JPS5799759A - Manufacture of resin sealing type electronic part - Google Patents

Manufacture of resin sealing type electronic part

Info

Publication number
JPS5799759A
JPS5799759A JP55175577A JP17557780A JPS5799759A JP S5799759 A JPS5799759 A JP S5799759A JP 55175577 A JP55175577 A JP 55175577A JP 17557780 A JP17557780 A JP 17557780A JP S5799759 A JPS5799759 A JP S5799759A
Authority
JP
Japan
Prior art keywords
polyester resin
molding
base material
resin
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55175577A
Other languages
Japanese (ja)
Other versions
JPS6118335B2 (en
Inventor
Hiroyuki Fujii
Kenichi Tateno
Kensaku Morii
Munetomo Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd, Matsushita Electric Works Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55175577A priority Critical patent/JPS5799759A/en
Publication of JPS5799759A publication Critical patent/JPS5799759A/en
Publication of JPS6118335B2 publication Critical patent/JPS6118335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a shape at a low temperature in a short time by compounding fiber base material to unsaturated epoxy resin, unsaturated polyester resin and a copolymerizing cross-linking agent and sealing the base material within a range of 120-180 deg.C. CONSTITUTION:The long chains of the unsaturated epoxy resin and the unsaturated polyester resin are cross-linked by the copolymerizing cross-linking agent, the adhesive strength with metals of the epoxy resin is added to the polyester resin, and the heat-shrinkage of the polyester resin is minimized by the fiber base material (5mum-3mm. length), and strength at the time of heating is increased. A reaction is instantaneous because the resin is cured by a copolymerization reaction, and a molding temperature can be selected extending over a wide range by choosing a reaction initiating material. When the molding temperature is selected at 120-180 deg.C, molding is completed extremely rapidly, hardness at the time of heating after molding is extremely high, the shape can simply be taken out of a die, and the efficiency of work is improved.
JP55175577A 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part Granted JPS5799759A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55175577A JPS5799759A (en) 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55175577A JPS5799759A (en) 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part

Publications (2)

Publication Number Publication Date
JPS5799759A true JPS5799759A (en) 1982-06-21
JPS6118335B2 JPS6118335B2 (en) 1986-05-12

Family

ID=15998510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55175577A Granted JPS5799759A (en) 1980-12-11 1980-12-11 Manufacture of resin sealing type electronic part

Country Status (1)

Country Link
JP (1) JPS5799759A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151950A (en) * 1984-08-22 1986-03-14 Mitsubishi Electric Corp Resin-sealed semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019191538A1 (en) 2018-03-29 2019-10-03 Asahi Intecc Co., Ltd. Catheter and recanalization catheter system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151950A (en) * 1984-08-22 1986-03-14 Mitsubishi Electric Corp Resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPS6118335B2 (en) 1986-05-12

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