JPS56135584A - Molded sealing material - Google Patents
Molded sealing materialInfo
- Publication number
- JPS56135584A JPS56135584A JP3952580A JP3952580A JPS56135584A JP S56135584 A JPS56135584 A JP S56135584A JP 3952580 A JP3952580 A JP 3952580A JP 3952580 A JP3952580 A JP 3952580A JP S56135584 A JPS56135584 A JP S56135584A
- Authority
- JP
- Japan
- Prior art keywords
- molded
- component
- sealing material
- contg
- hardener
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Gasket Seals (AREA)
Abstract
PURPOSE: To provide a molded sealing material which can be molten and bonded to a sealing part by heating and, at the same time, can be cured to exhibit a sealing function, by a method wherein a speified thermosetting resin compsn. contg. a hardener exhibiting activity at an elevated temperature is molded into a shape in an uncured or semi-cured state.
CONSTITUTION: An acrylonitrile-butadiene copolymer (B) contg. a predetermined amount of carboxyl groups at its terminal or in the polymer chain is mixed or reacted with 100pts.wt. epoxy resin in such a proportion as to give 10wt% component (B) based on the combined amount of the component (A) and the component (C) mentioned below. Then 0.5W20pts.wt. hardener (C), which is stable at a room temperature and exhibits activity at an elevated temperature (e.g. dicyandiamide or thiourea), is added to the resulting mixt. or reaction product. The resulting thermosetting resin compsn. is molded into a string or a film in an uncured or a semicured state by using an extruder etc. to produce the desired molded sealing material.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3952580A JPS56135584A (en) | 1980-03-26 | 1980-03-26 | Molded sealing material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3952580A JPS56135584A (en) | 1980-03-26 | 1980-03-26 | Molded sealing material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56135584A true JPS56135584A (en) | 1981-10-23 |
JPH0128073B2 JPH0128073B2 (en) | 1989-05-31 |
Family
ID=12555453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3952580A Granted JPS56135584A (en) | 1980-03-26 | 1980-03-26 | Molded sealing material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56135584A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0196210A (en) * | 1987-09-28 | 1989-04-14 | Ppg Ind Inc | One-package type stable hardenable composition |
JPH01110525A (en) * | 1987-09-28 | 1989-04-27 | Ppg Ind Inc | One-package type stable curable composition |
US5010137A (en) * | 1987-02-16 | 1991-04-23 | Japan Synthetic Rubber Co., Ltd. | Rubber composition, and oil seal and rubber hose obtained therefrom |
WO2001057154A1 (en) * | 2000-02-02 | 2001-08-09 | Honda Motor Co., Ltd. | String type sealing material |
JP2001348418A (en) * | 2000-06-06 | 2001-12-18 | Mitsui Chemicals Inc | Epoxy resin composition and adhesive sheet |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2413636A1 (en) * | 2002-12-05 | 2004-06-05 | Bayer Inc. | Adhesive compositions |
-
1980
- 1980-03-26 JP JP3952580A patent/JPS56135584A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5010137A (en) * | 1987-02-16 | 1991-04-23 | Japan Synthetic Rubber Co., Ltd. | Rubber composition, and oil seal and rubber hose obtained therefrom |
JPH0196210A (en) * | 1987-09-28 | 1989-04-14 | Ppg Ind Inc | One-package type stable hardenable composition |
JPH01110525A (en) * | 1987-09-28 | 1989-04-27 | Ppg Ind Inc | One-package type stable curable composition |
WO2001057154A1 (en) * | 2000-02-02 | 2001-08-09 | Honda Motor Co., Ltd. | String type sealing material |
US7118803B1 (en) | 2000-02-02 | 2006-10-10 | Honda Motor Co., Ltd. | String-like sealing material |
JP2001348418A (en) * | 2000-06-06 | 2001-12-18 | Mitsui Chemicals Inc | Epoxy resin composition and adhesive sheet |
Also Published As
Publication number | Publication date |
---|---|
JPH0128073B2 (en) | 1989-05-31 |
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