JPS56135580A - Thermosetting resin molded article - Google Patents

Abstract

PURPOSE: To provide the titled molded article which can be molten and cured by heating to set, cover or seal an article, by a method wherein a specified thermoplastic resin is blended with an epoxy resin to prepare a thermosetting resin compsn. which is then molded in an uncured or a semicured state into a shape according to the shape of an article to be molded.

CONSTITUTION: A thermoplastic resin having an average MW of not less than 1,0000 and contg. a repeating unit of the formula and derived from bisphenol A and epichlorohydrin, is blended with an epoxy resin which is liquid or semisolid at a room temperature. A hardener which is stable at a room temperature and exhibits activity at an elevated temperature [e.g. 3-(p-chlorophenyl)-1,1,-dimethylurea or dicyandiamide] is incorporated into the above blend to prepare a thermosetting resin compsn. The thermosetting resin compsn. is crushed or pelletized, and molded in an uncured or a semicured state into a shape of, e.g., string, a film, a tube or a half-round doughnut. The resulting molded article is molten and cured by heating. The molded article exhibits excellent setting, covering and sealing performances, and produces a cured article having excellent resistance to heat, solvent and chemicals. For example, a plurality of conductive wires can be covered with the resin compsn. and, at the same time, can be set to a substrate.

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