RU2151447C1 - Способ герметизации электронных компонентов и электронный компонент - Google Patents
Способ герметизации электронных компонентов и электронный компонент Download PDFInfo
- Publication number
- RU2151447C1 RU2151447C1 RU95122410/28A RU95122410A RU2151447C1 RU 2151447 C1 RU2151447 C1 RU 2151447C1 RU 95122410/28 A RU95122410/28 A RU 95122410/28A RU 95122410 A RU95122410 A RU 95122410A RU 2151447 C1 RU2151447 C1 RU 2151447C1
- Authority
- RU
- Russia
- Prior art keywords
- component
- thermoplastic
- reactive solvent
- sealing
- sealing material
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 36
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 229920001169 thermoplastic Polymers 0.000 claims description 42
- 239000004416 thermosoftening plastic Substances 0.000 claims description 42
- 239000003566 sealing material Substances 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- -1 unsaturated aromatic olefins Chemical class 0.000 claims description 12
- 239000004952 Polyamide Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 150000001721 carbon Chemical class 0.000 claims description 2
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 150000001735 carboxylic acids Chemical class 0.000 claims 1
- 150000003950 cyclic amides Chemical class 0.000 claims 1
- 150000004292 cyclic ethers Chemical class 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 1
- 239000012815 thermoplastic material Substances 0.000 abstract 1
- 229920002492 poly(sulfone) Polymers 0.000 description 8
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 239000004848 polyfunctional curative Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- BUZMJVBOGDBMGI-UHFFFAOYSA-N 1-phenylpropylbenzene Chemical compound C=1C=CC=CC=1C(CC)C1=CC=CC=C1 BUZMJVBOGDBMGI-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 102000043859 Dynamin Human genes 0.000 description 1
- 108700021058 Dynamin Proteins 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920003289 Ultrason® S Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- AHAREKHAZNPPMI-UHFFFAOYSA-N hexa-1,3-diene Chemical compound CCC=CC=C AHAREKHAZNPPMI-UHFFFAOYSA-N 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- YWXYYJSYQOXTPL-SLPGGIOYSA-N isosorbide mononitrate Chemical compound [O-][N+](=O)O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 YWXYYJSYQOXTPL-SLPGGIOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Formation Of Insulating Films (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL9402233A NL9402233A (nl) | 1994-12-29 | 1994-12-29 | Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal. |
| NL9402233 | 1994-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU95122410A RU95122410A (ru) | 1998-03-20 |
| RU2151447C1 true RU2151447C1 (ru) | 2000-06-20 |
Family
ID=19865082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU95122410/28A RU2151447C1 (ru) | 1994-12-29 | 1995-12-28 | Способ герметизации электронных компонентов и электронный компонент |
Country Status (14)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2358353C2 (ru) * | 2003-09-03 | 2009-06-10 | Моментив Перформанс Матириалз Инк. | Прозрачная композиция герметика, способ ее получения и твердотельное устройство, использующее указанную композицию |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2768707B1 (fr) * | 1997-09-22 | 1999-10-29 | Plastic Omnium Cie | Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication |
| DE19841498C2 (de) * | 1998-09-10 | 2002-02-21 | Beru Ag | Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors |
| CA2566982C (en) | 2004-05-20 | 2012-02-21 | Albemarle Corporation | Pelletized brominated anionic styrenic polymers and their preparation and use |
| US9202770B1 (en) | 2014-09-01 | 2015-12-01 | Freescale Semiconductor, Inc. | Non-homogeneous molding of packaged semiconductor devices |
| DE102017219020A1 (de) * | 2017-10-25 | 2019-04-25 | Volkswagen Aktiengesellschaft | Verfahren zur Herstellung eines fertigen Bauteils umfassend ein Elektronikelement |
| WO2021245481A1 (en) * | 2020-06-05 | 2021-12-09 | Renson Sunprotection-Screens Nv | Method for manufacturing an awning device |
| KR102536941B1 (ko) * | 2020-09-28 | 2023-05-26 | 한국전자통신연구원 | 반도체 패키지의 제조 방법 |
| US12206056B2 (en) | 2020-09-28 | 2025-01-21 | Electronics And Telecommunications Research Institute | Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials |
| CN113644203B (zh) * | 2021-08-09 | 2024-02-27 | 天津大学 | 一种基于热塑性弹性体的有机太阳能电池及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0359558A2 (en) * | 1988-09-13 | 1990-03-21 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant consisting of epoxy resin composition |
| EP0365168A2 (en) * | 1988-10-05 | 1990-04-25 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911075A (en) * | 1974-02-28 | 1975-10-07 | Western Electric Co | Transfer molding thermosetting polymeric material |
| US3969461A (en) * | 1974-02-28 | 1976-07-13 | Western Electric Company, Inc. | Transfer molding thermosetting polymeric material |
| US4327369A (en) * | 1979-08-06 | 1982-04-27 | Hi-Tech Industries, Inc. | Encapsulating moisture-proof coating |
| US4359831A (en) * | 1980-05-19 | 1982-11-23 | De Lorean Manufacturing Company | Reversibly powered rotary snow tiller |
| JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
| JPS57158271A (en) * | 1981-03-26 | 1982-09-30 | Showa Electric Wire & Cable Co Ltd | Film extrusion-coating resin composition |
| JPS5911360A (ja) * | 1982-07-09 | 1984-01-20 | Toray Ind Inc | 耐衝撃性熱可塑性樹脂組成物 |
| US4528346A (en) * | 1982-09-17 | 1985-07-09 | Dainippun Ink and Chemicals, Inc. | Resin composition |
| FR2545653B1 (fr) * | 1983-05-04 | 1986-06-06 | Pichot Michel | Procede et dispositif d'encapsulation de circuits integres |
| EP0151553A3 (de) * | 1984-02-03 | 1987-05-27 | Ciba-Geigy Ag | Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit |
| JPS6220555A (ja) * | 1985-07-18 | 1987-01-29 | Mitsubishi Electric Corp | エポキシ樹脂組成物 |
| US4853442A (en) * | 1987-04-03 | 1989-08-01 | Hercules Incorporated | Amine-terminated polysulfone sulfide, useful as epoxy curing agent |
| JPS63289016A (ja) * | 1987-05-22 | 1988-11-25 | Asahi Glass Co Ltd | エポキシ樹脂組成物 |
| US5364914A (en) * | 1988-10-05 | 1994-11-15 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
| US5326516A (en) * | 1989-10-03 | 1994-07-05 | Plasticolors, Inc. | Method of preparing a cured pigmented thermosetting polymer composition exhibiting improved color values and reduced haze |
| CA2089266C (en) * | 1990-08-27 | 2002-07-09 | Philip S. Blatz | Toughened thermoplastic polyester compositions |
| DE4140876C2 (de) * | 1991-12-11 | 1994-04-21 | Voith Gmbh J M | Walzenpresse |
| US5443775A (en) * | 1992-05-08 | 1995-08-22 | Plasticolors, Inc. | Process for preparing pigmented thermoplastic polymer compositions and low shrinking thermosetting resin molding composition |
| ES2127803T3 (es) * | 1992-08-11 | 1999-05-01 | Hexcel Corp | Resinas termoestables endurecidas con polimeros de sulfona. |
-
1994
- 1994-12-29 NL NL9402233A patent/NL9402233A/nl not_active Application Discontinuation
-
1995
- 1995-12-21 MY MYPI95004023A patent/MY131688A/en unknown
- 1995-12-22 CA CA002166043A patent/CA2166043A1/en not_active Abandoned
- 1995-12-25 JP JP07337400A patent/JP3126104B2/ja not_active Expired - Fee Related
- 1995-12-26 TW TW084113863A patent/TW312843B/zh active
- 1995-12-27 EP EP95203655A patent/EP0720901B1/en not_active Expired - Lifetime
- 1995-12-27 ES ES95203655T patent/ES2133662T3/es not_active Expired - Lifetime
- 1995-12-27 KR KR1019950059470A patent/KR960026681A/ko not_active Abandoned
- 1995-12-27 AT AT95203655T patent/ATE180201T1/de not_active IP Right Cessation
- 1995-12-27 DE DE69509739T patent/DE69509739T2/de not_active Expired - Fee Related
- 1995-12-28 RU RU95122410/28A patent/RU2151447C1/ru active
- 1995-12-28 SG SG1995002387A patent/SG35053A1/en unknown
- 1995-12-29 US US08/581,132 patent/US5895620A/en not_active Expired - Fee Related
-
1996
- 1996-01-10 MX MX9600185A patent/MX9600185A/es not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0359558A2 (en) * | 1988-09-13 | 1990-03-21 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant consisting of epoxy resin composition |
| EP0365168A2 (en) * | 1988-10-05 | 1990-04-25 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2358353C2 (ru) * | 2003-09-03 | 2009-06-10 | Моментив Перформанс Матириалз Инк. | Прозрачная композиция герметика, способ ее получения и твердотельное устройство, использующее указанную композицию |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69509739T2 (de) | 1999-10-21 |
| CA2166043A1 (en) | 1996-06-30 |
| JP3126104B2 (ja) | 2001-01-22 |
| ATE180201T1 (de) | 1999-06-15 |
| JPH08274221A (ja) | 1996-10-18 |
| EP0720901B1 (en) | 1999-05-19 |
| KR960026681A (ko) | 1996-07-22 |
| NL9402233A (nl) | 1996-08-01 |
| MY131688A (en) | 2007-08-30 |
| DE69509739D1 (de) | 1999-06-24 |
| ES2133662T3 (es) | 1999-09-16 |
| EP0720901A1 (en) | 1996-07-10 |
| US5895620A (en) | 1999-04-20 |
| MX9600185A (es) | 1997-01-31 |
| TW312843B (enrdf_load_stackoverflow) | 1997-08-11 |
| SG35053A1 (en) | 1997-02-01 |
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