JPS54146867A - Production of heat-resistant insulator - Google Patents

Production of heat-resistant insulator

Info

Publication number
JPS54146867A
JPS54146867A JP5493878A JP5493878A JPS54146867A JP S54146867 A JPS54146867 A JP S54146867A JP 5493878 A JP5493878 A JP 5493878A JP 5493878 A JP5493878 A JP 5493878A JP S54146867 A JPS54146867 A JP S54146867A
Authority
JP
Japan
Prior art keywords
heat
article
resistance
softening point
polyphenylene sulfide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5493878A
Other languages
Japanese (ja)
Inventor
Seisaburo Shimizu
Hiroshi Ohira
Masahiro Fukazawa
Tatsuo Fumikura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5493878A priority Critical patent/JPS54146867A/en
Publication of JPS54146867A publication Critical patent/JPS54146867A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

PURPOSE: To obtain the title insulator usable for printed circuit base boards, having improved solder resistance, by heat-treating a molded article comprising polyphenylene sulfide resin at a temperature ranging from the softening point (T) of the resin to (T-30°C).
CONSTITUTION: Polyphenylene sulfide resin is kneaded with a filler, e.g. glass fiber, a silane coupling agent, etc. to form a molding composition, which is injection molded into an article of desired shape. The article is then heat-treated at a temperature of the softening point T (about 277°C) to (T-30°C) for about 0.5W50 hr. The heat resistance, such as solder resistance, is remarkably improved, scarcely deteriorating the high-frequency characteristics and chemical resistance.
COPYRIGHT: (C)1979,JPO&Japio
JP5493878A 1978-05-11 1978-05-11 Production of heat-resistant insulator Pending JPS54146867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5493878A JPS54146867A (en) 1978-05-11 1978-05-11 Production of heat-resistant insulator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5493878A JPS54146867A (en) 1978-05-11 1978-05-11 Production of heat-resistant insulator

Publications (1)

Publication Number Publication Date
JPS54146867A true JPS54146867A (en) 1979-11-16

Family

ID=12984571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5493878A Pending JPS54146867A (en) 1978-05-11 1978-05-11 Production of heat-resistant insulator

Country Status (1)

Country Link
JP (1) JPS54146867A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796588A (en) * 1980-12-08 1982-06-15 Toray Industries Printed circuit board
JPS59184588A (en) * 1983-04-04 1984-10-19 東レ株式会社 Printed circuit board
JPS59184619A (en) * 1983-04-04 1984-10-20 Toray Ind Inc Sheetlike article made of polyphenylenesulfide resin and manufacture thereof
US4560580A (en) * 1982-09-30 1985-12-24 Phillips Petroleum Company Process for encapsulating articles with optional laser printing

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796588A (en) * 1980-12-08 1982-06-15 Toray Industries Printed circuit board
JPS6052943B2 (en) * 1980-12-08 1985-11-22 東レ株式会社 printed wiring board
US4560580A (en) * 1982-09-30 1985-12-24 Phillips Petroleum Company Process for encapsulating articles with optional laser printing
JPS59184588A (en) * 1983-04-04 1984-10-19 東レ株式会社 Printed circuit board
JPS59184619A (en) * 1983-04-04 1984-10-20 Toray Ind Inc Sheetlike article made of polyphenylenesulfide resin and manufacture thereof
JPH0568875B2 (en) * 1983-04-04 1993-09-29 Toray Industries

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