside contact and vertical trench isolation and method of fabricating same
KR100482950B1 (ko) 반도체소자 및 그 제조방법
KR900001036A (ko) 분리식 수직형 바이폴라 및 jfet트랜지스터를 제조하기 위한 처리 공정
CN219419036U (zh) 绝缘栅双极性晶体管及其晶片
US20240355913A1 (en) Bipolar transistor
JPS63175463A (ja) バイmos集積回路の製造方法