JPS62141038U - - Google Patents

Info

Publication number
JPS62141038U
JPS62141038U JP2947686U JP2947686U JPS62141038U JP S62141038 U JPS62141038 U JP S62141038U JP 2947686 U JP2947686 U JP 2947686U JP 2947686 U JP2947686 U JP 2947686U JP S62141038 U JPS62141038 U JP S62141038U
Authority
JP
Japan
Prior art keywords
reel
separator
filler
adhesive layer
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2947686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2947686U priority Critical patent/JPS62141038U/ja
Publication of JPS62141038U publication Critical patent/JPS62141038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に於て用いられるテープの構造
例を示す一部拡大断面図、第２図は本考案の一例
を示す一部破断の斜視図である。 １１……接着剤層、１２……セパレーター、１
３……長尺テープ、１４……リール。 FIG. 1 is a partially enlarged sectional view showing an example of the structure of a tape used in the present invention, and FIG. 2 is a partially cutaway perspective view showing an example of the present invention. 11... Adhesive layer, 12... Separator, 1
3... Long tape, 14... Reel.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 熱硬化性樹脂とフイラーとを主成分とする接着
層と、セパレーターとからなる長尺テープがリー
ルに巻取られてなることを特徴とするダイボンデ
イング用接着テープ。 An adhesive tape for die bonding, characterized in that a long tape consisting of an adhesive layer mainly composed of a thermosetting resin and a filler and a separator is wound around a reel.
JP2947686U 1986-03-01 1986-03-01 Pending JPS62141038U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2947686U JPS62141038U (en) 1986-03-01 1986-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2947686U JPS62141038U (en) 1986-03-01 1986-03-01

Publications (1)

Publication Number Publication Date
JPS62141038U true JPS62141038U (en) 1987-09-05

Family

ID=30833389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2947686U Pending JPS62141038U (en) 1986-03-01 1986-03-01

Country Status (1)

Country Link
JP (1) JPS62141038U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372585A (en) * 1989-05-29 1991-03-27 Tomoegawa Paper Co Ltd Adhesive sheet and semiconductor device
JPH03296582A (en) * 1990-04-14 1991-12-27 Tomoegawa Paper Co Ltd Adhesive sheet
JP2001176895A (en) * 1994-10-31 2001-06-29 Hitachi Chem Co Ltd Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same
JP2009235402A (en) * 2008-03-05 2009-10-15 Hitachi Chem Co Ltd Adhesive film

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196415A (en) * 1981-05-28 1982-12-02 Nitto Electric Ind Co Insulating tape
JPS5947281A (en) * 1982-09-13 1984-03-16 Nitto Electric Ind Co Ltd Preparing self-adhesive tape or sheet
JPS5980482A (en) * 1982-10-29 1984-05-09 Hitachi Chem Co Ltd Electrically-conductive adhesive sheet
JPS606776A (en) * 1983-06-27 1985-01-14 Nitto Electric Ind Co Ltd Alpha ray-shielding adhesive film
JPS6028469A (en) * 1983-07-26 1985-02-13 Aisin Seiki Co Ltd Epoxy resin-made tape
JPS60102750A (en) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd Conductive adhesive film for fixing semiconductor element
JPS6134085A (en) * 1984-07-26 1986-02-18 Hitachi Chem Co Ltd Film-form bonding member

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196415A (en) * 1981-05-28 1982-12-02 Nitto Electric Ind Co Insulating tape
JPS5947281A (en) * 1982-09-13 1984-03-16 Nitto Electric Ind Co Ltd Preparing self-adhesive tape or sheet
JPS5980482A (en) * 1982-10-29 1984-05-09 Hitachi Chem Co Ltd Electrically-conductive adhesive sheet
JPS606776A (en) * 1983-06-27 1985-01-14 Nitto Electric Ind Co Ltd Alpha ray-shielding adhesive film
JPS6028469A (en) * 1983-07-26 1985-02-13 Aisin Seiki Co Ltd Epoxy resin-made tape
JPS60102750A (en) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd Conductive adhesive film for fixing semiconductor element
JPS6134085A (en) * 1984-07-26 1986-02-18 Hitachi Chem Co Ltd Film-form bonding member

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372585A (en) * 1989-05-29 1991-03-27 Tomoegawa Paper Co Ltd Adhesive sheet and semiconductor device
JPH03296582A (en) * 1990-04-14 1991-12-27 Tomoegawa Paper Co Ltd Adhesive sheet
JP2001176895A (en) * 1994-10-31 2001-06-29 Hitachi Chem Co Ltd Laminating method, die-bonding method, laminating device, and die-bonding device of film-shaped organic die-bonding material, and semiconductor device and manufacturing method thereof using the same
JP2009235402A (en) * 2008-03-05 2009-10-15 Hitachi Chem Co Ltd Adhesive film

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