FR2545653B1 - Procede et dispositif d'encapsulation de circuits integres - Google Patents
Procede et dispositif d'encapsulation de circuits integresInfo
- Publication number
- FR2545653B1 FR2545653B1 FR8307437A FR8307437A FR2545653B1 FR 2545653 B1 FR2545653 B1 FR 2545653B1 FR 8307437 A FR8307437 A FR 8307437A FR 8307437 A FR8307437 A FR 8307437A FR 2545653 B1 FR2545653 B1 FR 2545653B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuits
- encapsulating integrated
- encapsulating
- circuits
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8307437A FR2545653B1 (fr) | 1983-05-04 | 1983-05-04 | Procede et dispositif d'encapsulation de circuits integres |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8307437A FR2545653B1 (fr) | 1983-05-04 | 1983-05-04 | Procede et dispositif d'encapsulation de circuits integres |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2545653A1 FR2545653A1 (fr) | 1984-11-09 |
FR2545653B1 true FR2545653B1 (fr) | 1986-06-06 |
Family
ID=9288582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8307437A Expired FR2545653B1 (fr) | 1983-05-04 | 1983-05-04 | Procede et dispositif d'encapsulation de circuits integres |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2545653B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5018003A (en) * | 1988-10-20 | 1991-05-21 | Mitsubishi Denki Kabushiki Kaisha | Lead frame and semiconductor device |
NL9402233A (nl) * | 1994-12-29 | 1996-08-01 | 3P Licensing Bv | Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal. |
US5855924A (en) * | 1995-12-27 | 1999-01-05 | Siemens Microelectronics, Inc. | Closed-mold for LED alphanumeric displays |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1036165A (en) * | 1962-05-25 | 1966-07-13 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
NL7701283A (nl) * | 1977-02-08 | 1978-08-10 | Philips Nv | Werkwijze voor het vervaardigen van geheel of ge- deeltelijk uit geschuimd thermoplastisch materiaal bestaande voorwerpen, voorwerpen vervaardigd volgens die werkwijze en inrichting voor het uitvoeren van de werkwijze. |
US4332537A (en) * | 1978-07-17 | 1982-06-01 | Dusan Slepcevic | Encapsulation mold with removable cavity plates |
JPS5480079A (en) * | 1978-08-07 | 1979-06-26 | Dai Ichi Seiko Co Ltd | Method of forming semiconductor seal |
CH641626B (de) * | 1979-01-18 | Citizen Watch Co Ltd | Verfahren zur herstellung von elektronischen uhrmodulen. | |
FR2490917A1 (fr) * | 1980-09-02 | 1982-03-26 | Motorola Semiconducteurs | Boitier pour circuit electrique et procede de fabrication |
-
1983
- 1983-05-04 FR FR8307437A patent/FR2545653B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2545653A1 (fr) | 1984-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |