JPS5799760A - Resin sealing type electronic part - Google Patents

Resin sealing type electronic part

Info

Publication number
JPS5799760A
JPS5799760A JP17557880A JP17557880A JPS5799760A JP S5799760 A JPS5799760 A JP S5799760A JP 17557880 A JP17557880 A JP 17557880A JP 17557880 A JP17557880 A JP 17557880A JP S5799760 A JPS5799760 A JP S5799760A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
unsaturated
cross
fibriform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17557880A
Other languages
Japanese (ja)
Inventor
Hiroyuki Fujii
Kenichi Tateno
Kensaku Morii
Munetomo Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd, Matsushita Electric Works Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP17557880A priority Critical patent/JPS5799760A/en
Publication of JPS5799760A publication Critical patent/JPS5799760A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a surrounding instrument having high hardness, which does not require heat treatment after molding, by mixing unsaturated epoxy resin, unsaturated polyester and a copolymerizing cross-linking agent and compounding a fibriform base material. CONSTITUTION:The long chains of the unsaturated epoxy resin and the unsaturated polyester resin are cross-linked by the copolymerizing cross-linking agent, the adhesive strength with metals of the epoxy resin is added to the polyester resin, and the heat-shrinkage of the polyester resin is minimized by the fibriform base material (3mum-5mm.) while strength at the time of heating is increased. A reaction is completed instantaneously because the composition is cured by a copolymerization reaction, its hardness is extremely high and its adhesive strength is strong, and the excellent surrounding instrument is obtained. Cost can be reduced because expansive resin such as epoxy resin is contained only by one part.
JP17557880A 1980-12-11 1980-12-11 Resin sealing type electronic part Pending JPS5799760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17557880A JPS5799760A (en) 1980-12-11 1980-12-11 Resin sealing type electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17557880A JPS5799760A (en) 1980-12-11 1980-12-11 Resin sealing type electronic part

Publications (1)

Publication Number Publication Date
JPS5799760A true JPS5799760A (en) 1982-06-21

Family

ID=15998526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17557880A Pending JPS5799760A (en) 1980-12-11 1980-12-11 Resin sealing type electronic part

Country Status (1)

Country Link
JP (1) JPS5799760A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5251881A (en) * 1989-09-19 1993-10-12 Compagnie Generale Des Etablissements Michelin - Michelin & Cie Methods and devices for the thermal treatment of metal wires upon passing them over capstans

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5251881A (en) * 1989-09-19 1993-10-12 Compagnie Generale Des Etablissements Michelin - Michelin & Cie Methods and devices for the thermal treatment of metal wires upon passing them over capstans

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