JPS6028469A - Epoxy resin-made tape - Google Patents
Epoxy resin-made tapeInfo
- Publication number
- JPS6028469A JPS6028469A JP13654383A JP13654383A JPS6028469A JP S6028469 A JPS6028469 A JP S6028469A JP 13654383 A JP13654383 A JP 13654383A JP 13654383 A JP13654383 A JP 13654383A JP S6028469 A JPS6028469 A JP S6028469A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- tape
- anhydrous silica
- casting
- type epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
本発明は、エポキシ樹脂主剤と硬化剤をあらかじめ混合
し、シート状に流延したエポキシ樹脂製のテープに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin tape in which a base epoxy resin and a curing agent are mixed in advance and cast into a sheet.
エポキシ樹脂主剤と硬化剤をあらかじめ混合し、シート
状に流延したエポキシ樹脂製テープは、電磁弁コイルの
表面部へのコーティング、金属板の接着等に作業性の良
さから、実用の期待が、かけられていたが、仲々実用さ
れていない。Epoxy resin tape, which is made by pre-mixing an epoxy resin base and a curing agent and casting it into a sheet, is expected to be used in practical applications such as coating the surface of solenoid valve coils and adhering metal plates due to its good workability. Although it was used, it was never put into practical use.
これは、主としてエポキシ樹脂製テープが３０℃以上の
室温において、タレを生じるとともに、加熱硬化時にお
いても、タレが発生し易いためである。即ち、従来のエ
ポキシ樹脂製テープは、タレを防止するために、次の様
な方法が採用されていた。This is mainly because epoxy resin tapes tend to sag at room temperatures of 30° C. or higher and also tend to sag during heat curing. That is, in order to prevent sagging of conventional epoxy resin tapes, the following method has been adopted.
（１）エポキシ樹脂の中に炭酸カルシウム、或いはタル
クを添加する。これの断面図を第１図の（イ）に示す。(1) Add calcium carbonate or talc to the epoxy resin. A cross-sectional view of this is shown in FIG. 1(a).
１は樹脂、２は離型紙、そして３は炭酸Ｃａ又はタルク
である。1 is resin, 2 is release paper, and 3 is Ca carbonate or talc.
（２）ガラス繊維、ポリエステル等からなるマット、テ
ープ、あるいは不織布のような基材の上に、エポキシ樹
脂を流延する。この断面を第１図の（ロ）に示す。１は
樹脂で、２は離型紙、そして４は基材であるガラス繊維
又はポリエステルである。(2) Epoxy resin is cast onto a base material such as a mat, tape, or nonwoven fabric made of glass fiber, polyester, or the like. This cross section is shown in FIG. 1(b). 1 is a resin, 2 is a release paper, and 4 is a base material of glass fiber or polyester.
然し、前記（１）の方法では流動性に対する効果が少な
く、また、炭酸カルシウム、タルクに付着する結晶水、
凝集水のため、硬化時に発泡が生し外観上問題となり、
また（２）の方法ではエポキシ樹脂製テープ全体の剛性
が上がり、例えば電磁弁コイルのようにテープ貼付面が
複雑形状の場合にはテープが完全に密着貼付できず、内
部に空気が残るために硬化時に発泡する原因となってい
た。However, the method (1) has little effect on fluidity, and also causes crystallization water adhering to calcium carbonate and talc.
Due to condensed water, foaming occurs during curing, which causes problems with appearance.
In addition, method (2) increases the rigidity of the epoxy resin tape as a whole, and if the surface to which the tape is applied has a complex shape, such as a solenoid valve coil, the tape cannot be adhered completely and air may remain inside. This caused foaming during curing.
この様に従来のエポキシ樹脂製テープは、タレ、泡の発
生による外観上の問題と、更に硬化時に密着性が良くな
いという欠点があった。As described above, conventional epoxy resin tapes have problems in appearance due to sagging and generation of bubbles, and also have the disadvantage of poor adhesion during curing.
本発明は、前記欠点を解消したものでタレ、泡のない密
着性の良いエポキシ樹脂製テープを提供するものである
。即ち、エポキシ樹脂製テープに、特に微粒子の無水シ
リカを配合することを特徴としたもので、無水シリカは
表面に活性基として、シラノール基（ＳｉＯＨ）を持っ
ているため、相互に水素結合をなし、通常他の無機物を
添加した以上に増粘硬化があり、また、シラノール基は
エポキシ樹脂配合物中に含まれるエポキシ基、アミノ基
等と同様に水素結合をなし、更に増粘硬化を示す。この
結果、無水シリカを添加することにより、エポキシ樹脂
の流動性が低下し、室温あるいは高温時のタレを防止で
き、密着性を増すことが出来る。The present invention solves the above-mentioned drawbacks and provides an epoxy resin tape with good adhesion and no sagging or bubbles. That is, it is characterized by blending particularly fine particles of anhydrous silica into an epoxy resin tape.Anhydrous silica has silanol groups (SiOH) as active groups on its surface, so it does not form hydrogen bonds with each other. Generally, the viscosity increases and hardens more than when other inorganic substances are added, and the silanol groups form hydrogen bonds like the epoxy groups, amino groups, etc. contained in epoxy resin formulations, and exhibit further viscosity and hardness. As a result, by adding anhydrous silica, the fluidity of the epoxy resin is reduced, sagging at room temperature or high temperature can be prevented, and adhesiveness can be increased.
次に、具体的に実施例にもとづいて説明する。Next, a specific explanation will be given based on an example.
第１表は、変性ビスフェノールＡ型エポキシ樹脂１００
部に対し、硬化剤及び添加材を配合したもの、タレの流
れ具合及び発泡の状況を示したもので、１〜２は本発明
の実施例で、３〜４は従来例である。Table 1 shows modified bisphenol A type epoxy resin 100
1 and 2 are examples of the present invention, and 3 and 4 are conventional examples.
第一」−一犬２
第１表の流動距離Ｓは、樹脂の粘性即ちタレ具合の測定
方法で、第２図に示すように、ガラス板６をα＝６０度
の角度に傾斜させ、試料として厚０．１ｍｍ、直径５額
のシート７をガラス面に置き、炉内（図示しない）にて
１５０度で２０分間加熱後、タレ具合７ａの流れ、即ち
流動距離Ｓを測定したものである。The flow distance S in Table 1 is a method for measuring the viscosity of the resin, that is, the degree of sagging.As shown in FIG. A sheet 7 with a thickness of 0.1 mm and a diameter of 5 mm was placed on a glass surface, and after heating at 150 degrees for 20 minutes in a furnace (not shown), the flow of the sagging condition 7a, that is, the flow distance S was measured. .
第１表より、実施差１及び２がまった（泡の発生が無く
、流動距離も短かく、従って、タレ及（泡のないエポキ
シ樹脂製テープであることが判・。尚、第１図の（ハ）
に、このテープの断面ヲノす。１は樹脂、２は離型紙、
そして５は添加材−ある無水シリカを示す。From Table 1, it can be seen that the difference between 1 and 2 is that there are no bubbles, the flow distance is short, and therefore the tape is made of epoxy resin without sagging or bubbles. of (ha)
Here is a cross section of this tape. 1 is resin, 2 is release paper,
and 5 indicates an additive - a certain anhydrous silica.
第１図はエポキシ樹脂製テープを示すもので−（イ）ノ
′Ａ〆゛（ロ）は従来例の断面図で、（ハ）は、実施差
の断面図、そして、第２図は流動距離のン定方法を示す
概略説明図である。
１・・・エポキシ樹脂、２・・・離型紙、５・・無水シ
リカ
特許出願人
１イレン精柵樟式嘗社
代表者中井令夫
第１図
第２図Figure 1 shows an epoxy resin tape - (a) No'A〆゛ (b) is a cross-sectional view of the conventional example, (c) is a cross-sectional view of the difference in implementation, and Figure 2 is a cross-sectional view of the conventional example. FIG. 2 is a schematic explanatory diagram showing a distance determination method. 1...Epoxy resin, 2...Release paper, 5...Anhydrous silica Patent applicant 1 Iren Seizan Shushikisha Representative Reio Nakai Figure 1 Figure 2
Claims (1)
レアンジアミド２〜２０部、無水シリカ２〜８部を配合
、混合し、離型紙の上にシート状に流延した、エポキシ
樹脂製テープ。An epoxy resin tape prepared by blending and mixing 2 to 20 parts of lyreandiamide and 2 to 8 parts of anhydrous silica to 100 parts of a modified bisphenol A type epoxy resin base material, and casting the mixture in a sheet form on release paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13654383A JPS6028469A (en) | 1983-07-26 | 1983-07-26 | Epoxy resin-made tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13654383A JPS6028469A (en) | 1983-07-26 | 1983-07-26 | Epoxy resin-made tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6028469A true JPS6028469A (en) | 1985-02-13 |
Family
ID=15177652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13654383A Pending JPS6028469A (en) | 1983-07-26 | 1983-07-26 | Epoxy resin-made tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028469A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234976A (en) * | 1985-08-07 | 1987-02-14 | ミネソタ マイニング アンド マニユフアクチユアリング コンパニ− | Pressure-sensitive adhesive tape containing hydrophobic silica |
| JPS62141038U (en) * | 1986-03-01 | 1987-09-05 | ||
| JPH03296582A (en) * | 1990-04-14 | 1991-12-27 | Tomoegawa Paper Co Ltd | Adhesive sheet |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111799A (en) * | 1974-07-18 | 1976-01-30 | Kojin Kk | Shinkina pirimido * 4**5* 5*4 * piroro * 1*22b * isokinorinjudotaino seizohoho |
| JPS56135580A (en) * | 1980-03-26 | 1981-10-23 | Nitto Electric Ind Co Ltd | Thermosetting resin molded article |
-
1983
- 1983-07-26 JP JP13654383A patent/JPS6028469A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111799A (en) * | 1974-07-18 | 1976-01-30 | Kojin Kk | Shinkina pirimido * 4**5* 5*4 * piroro * 1*22b * isokinorinjudotaino seizohoho |
| JPS56135580A (en) * | 1980-03-26 | 1981-10-23 | Nitto Electric Ind Co Ltd | Thermosetting resin molded article |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234976A (en) * | 1985-08-07 | 1987-02-14 | ミネソタ マイニング アンド マニユフアクチユアリング コンパニ− | Pressure-sensitive adhesive tape containing hydrophobic silica |
| JPH0250145B2 (en) * | 1985-08-07 | 1990-11-01 | Minnesota Mining & Mfg | |
| JPS62141038U (en) * | 1986-03-01 | 1987-09-05 | ||
| JPH03296582A (en) * | 1990-04-14 | 1991-12-27 | Tomoegawa Paper Co Ltd | Adhesive sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4537633A (en) | Portland cement, process for preparing same, and compositions containing same | |
| JPH03122114A (en) | Curing agent composition, production thereof and thermosetting epoxy resin composition | |
| US3468750A (en) | Refractory bodies with thermal barrier adhesive coatings and method therefor | |
| JPS6028469A (en) | Epoxy resin-made tape | |
| JPH03122060A (en) | Refractory coating composition having excellent adhesive force to iron | |
| CN212200899U (en) | Wallboard of quick installation | |
| JPH0478648B2 (en) | ||
| JPS60103069A (en) | Inorganic sheet for cement concrete adhesive | |
| JPH0485385A (en) | Adhesive epoxy resin composition | |
| JP2566858B2 (en) | Method for producing inorganic civil engineering building structural material and molding material used therefor | |
| JPH0338328A (en) | Honeycomb panel for construction | |
| JPS6114435Y2 (en) | ||
| CA1301396C (en) | High green strength induction curable adhesives | |
| JP3190284B2 (en) | Functional building material composition | |
| JPS63196621A (en) | Production of epoxy resin composition | |
| JPH09132474A (en) | Board capable of absorbing sound and conditioning humidity and its production | |
| JPS6142559A (en) | Amino resin molding material | |
| WO1988000221A1 (en) | Sound deadening material | |
| JPS5830910B2 (en) | One-component foamed epoxy resin-impregnated adhesive tape | |
| JPH0345570A (en) | Adhesive for refractory board and production thereof | |
| JP2021073390A (en) | Corner member and manufacturing method thereof | |
| JPH06293100A (en) | Production of laminated sheet | |
| JPS63139738A (en) | Manufacture of honeycomb structure and adhesive sheet for manufacturing honeycomb structure | |
| JPS60166277A (en) | Foamed ceramics | |
| JP2007138527A (en) | Wall panel |