JPS5590549A - Adhesive resin molding - Google Patents

Adhesive resin molding

Info

Publication number
JPS5590549A
JPS5590549A JP16191878A JP16191878A JPS5590549A JP S5590549 A JPS5590549 A JP S5590549A JP 16191878 A JP16191878 A JP 16191878A JP 16191878 A JP16191878 A JP 16191878A JP S5590549 A JPS5590549 A JP S5590549A
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
adhesive
molding
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16191878A
Other languages
Japanese (ja)
Other versions
JPS5817239B2 (en
Inventor
Masahito Shimizu
Hideshi Asoshina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP53161918A priority Critical patent/JPS5817239B2/en
Publication of JPS5590549A publication Critical patent/JPS5590549A/en
Publication of JPS5817239B2 publication Critical patent/JPS5817239B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined

Abstract

PURPOSE: To obtain an adhesive resin molding which is meltable and then curable when heated and of excellent coverability for products as well as excellent chemical resistance and excellent solvent resistance from an adhesive thermal plastic resin, an epoxy resin, and an expoxy resin hardener.
CONSTITUTION: A mixture consisting of 100pts.wt. of an adhesive thermal plastic resin(A) for hot melt adhesion, e.g., ethylene-vinyl acetate copolymers, ionomer resins, etc., 20W300pts.wt. of an epoxy resin(B) of Novolak- or bisphenol-type, having a softening point of 60W180°C, and 0.1W10wt%(based on total weight of resin components) an epoxy resin hardener(C), e.g., 3-para-chlorophenyl-1,1-dimethylurea, 2,4-bis(N,N-dimethylcarbamido)toluene, etc., is cast into a mold treated with a releasing agent and cooled to obtain a molding in which the components (B) and (C) are uniformly dispersed in an unhardened state.
COPYRIGHT: (C)1980,JPO&Japio
JP53161918A 1978-12-29 1978-12-29 Adhesive resin molded products Expired JPS5817239B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53161918A JPS5817239B2 (en) 1978-12-29 1978-12-29 Adhesive resin molded products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53161918A JPS5817239B2 (en) 1978-12-29 1978-12-29 Adhesive resin molded products

Publications (2)

Publication Number Publication Date
JPS5590549A true JPS5590549A (en) 1980-07-09
JPS5817239B2 JPS5817239B2 (en) 1983-04-05

Family

ID=15744494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53161918A Expired JPS5817239B2 (en) 1978-12-29 1978-12-29 Adhesive resin molded products

Country Status (1)

Country Link
JP (1) JPS5817239B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210920A (en) * 1982-05-31 1983-12-08 Shin Etsu Chem Co Ltd Thermosetting epoxy resin composition
JPS61266483A (en) * 1985-05-20 1986-11-26 Toagosei Chem Ind Co Ltd Adhesive composition
JPS6281445A (en) * 1985-10-03 1987-04-14 Toyo Tire & Rubber Co Ltd Bondable epoxy composition
WO1998045382A1 (en) * 1997-04-09 1998-10-15 Minnesota Mining And Manufacturing Company Shaped adhesives

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104559816A (en) * 2015-02-05 2015-04-29 曾昭峰 Splicing method of glass felts

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923810A (en) * 1972-06-29 1974-03-02
JPS5083431A (en) * 1973-11-26 1975-07-05
JPS51109037A (en) * 1975-03-19 1976-09-27 Seitetsu Kagaku Co Ltd SETSUCHAKUSEIJUSHISOSEIBUTSU
JPS51109941A (en) * 1975-03-25 1976-09-29 Matsushita Electric Works Ltd TAIMAMOSEINOYOIKOKABUTSUOATAERU KOKASEIJUSHISOSEIBUTSU
JPS5274623A (en) * 1975-12-18 1977-06-22 Sumitomo Chem Co Ltd Coating composition having excellent adhesivity with polyethylene

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923810A (en) * 1972-06-29 1974-03-02
JPS5083431A (en) * 1973-11-26 1975-07-05
JPS51109037A (en) * 1975-03-19 1976-09-27 Seitetsu Kagaku Co Ltd SETSUCHAKUSEIJUSHISOSEIBUTSU
JPS51109941A (en) * 1975-03-25 1976-09-29 Matsushita Electric Works Ltd TAIMAMOSEINOYOIKOKABUTSUOATAERU KOKASEIJUSHISOSEIBUTSU
JPS5274623A (en) * 1975-12-18 1977-06-22 Sumitomo Chem Co Ltd Coating composition having excellent adhesivity with polyethylene

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210920A (en) * 1982-05-31 1983-12-08 Shin Etsu Chem Co Ltd Thermosetting epoxy resin composition
JPS636084B2 (en) * 1982-05-31 1988-02-08 Shinetsu Chem Ind Co
JPS61266483A (en) * 1985-05-20 1986-11-26 Toagosei Chem Ind Co Ltd Adhesive composition
JPH039952B2 (en) * 1985-05-20 1991-02-12 Toa Gosei Chem Ind
JPS6281445A (en) * 1985-10-03 1987-04-14 Toyo Tire & Rubber Co Ltd Bondable epoxy composition
WO1998045382A1 (en) * 1997-04-09 1998-10-15 Minnesota Mining And Manufacturing Company Shaped adhesives

Also Published As

Publication number Publication date
JPS5817239B2 (en) 1983-04-05

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