JPS56135579A - Bondable resin molded article - Google Patents

Bondable resin molded article

Info

Publication number
JPS56135579A
JPS56135579A JP3952680A JP3952680A JPS56135579A JP S56135579 A JPS56135579 A JP S56135579A JP 3952680 A JP3952680 A JP 3952680A JP 3952680 A JP3952680 A JP 3952680A JP S56135579 A JPS56135579 A JP S56135579A
Authority
JP
Japan
Prior art keywords
article
resin compsn
shape
molded
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3952680A
Other languages
Japanese (ja)
Inventor
Masahito Shimizu
Hideshi Asoshina
Shigeru Katayama
Hiroshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP3952680A priority Critical patent/JPS56135579A/en
Publication of JPS56135579A publication Critical patent/JPS56135579A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)

Abstract

PURPOSE: To provide a bondable resin molded article which can be molten and cured by a heating means to set an article or to cover and set an article,by a method wherein a thermosetting resin compsn. contg. a specified nitrile rubber is molded in an uncured or a semicured state into a shape according to the shape of an article to which the resin compsn. is applied.
CONSTITUTION: There is used a thermosetting resin compsn. contg. an epoxy resin having a softening point of not lower than 60°C, an acrylonitrile-butadiene copolymer contg. carboxyl group and having a Mooney viscosity (100°C) of 10W 150, and a hardener which is stable at a room temperature and exhibits activity at an elevated temperature. The thermosetting resin compsn. is crushed or pelletized and molded in an uncured or a semicured state into a shape of, e.g., a tube, a branch pipe, a cup, or a half-round doughnut according to the shape of an article to which the resin compsn. is applied. Then the molded article is molten and cured by heating. The molded article exhibits excellent setting performance and produces a cured article having excellent heat resistance, solvent resistance and chemical resistance. For example, a plurality of conductive wires can be covered with the resin compsn. and, at the same time, can be set to a substrate.
COPYRIGHT: (C)1981,JPO&Japio
JP3952680A 1980-03-26 1980-03-26 Bondable resin molded article Pending JPS56135579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3952680A JPS56135579A (en) 1980-03-26 1980-03-26 Bondable resin molded article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3952680A JPS56135579A (en) 1980-03-26 1980-03-26 Bondable resin molded article

Publications (1)

Publication Number Publication Date
JPS56135579A true JPS56135579A (en) 1981-10-23

Family

ID=12555480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3952680A Pending JPS56135579A (en) 1980-03-26 1980-03-26 Bondable resin molded article

Country Status (1)

Country Link
JP (1) JPS56135579A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837701A (en) * 1981-08-31 1983-03-05 Nissan Motor Co Ltd Safety device for robot
JPS58142955A (en) * 1982-02-19 1983-08-25 Mitsui Petrochem Ind Ltd Adhesive composition
JPS5989380A (en) * 1982-11-11 1984-05-23 Mitsui Petrochem Ind Ltd Adhesive composition
US4501853A (en) * 1981-11-26 1985-02-26 Sunstar Giken Kabushiki Kaisha Epoxy resin composition and method for the preparation of the same
JPS6485271A (en) * 1982-11-11 1989-03-30 Mitsui Petrochemical Ind Printed board
US4829124A (en) * 1986-11-17 1989-05-09 Armstrong World Industries, Inc. Dynamically crosslinked thermoplastic elastomer
EP1138722A1 (en) * 1999-01-06 2001-10-04 Sunstar Giken Kabushiki Kaisha One-pack type thermally crosslinkable polymer composition

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837701A (en) * 1981-08-31 1983-03-05 Nissan Motor Co Ltd Safety device for robot
US4501853A (en) * 1981-11-26 1985-02-26 Sunstar Giken Kabushiki Kaisha Epoxy resin composition and method for the preparation of the same
JPS58142955A (en) * 1982-02-19 1983-08-25 Mitsui Petrochem Ind Ltd Adhesive composition
JPS5989380A (en) * 1982-11-11 1984-05-23 Mitsui Petrochem Ind Ltd Adhesive composition
JPS6485271A (en) * 1982-11-11 1989-03-30 Mitsui Petrochemical Ind Printed board
JPH0517269B2 (en) * 1982-11-11 1993-03-08 Mitsui Petrochemical Ind
US4829124A (en) * 1986-11-17 1989-05-09 Armstrong World Industries, Inc. Dynamically crosslinked thermoplastic elastomer
EP1138722A1 (en) * 1999-01-06 2001-10-04 Sunstar Giken Kabushiki Kaisha One-pack type thermally crosslinkable polymer composition

Similar Documents

Publication Publication Date Title
JPS56125449A (en) Curable resin composition
JPS56135579A (en) Bondable resin molded article
JPS5649780A (en) Resin molded bondable article
JPS5388097A (en) Epoxy resin composition
JPS56135584A (en) Molded sealing material
JPS5590549A (en) Adhesive resin molding
JPS56116742A (en) Synthetic resin composition
JPS54125284A (en) Production of flexible printed circuit
JPS543135A (en) Adhesive composition
JPS52845A (en) Polycarbonate resin composition
JPS57115938A (en) Method for manufacturing molding sand coated with unsaturated polyester resin
JPS56135580A (en) Thermosetting resin molded article
JPS57135839A (en) Production of porous epoxy resin molded article
JPS51134793A (en) Method for manufacturing a cured epoxy resin
JPS52129379A (en) Plastic molded semiconductor device
JPS54146867A (en) Production of heat-resistant insulator
JPS54157189A (en) Treatment of surface of plastic base for metal coating
JPS53134097A (en) Heat-resistant resin composition
JPS51149399A (en) Preparation of acrylate modified with urethane and the resin therefrom
JPS5799759A (en) Manufacture of resin sealing type electronic part
FR2576545B1 (en) METHOD FOR MANUFACTURING FLEXIBLE ELECTRICAL INSULATING MATERIAL AND FLEXIBLE ELECTRICAL INSULATING MATERIAL OBTAINED BY THIS PROCESS
JPS5589342A (en) Crosslinkable resin composition
JPS52114982A (en) Resin mould electrical and electronic parts
Hong et al. Electrical Insulating Characteristics of Epoxy Resin by the Fusion Blend Method
JPS52154849A (en) Curable liquid polymer composition