JPS5665070A - Adhesive expandable resin molded product - Google Patents
Adhesive expandable resin molded productInfo
- Publication number
- JPS5665070A JPS5665070A JP14147079A JP14147079A JPS5665070A JP S5665070 A JPS5665070 A JP S5665070A JP 14147079 A JP14147079 A JP 14147079A JP 14147079 A JP14147079 A JP 14147079A JP S5665070 A JPS5665070 A JP S5665070A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- adhesive
- molded product
- resin molded
- expandable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesive Tapes (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: The titled adhesive product, easily handled and excellent in workability, which is prepared by providing an expandable resin molded product containing a thermoplastic resin and a thermosetting resin as resin components, with an adhesive layer.
CONSTITUTION: A resin composition is formed by compounding 100pts.wt. of a thermoplastic resin (e.g., an ethylene-vinyl acetate copolymer containing about 10W 40wt% of vinyl acetate), 20W30pts.wt. of a thermosetting resin (e.g., an epoxy resin of melting pt. 60W180°C), a foaming agent (e.g., an azodicarboxylic acid amide), and a curing agent (e.g., 3-p-chlorophenyl-1,1-dimethylurea). The resulting composition is molded, with little foaming, into a sheet of thickness 0.05W4mm, to which an adhesive (preferably a thermosetting adhesive) is applied, to form an adhesive expandable resin molded product.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14147079A JPS5665070A (en) | 1979-10-31 | 1979-10-31 | Adhesive expandable resin molded product |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14147079A JPS5665070A (en) | 1979-10-31 | 1979-10-31 | Adhesive expandable resin molded product |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5665070A true JPS5665070A (en) | 1981-06-02 |
Family
ID=15292626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14147079A Pending JPS5665070A (en) | 1979-10-31 | 1979-10-31 | Adhesive expandable resin molded product |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5665070A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6246624A (en) * | 1985-08-26 | 1987-02-28 | Sekisui Chem Co Ltd | Manufacture of olefin-based resin foam with modified surface |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4843030A (en) * | 1971-09-29 | 1973-06-22 |
-
1979
- 1979-10-31 JP JP14147079A patent/JPS5665070A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4843030A (en) * | 1971-09-29 | 1973-06-22 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6246624A (en) * | 1985-08-26 | 1987-02-28 | Sekisui Chem Co Ltd | Manufacture of olefin-based resin foam with modified surface |
JPH0353104B2 (en) * | 1985-08-26 | 1991-08-14 | Sekisui Chemical Co Ltd |
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