KR960026681A - 전자소자를 캡슐화하는 방법, 그 방법에 의해 캡슐화된 전자소자, 및 그 전자소자를 위해 설계된 캡슐재료 - Google Patents

전자소자를 캡슐화하는 방법, 그 방법에 의해 캡슐화된 전자소자, 및 그 전자소자를 위해 설계된 캡슐재료 Download PDF

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KR960026681A
KR960026681A KR1019950059470A KR19950059470A KR960026681A KR 960026681 A KR960026681 A KR 960026681A KR 1019950059470 A KR1019950059470 A KR 1019950059470A KR 19950059470 A KR19950059470 A KR 19950059470A KR 960026681 A KR960026681 A KR 960026681A
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South Korea
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weight
electronic device
encapsulated
encapsulating
reactive
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KR1019950059470A
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English (en)
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조하네스 테오도루스 마리아 피에이에스 이레네우스
게라드 로데위즈크 넬리쎈 조하네스
Original Assignee
조하네스 테오도루스 마리아 피에이에스 이레네우스
"3피" 라이센싱 비이. 브이.
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Application filed by 조하네스 테오도루스 마리아 피에이에스 이레네우스, "3피" 라이센싱 비이. 브이. filed Critical 조하네스 테오도루스 마리아 피에이에스 이레네우스
Publication of KR960026681A publication Critical patent/KR960026681A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Sealing Material Composition (AREA)

Abstract

전자소자, 특히 집적회로를 캡슐재료로 캡슐화하기 위한 방법으로서, 주형의 공동안에 캡슐화될 전자소자를 위치시키는 단계; 주형 및 캡슐화될 소자 사이의 공동안쪽으로 상승 온도에서 캡슐재료를 도입하는 단계; 캡슐재료를 경화시키는 단계; 및 공동으로부터 캡슐화된 소자를 방출시키는 단계를 적어도 포함하며, 이용된 캡슐재료가 40~65중량%의 공업용 열가소성 물질 및 60~35중량%의 반응성 용매를 포함하는 것을 특징으로 하는, 전자소자 특히 집적회로를 캡슐화하기 위한 방법.

Description

전자소자를 캡슐화하는 방법, 그 방법에 의해 캡슐화된 전자소자, 및 그 전자소자를 위해 설계된 캡슐재료
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 공업용 열가소성 물질 및 반응성 용매를 포함한 캡슐재료로 전자소자, 특히 집적회로를 캡슐화하기 위한 방법으로서, 주형의 공동안에 캡슐화될 상기 소자를 위치시키는 단계; 상기 주형 및 캡슐화될 상기 소자 사이의 공동안쪽으로 상승 온도에서 상기 캡슐재료를 도입하는 단계; 상기 캡슐재료를 경화시키는 단계; 및 상기 공동으로부터 상기 캡슐화된 소자를 방출시키는 단계를 적어도 포함하는, 전자소자 특히 집적회로를 캡슐화하기 위한 방법에 있어서, 이용된 캡슐재료가 40~65중량%의 공업용 열가소성 물질 및 60~35중량%의 반응성 용매를 포함하는 것을 특징으로 하는, 전자소자 특히 집적회로를 캡슐화하기 위한 방법.
  2. 제1항에 있어서, 이용된 캡슐재료가 50~60중량%의 공업용 열가소성 물질 및 50~40중량%의 반응성 용매를 포함하는 것을 특징으로 하는, 전자소자 특히 집적회로를 캡슐화하기 위한 방법.
  3. 제1항 또는 제2항에 있어서, 반응성 용매가, 중합, 교차결합 또는 두 가지 모두를 수행할 수 있는 반응성 성분을 포함하는 것을 특징으로 하는, 전자소자 특히 집적회로를 캡슐화하기 위한 방법.
  4. 제1항 내지 제3항 중 하나 또는 다수항에 있어서, 반응성 용매가, 불포화 올레핀, 불포화 방향족 올레핀, 시클릭 에테르, 시클릭 아미드, 아크릴레이트, 아크릴로 니트릴, 열경화성 수지, 폴리아미드, 알리파틱 및 알리시클릭 아민, 방향족 아민, 카르복실산, 카르복실산 무수물, 페놀릭스, 폴리알코올 및 그 혼합물로부터 선택되는 것을 특징으로 하는, 전자소자 특히 집적회로를 캡슐화하기 위한 방법.
  5. 특히, 전자소자를 캡슐화하려고 의도된 캡슐재료에 있어서, 40~65중량%의 공업용 열가소성물질 및 60~35중량%의 반응성 용매를 적어도 포함하는 캡슐재료.
  6. 제5항에 있어서, 상기 캡슐재료가 50~60중량%의 공업용 열가소성물질 및 50~40중량%의 반응성용매를 적어도 포함하는 것을 특징으로 하는 캡슐재료.
  7. 제5항 또는 제6항에 따른 캡슐재료로 제조된 엔캡슐레이션(encapsulation)이 구비된, 전자소자 특히 집적회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950059470A 1994-12-29 1995-12-27 전자소자를 캡슐화하는 방법, 그 방법에 의해 캡슐화된 전자소자, 및 그 전자소자를 위해 설계된 캡슐재료 KR960026681A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9402233A NL9402233A (nl) 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
NL9402233 1994-12-29

Publications (1)

Publication Number Publication Date
KR960026681A true KR960026681A (ko) 1996-07-22

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KR1019950059470A KR960026681A (ko) 1994-12-29 1995-12-27 전자소자를 캡슐화하는 방법, 그 방법에 의해 캡슐화된 전자소자, 및 그 전자소자를 위해 설계된 캡슐재료

Country Status (14)

Country Link
US (1) US5895620A (ko)
EP (1) EP0720901B1 (ko)
JP (1) JP3126104B2 (ko)
KR (1) KR960026681A (ko)
AT (1) ATE180201T1 (ko)
CA (1) CA2166043A1 (ko)
DE (1) DE69509739T2 (ko)
ES (1) ES2133662T3 (ko)
MX (1) MX9600185A (ko)
MY (1) MY131688A (ko)
NL (1) NL9402233A (ko)
RU (1) RU2151447C1 (ko)
SG (1) SG35053A1 (ko)
TW (1) TW312843B (ko)

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CN113644203B (zh) * 2021-08-09 2024-02-27 天津大学 一种基于热塑性弹性体的有机太阳能电池及其制备方法

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Also Published As

Publication number Publication date
EP0720901B1 (en) 1999-05-19
TW312843B (ko) 1997-08-11
CA2166043A1 (en) 1996-06-30
JPH08274221A (ja) 1996-10-18
ATE180201T1 (de) 1999-06-15
US5895620A (en) 1999-04-20
DE69509739T2 (de) 1999-10-21
RU2151447C1 (ru) 2000-06-20
EP0720901A1 (en) 1996-07-10
JP3126104B2 (ja) 2001-01-22
ES2133662T3 (es) 1999-09-16
MY131688A (en) 2007-08-30
MX9600185A (es) 1997-01-31
DE69509739D1 (de) 1999-06-24
NL9402233A (nl) 1996-08-01
SG35053A1 (en) 1997-02-01

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