RU2670303C2 - Функциональная тонкая пленка и способ ее изготовления - Google Patents

Функциональная тонкая пленка и способ ее изготовления Download PDF

Info

Publication number
RU2670303C2
RU2670303C2 RU2016111693A RU2016111693A RU2670303C2 RU 2670303 C2 RU2670303 C2 RU 2670303C2 RU 2016111693 A RU2016111693 A RU 2016111693A RU 2016111693 A RU2016111693 A RU 2016111693A RU 2670303 C2 RU2670303 C2 RU 2670303C2
Authority
RU
Russia
Prior art keywords
thin film
group
organic
inorganic
functional thin
Prior art date
Application number
RU2016111693A
Other languages
English (en)
Russian (ru)
Other versions
RU2016111693A (ru
Inventor
Мён Мо СУН
Кё Сок ХАН
Original Assignee
Июкф-Хю (Индастри-Юниверсити-Кооперейшн Фаундейшн Ханян Юниверсити)
БАСФ Коатингс ГмбХ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Июкф-Хю (Индастри-Юниверсити-Кооперейшн Фаундейшн Ханян Юниверсити), БАСФ Коатингс ГмбХ filed Critical Июкф-Хю (Индастри-Юниверсити-Кооперейшн Фаундейшн Ханян Юниверсити)
Publication of RU2016111693A publication Critical patent/RU2016111693A/ru
Application granted granted Critical
Publication of RU2670303C2 publication Critical patent/RU2670303C2/ru

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3192Multilayer coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F3/00Compounds containing elements of Groups 2 or 12 of the Periodic Table
    • C07F3/06Zinc compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00Compounds containing elements of Groups 3 or 13 of the Periodic Table
    • C07F5/06Aluminium compounds
    • C07F5/061Aluminium compounds with C-aluminium linkage
    • C07F5/062Al linked exclusively to C
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42Silicides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45527Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
    • C23C16/45529Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45553Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133305Flexible substrates, e.g. plastics, organic film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/50Encapsulations or containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133302Rigid substrates, e.g. inorganic substrates
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133345Insulating layers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50Protective arrangements
    • G02F2201/501Blocking layers, e.g. against migration of ions
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/02Materials and properties organic material
    • G02F2202/022Materials and properties organic material polymeric
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10Transparent electrodes, e.g. using graphene
    • H10K2102/101Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/10Transparent electrodes, e.g. using graphene
    • H10K2102/101Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
    • H10K2102/103Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO] comprising indium oxides, e.g. ITO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/351Thickness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Liquid Crystal (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
RU2016111693A 2013-08-30 2013-11-04 Функциональная тонкая пленка и способ ее изготовления RU2670303C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2013-0104463 2013-08-30
KR1020130104463 2013-08-30
PCT/KR2013/009909 WO2015030297A1 (ko) 2013-08-30 2013-11-04 유무기 혼성 박막 및 이의 제조 방법

Publications (2)

Publication Number Publication Date
RU2016111693A RU2016111693A (ru) 2017-10-06
RU2670303C2 true RU2670303C2 (ru) 2018-10-22

Family

ID=52586830

Family Applications (2)

Application Number Title Priority Date Filing Date
RU2016111693A RU2670303C2 (ru) 2013-08-30 2013-11-04 Функциональная тонкая пленка и способ ее изготовления
RU2016111694A RU2672962C2 (ru) 2013-08-30 2013-11-04 Структура подложки и способ ее изготовления

Family Applications After (1)

Application Number Title Priority Date Filing Date
RU2016111694A RU2672962C2 (ru) 2013-08-30 2013-11-04 Структура подложки и способ ее изготовления

Country Status (12)

Country Link
US (2) US9576876B2 (enExample)
EP (2) EP3040443B1 (enExample)
JP (2) JP6286557B2 (enExample)
KR (2) KR20150026746A (enExample)
CN (2) CN105745353B (enExample)
BR (2) BR112016004389B1 (enExample)
CA (2) CA2922612A1 (enExample)
MX (2) MX390737B (enExample)
RU (2) RU2670303C2 (enExample)
SG (2) SG11201600923YA (enExample)
TW (2) TWI606111B (enExample)
WO (2) WO2015030297A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2670303C2 (ru) * 2013-08-30 2018-10-22 Июкф-Хю (Индастри-Юниверсити-Кооперейшн Фаундейшн Ханян Юниверсити) Функциональная тонкая пленка и способ ее изготовления
JP6253070B2 (ja) * 2013-09-30 2017-12-27 エルジー・ケム・リミテッド 有機電子素子用基板およびこの製造方法
MX390409B (es) 2014-06-12 2025-03-20 Basf Coatings Gmbh Proceso para producir laminados orgánicos-inorgánicos flexibles.
SG11201707265QA (en) * 2015-03-25 2017-10-30 Basf Coatings Gmbh Process for producing flexible organic-inorganic laminates
US20190036077A1 (en) * 2016-02-18 2019-01-31 Sharp Kabushiki Kaisha Method for producing organic el display device, and organic el display device
KR102586045B1 (ko) * 2016-07-12 2023-10-10 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
US20190040503A1 (en) * 2017-08-03 2019-02-07 Hrl Laboratories, Llc Feedstocks for additive manufacturing, and methods of using the same
WO2019010696A1 (en) * 2017-07-14 2019-01-17 General Electric Company METHOD FOR DEPOSITION LAYERED BY GAS PHASE MOLECULAR LAYER ON A MICROPOROUS SUPPORT
US10673046B2 (en) * 2018-04-13 2020-06-02 GM Global Technology Operations LLC Separator for lithium metal based batteries
CN112334602B (zh) * 2018-07-05 2023-06-30 巴斯夫涂料有限公司 透明导电膜
KR102224346B1 (ko) * 2019-07-11 2021-03-05 한양대학교 산학협력단 유무기 하이브리드층, 이 층을 구비하는 유무기 적층체, 및 이 적층체를 가스 배리어로 구비하는 유기전자소자
CN110508155B (zh) * 2019-08-21 2021-09-03 南京大学 一种锌基无机-有机杂化纳米多孔分离膜的制备方法
CN110635044B (zh) * 2019-11-04 2021-07-06 吉林大学 一种有机金属卤化物钙钛矿太阳能电池的复合封装薄膜及其制备方法
CN112410763A (zh) * 2020-10-28 2021-02-26 武汉华星光电半导体显示技术有限公司 一种薄膜封装层,其制备方法及可折叠显示装置
TWI824213B (zh) * 2020-12-19 2023-12-01 逢甲大學 可撓式透明導電複合膜及其製造方法
KR102558965B1 (ko) * 2021-03-18 2023-07-25 한국과학기술연구원 신축성 표시 장치 및 신축성 표시 장치 제조 방법
US20240189861A1 (en) 2021-05-06 2024-06-13 Basf Coatings Gmbh Multilayer barrier film, its manufacture and use in photovoltaic applications
WO2023018308A1 (ko) * 2021-08-12 2023-02-16 한양대학교 산학협력단 분자선 구조를 갖는 다층 분자막 포토레지스트 및 이의 제조방법
EP4386482A4 (en) * 2021-08-12 2025-10-22 Iucf Hyu MULTILAYER MOLECULAR FILM PHOTOSENSITIVE RESIN HAVING MOLECULAR LINE STRUCTURE AND METHOD FOR PRODUCING SAME
KR102796366B1 (ko) * 2022-01-13 2025-04-18 한양대학교 산학협력단 분자선 구조를 갖는 다층 분자막 포토레지스트의 제조방법
CN115124727B (zh) * 2022-07-08 2023-07-14 中国科学院山西煤炭化学研究所 一种mof薄膜的制备方法
CN117845191A (zh) * 2022-09-30 2024-04-09 华为技术有限公司 复合薄膜及其制备方法和应用
WO2024126566A1 (en) 2022-12-14 2024-06-20 Basf Coatings Gmbh Multilayer barrier film coated polymeric substrate, its manufacture and use in electronic devices
WO2024167351A1 (ko) * 2023-02-10 2024-08-15 한양대학교 산학협력단 분자선 구조를 갖는 포지티브형의 다층 분자막 포토레지스트
WO2024167360A1 (ko) * 2023-02-10 2024-08-15 한양대학교 산학협력단 배위결합에 의해 가교가능한 분자선 구조를 갖는 다층 분자막 포토레지스트
CN116794116A (zh) * 2023-05-29 2023-09-22 南京大学 一种基于无机-有机杂化纳米多孔膜/半导体金属氧化物的薄膜氢气传感器及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080102313A1 (en) * 2004-12-28 2008-05-01 Universitetet I Oslo Thin Films Prepared With Gas Phase Deposition Technique
US20090081883A1 (en) * 2007-09-26 2009-03-26 Freeman Diane C Process for depositing organic materials
US20100178481A1 (en) * 2007-06-22 2010-07-15 George Steven M Protective coatings for organic electronic devices made using atomic layer deposition and molecular layer deposition techniques
RU2462793C2 (ru) * 2007-12-28 2012-09-27 Юниверсите Де Ля Медитерране Экс-Марсель Ii Гибридные нанокомпозиционные материалы
WO2012157960A2 (ko) * 2011-05-16 2012-11-22 주식회사 엘지화학 다층 플라스틱 기판 및 이의 제조방법

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2118402C1 (ru) * 1994-05-17 1998-08-27 Виктор Васильевич Дроботенко Способ получения металлооксидных покрытий (его варианты)
JP2002053669A (ja) 2000-06-01 2002-02-19 Osaka Organic Chem Ind Ltd 多次元有機・無機複合体化合物およびその製造方法
US6866949B2 (en) 2002-03-08 2005-03-15 Dai Nippon Printing Co., Ltd. Substrate film, gas barrier film, and display using the same
TW548853B (en) * 2002-09-13 2003-08-21 Ind Tech Res Inst Method of manufacturing flexible TFT display
US7285440B2 (en) * 2002-11-25 2007-10-23 International Business Machines Corporation Organic underlayers that improve the performance of organic semiconductors
JP2004231784A (ja) * 2003-01-30 2004-08-19 Konica Minolta Holdings Inc 有機−無機ポリマーハイブリッドフィルム、その製造方法、該フィルムを用いたディスプレイ及びタッチパネル
US7229703B2 (en) 2003-03-31 2007-06-12 Dai Nippon Printing Co. Ltd. Gas barrier substrate
JP4654911B2 (ja) 2003-05-16 2011-03-23 凸版印刷株式会社 透明ガスバリア積層フィルム、これを用いたエレクトロルミネッセンス発光素子、エレクトロルミネッセンス表示装置、及び電気泳動式表示パネル
WO2005056354A2 (en) * 2003-12-03 2005-06-23 Gedeon Anthony A Method of resisting contaminant build up and oxidation of vehicle surfaces and other surfaces
JP2005289885A (ja) 2004-03-31 2005-10-20 Osaka Organic Chem Ind Ltd 多次元有機・無機複合体化合物、複合焼成体およびこれらの製造方法
JP2005297498A (ja) 2004-04-16 2005-10-27 Dainippon Printing Co Ltd 可撓性基板およびそれを用いた有機デバイス
US7378157B2 (en) 2004-06-28 2008-05-27 Dai Nippon Printing Co., Ltd. Gas barrier film, and display substrate and display using the same
KR101001441B1 (ko) * 2004-08-17 2010-12-14 삼성전자주식회사 유무기 금속 하이브리드 물질 및 이를 포함하는 유기절연체 조성물
JP2007185937A (ja) 2005-12-12 2007-07-26 Fujifilm Corp 有機−無機ハイブリッド材料、ガスバリヤーフィルム及びその製造方法
KR20070084683A (ko) * 2006-02-21 2007-08-27 국민대학교산학협력단 분자층 증착법
JP2007273094A (ja) 2006-03-30 2007-10-18 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子およびその製造方法
DE102006016280A1 (de) * 2006-04-01 2007-10-04 Pvflex Solar Gmbh Glasloser Solarstrom-Modul mit flexiblen Dünnschicht-Zellen und Verfahren zu seiner Herstellung
JP2008087163A (ja) 2006-09-29 2008-04-17 Fujifilm Corp ガスバリア性積層フィルム、およびそれを用いた画像表示素子
US10092927B2 (en) 2006-11-13 2018-10-09 The Regents Of The University Of Colorado, A Body Corporate Molecular layer deposition process for making organic or organic-inorganic polymers
JP2008218632A (ja) * 2007-03-02 2008-09-18 Fujifilm Corp 電子デバイス
WO2008117487A1 (fr) 2007-03-23 2008-10-02 Dai Nippon Printing Co., Ltd. Feuille de barrière contre les gaz
JP5127277B2 (ja) 2007-04-05 2013-01-23 新日鉄住金マテリアルズ株式会社 表面平坦性絶縁膜形成用塗布溶液、表面平坦性絶縁膜被覆基材、及び表面平坦性絶縁膜被覆基材の製造方法
JP5198131B2 (ja) 2007-05-14 2013-05-15 富士フイルム株式会社 バリアフィルムおよび素子
JP5510766B2 (ja) 2007-06-20 2014-06-04 大日本印刷株式会社 イオンプレーティング用蒸発源材料の原料粉末、イオンプレーティング用蒸発源材料及びその製造方法、ガスバリア性シート及びその製造方法
US20090021797A1 (en) * 2007-07-17 2009-01-22 Luciano Joseph W All-In-One Device With Integrated Monitor
JP2010006039A (ja) 2007-09-05 2010-01-14 Fujifilm Corp ガスバリアフィルムおよびガスバリアフィルムを用いて表示素子を封止する方法。
US8067085B2 (en) 2007-09-14 2011-11-29 Fujifilm Corporation Gas barrier film, and display device comprising the same
US8776238B2 (en) * 2008-07-16 2014-07-08 International Business Machines Corporation Verifying certificate use
US8241749B2 (en) 2008-09-11 2012-08-14 Fujifilm Corporation Barrier laminate, gas barrier film, and device using the same
JP2011046060A (ja) 2009-08-26 2011-03-10 Fujifilm Corp ガスバリアフィルムおよびガスバリアフィルムの製造方法
JP4821925B2 (ja) 2009-11-27 2011-11-24 大日本印刷株式会社 ガスバリア性フィルム、装置、及びガスバリア性フィルムの製造方法
EP2549560B1 (en) 2010-03-17 2018-09-26 Konica Minolta Holdings, Inc. Organic electronic device and method of manufacturing the same
CN102821949B (zh) 2010-03-25 2016-08-10 凸版印刷株式会社 阻气性层叠体及包装材料
JP5598080B2 (ja) 2010-05-17 2014-10-01 大日本印刷株式会社 ガスバリア性シートの製造方法
JP5913809B2 (ja) 2011-01-05 2016-04-27 リンテック株式会社 透明電極基板、その製造方法、該透明電極基板を有する電子デバイス及び太陽電池
JP5752438B2 (ja) * 2011-02-23 2015-07-22 グンゼ株式会社 ガスバリアフィルム
KR101432737B1 (ko) 2011-07-28 2014-08-22 한양대학교 산학협력단 유기-무기 혼성 박막 및 이의 제조 방법
RU2670303C2 (ru) * 2013-08-30 2018-10-22 Июкф-Хю (Индастри-Юниверсити-Кооперейшн Фаундейшн Ханян Юниверсити) Функциональная тонкая пленка и способ ее изготовления

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080102313A1 (en) * 2004-12-28 2008-05-01 Universitetet I Oslo Thin Films Prepared With Gas Phase Deposition Technique
US20100178481A1 (en) * 2007-06-22 2010-07-15 George Steven M Protective coatings for organic electronic devices made using atomic layer deposition and molecular layer deposition techniques
US20090081883A1 (en) * 2007-09-26 2009-03-26 Freeman Diane C Process for depositing organic materials
RU2462793C2 (ru) * 2007-12-28 2012-09-27 Юниверсите Де Ля Медитерране Экс-Марсель Ii Гибридные нанокомпозиционные материалы
WO2012157960A2 (ko) * 2011-05-16 2012-11-22 주식회사 엘지화학 다층 플라스틱 기판 및 이의 제조방법

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KATSUHIKO KANAIZUKA et al. "Construction of Highly Oriented Crystalline Surface Coordination Polymers Composed of Copper Dithiooxamide Complexes", J. AM. CHEM. SOC., v. 130(47), 2008, p. 15778-15779. *
MATHIAS BRUST et al. "Self-assembly of photoluminescent copper(I)-dithiol multilayer thin films and bulk materials", LANGMUIR, v. 13(21), 1997, p. 5602-5607. *

Also Published As

Publication number Publication date
BR112016004389A2 (pt) 2017-09-12
US20160276241A1 (en) 2016-09-22
WO2015030297A1 (ko) 2015-03-05
CA2922612A1 (en) 2015-03-05
TWI606111B (zh) 2017-11-21
MX2016002432A (es) 2016-12-07
EP3040443A4 (en) 2017-04-12
EP3040442A1 (en) 2016-07-06
KR20150026748A (ko) 2015-03-11
US10418300B2 (en) 2019-09-17
RU2672962C2 (ru) 2018-11-21
US20160215394A1 (en) 2016-07-28
CN105723011B (zh) 2019-05-10
MX390737B (es) 2025-03-21
RU2016111693A (ru) 2017-10-06
JP6286557B2 (ja) 2018-02-28
TWI521083B (zh) 2016-02-11
CN105723011A (zh) 2016-06-29
JP6654753B2 (ja) 2020-02-26
JP2016537510A (ja) 2016-12-01
EP3040442A4 (en) 2017-04-12
CA2922615A1 (en) 2015-03-05
EP3040442B1 (en) 2024-02-14
JP2016534231A (ja) 2016-11-04
CN105745353B (zh) 2019-07-05
EP3040443A1 (en) 2016-07-06
TW201508047A (zh) 2015-03-01
US9576876B2 (en) 2017-02-21
EP3040443B1 (en) 2024-03-06
MX389406B (es) 2025-03-20
KR20150026746A (ko) 2015-03-11
RU2016111694A (ru) 2017-10-05
WO2015030298A1 (ko) 2015-03-05
BR112016004476A2 (pt) 2017-09-12
SG11201600923YA (en) 2016-03-30
MX2016002433A (es) 2016-12-09
SG11201600921XA (en) 2016-03-30
KR102289064B1 (ko) 2021-08-12
TW201508083A (zh) 2015-03-01
CN105745353A (zh) 2016-07-06
BR112016004389B1 (pt) 2021-11-23

Similar Documents

Publication Publication Date Title
RU2670303C2 (ru) Функциональная тонкая пленка и способ ее изготовления
Ratzsch et al. Influence of the oxygen plasma parameters on the atomic layer deposition of titanium dioxide
Malm et al. Atomic layer deposition of WO3 thin films using W (CO) 6 and O3 precursors
Mar et al. Factors influencing the chemical vapor deposition of oriented ZnO films using zinc acetate
US11352692B2 (en) Hexagonal boron nitride thin film and method for producing the same
Mihaiu et al. Thermal study on the synthesis of the doped ZnO to be used in TCO films
Guo et al. Low temperature fabrication of thermochromic VO 2 thin films by low-pressure chemical vapor deposition
Kayani et al. Structural, optical, and magnetic properties of cobalt-doped dip coated ZnO films
Li et al. Thermochromatic vanadium dioxide (VO2) thin films synthesized by atomic layer deposition and post-treatments
Riaz et al. Effect of Mn-doping concentration on the structural & magnetic properties of sol-gel deposited ZnO diluted magnetic semiconductor
Wang et al. Chemical solution deposition of ZnO thin films with controlled crystallite orientation and intense ultraviolet emission
KR20150026747A (ko) 유무기 혼성 박막 및 이의 제조 방법
Alcaire et al. Highly Porous ZnO Thin Films and 1D Nanostructures by Remote Plasma Processing of Zn‐Phthalocyanine
KR100416504B1 (ko) 망간이 도핑된 산화아연계 강자성 물질 및 그 제조방법
TWI385117B (zh) Production Method of ZnO Nanometer Structure by Liquid Chromatography
Sivakumar et al. Characterisation of the Magnetic property of the Cobalt (Transition metal) doped with Zinc Oxide using Spin Coating Technique
Xin et al. Study on the effect of Sn concentration on the structural, optical, and electrical properties of (Al 0.55 In 0.45) 2 O 3: Sn films
Du et al. Synthesis of Ga-riched zinc gallate nanowires by reactive evaporation and the cathodoluminescence properties of individual nanowires
Ding et al. Thermal stability studies on ion beam sputter deposited substoichiometric iron nitride thin films
Guglieri Rodríguez Synthesis and In-house Characterization of Materials
US20130337157A1 (en) Method for synthesizing metal or metal oxide nanoparticles by liquid phase deposition on the surface of a substrate

Legal Events

Date Code Title Description
PC41 Official registration of the transfer of exclusive right

Effective date: 20200311