DE69509739D1 - Verfahren zur Verkapselung von einem elektronischen Bauelement und durch dieses Verfahren verkapseltes elektronisches Bauelement - Google Patents

Verfahren zur Verkapselung von einem elektronischen Bauelement und durch dieses Verfahren verkapseltes elektronisches Bauelement

Info

Publication number
DE69509739D1
DE69509739D1 DE69509739T DE69509739T DE69509739D1 DE 69509739 D1 DE69509739 D1 DE 69509739D1 DE 69509739 T DE69509739 T DE 69509739T DE 69509739 T DE69509739 T DE 69509739T DE 69509739 D1 DE69509739 D1 DE 69509739D1
Authority
DE
Germany
Prior art keywords
electronic component
encapsulated
encapsulating
component
encapsulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69509739T
Other languages
English (en)
Other versions
DE69509739T2 (de
Inventor
Ireneus J T M Pas
Johannes G L Nelissen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3P Licensing BV
Original Assignee
3P Licensing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing BV filed Critical 3P Licensing BV
Application granted granted Critical
Publication of DE69509739D1 publication Critical patent/DE69509739D1/de
Publication of DE69509739T2 publication Critical patent/DE69509739T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Formation Of Insulating Films (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
DE69509739T 1994-12-29 1995-12-27 Verfahren zur Verkapselung von einem elektronischen Bauelement und durch dieses Verfahren verkapseltes elektronisches Bauelement Expired - Fee Related DE69509739T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9402233A NL9402233A (nl) 1994-12-29 1994-12-29 Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.

Publications (2)

Publication Number Publication Date
DE69509739D1 true DE69509739D1 (de) 1999-06-24
DE69509739T2 DE69509739T2 (de) 1999-10-21

Family

ID=19865082

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69509739T Expired - Fee Related DE69509739T2 (de) 1994-12-29 1995-12-27 Verfahren zur Verkapselung von einem elektronischen Bauelement und durch dieses Verfahren verkapseltes elektronisches Bauelement

Country Status (14)

Country Link
US (1) US5895620A (de)
EP (1) EP0720901B1 (de)
JP (1) JP3126104B2 (de)
KR (1) KR960026681A (de)
AT (1) ATE180201T1 (de)
CA (1) CA2166043A1 (de)
DE (1) DE69509739T2 (de)
ES (1) ES2133662T3 (de)
MX (1) MX9600185A (de)
MY (1) MY131688A (de)
NL (1) NL9402233A (de)
RU (1) RU2151447C1 (de)
SG (1) SG35053A1 (de)
TW (1) TW312843B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2768707B1 (fr) * 1997-09-22 1999-10-29 Plastic Omnium Cie Dispositif de transport et/ou de collecte en matiere plastique moulee comportant un dispositif d'identification et procede de fabrication
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US7585443B2 (en) 2004-05-20 2009-09-08 Albemarle Corporation Pelletized brominated anionic styrenic polymers and their preparation and use
US9202770B1 (en) 2014-09-01 2015-12-01 Freescale Semiconductor, Inc. Non-homogeneous molding of packaged semiconductor devices
DE102017219020A1 (de) * 2017-10-25 2019-04-25 Volkswagen Aktiengesellschaft Verfahren zur Herstellung eines fertigen Bauteils umfassend ein Elektronikelement
KR102536941B1 (ko) * 2020-09-28 2023-05-26 한국전자통신연구원 반도체 패키지의 제조 방법
CN113644203B (zh) * 2021-08-09 2024-02-27 天津大学 一种基于热塑性弹性体的有机太阳能电池及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969461A (en) * 1974-02-28 1976-07-13 Western Electric Company, Inc. Transfer molding thermosetting polymeric material
US3911075A (en) * 1974-02-28 1975-10-07 Western Electric Co Transfer molding thermosetting polymeric material
US4327369A (en) * 1979-08-06 1982-04-27 Hi-Tech Industries, Inc. Encapsulating moisture-proof coating
US4359831A (en) * 1980-05-19 1982-11-23 De Lorean Manufacturing Company Reversibly powered rotary snow tiller
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS57158271A (en) * 1981-03-26 1982-09-30 Showa Electric Wire & Cable Co Ltd Film extrusion-coating resin composition
JPS5911360A (ja) * 1982-07-09 1984-01-20 Toray Ind Inc 耐衝撃性熱可塑性樹脂組成物
US4528346A (en) * 1982-09-17 1985-07-09 Dainippun Ink and Chemicals, Inc. Resin composition
FR2545653B1 (fr) * 1983-05-04 1986-06-06 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
EP0151553A3 (de) * 1984-02-03 1987-05-27 Ciba-Geigy Ag Epoxiharz/Polysulfon-Formmassen für gehärtete Produkte mit ausgezeichneter Riss- und Feuchtigkeitsbeständigkeit
JPS6220555A (ja) * 1985-07-18 1987-01-29 Mitsubishi Electric Corp エポキシ樹脂組成物
US4853442A (en) * 1987-04-03 1989-08-01 Hercules Incorporated Amine-terminated polysulfone sulfide, useful as epoxy curing agent
JPS63289016A (ja) * 1987-05-22 1988-11-25 Asahi Glass Co Ltd エポキシ樹脂組成物
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US5364914A (en) * 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US5326516A (en) * 1989-10-03 1994-07-05 Plasticolors, Inc. Method of preparing a cured pigmented thermosetting polymer composition exhibiting improved color values and reduced haze
EP0545973A4 (en) * 1990-08-27 1993-09-15 E.I. Du Pont De Nemours And Company Toughened thermoplastic polyester compositions
DE4140876C2 (de) * 1991-12-11 1994-04-21 Voith Gmbh J M Walzenpresse
US5443775A (en) * 1992-05-08 1995-08-22 Plasticolors, Inc. Process for preparing pigmented thermoplastic polymer compositions and low shrinking thermosetting resin molding composition
DE69323129T2 (de) * 1992-08-11 1999-08-19 Hexcel Corp. Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze

Also Published As

Publication number Publication date
SG35053A1 (en) 1997-02-01
NL9402233A (nl) 1996-08-01
EP0720901A1 (de) 1996-07-10
JP3126104B2 (ja) 2001-01-22
MX9600185A (es) 1997-01-31
ES2133662T3 (es) 1999-09-16
ATE180201T1 (de) 1999-06-15
TW312843B (de) 1997-08-11
DE69509739T2 (de) 1999-10-21
US5895620A (en) 1999-04-20
MY131688A (en) 2007-08-30
CA2166043A1 (en) 1996-06-30
KR960026681A (ko) 1996-07-22
EP0720901B1 (de) 1999-05-19
JPH08274221A (ja) 1996-10-18
RU2151447C1 (ru) 2000-06-20

Similar Documents

Publication Publication Date Title
MY118471A (en) Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method
ATE130351T1 (de) Pulver für imc-beschichtung enthaltend 1,1'-di(t- butylperoxy)-3,3,5-trimethylcyclohexan als initiator.
MY114173A (en) Method for producing semiconductor device
FI955317A (fi) Parannettu menetelmä hartsi-injektiomuovauksen toteuttamiseksi
ATE26896T1 (de) Verfahren und system zum einkapseln elektronischer bauteile in kunststoff.
ATE180201T1 (de) Verfahren zur verkapselung von einem elektronischen bauelement und durch dieses verfahren verkapseltes elektronisches bauelement
ES2003724A6 (es) Metodo para producir una goma de silicona y un compuesto de resina termoplastica
EP0982111A3 (de) Einrichtung und Verfahren zum Vergiessen elektrischer Schaltungen mittels Spritzguss
EP0224064A3 (de) Verfahren zur Herstellung von Bauteilen aus faserverstärkten Thermoplasten
DE19841498A1 (de) Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
EP0831564A3 (de) Herstellungsverfahren eines Kunststoffspritzgussbauteils mit Anschlüssen
ATE215412T1 (de) Verfahren und vorrichtung zum herstellen einer hohlwelle mit äusseren radialen erhebungen durch innenhochdruck-umformung
NL1000621C2 (en) Encapsulation of electronic components, e.g. integrated circuits
JPS56114589A (en) Manufacture of metallic product with hole
KR900006090A (ko) 제품을 캡슐화하는 방법
ATE152033T1 (de) Verfahren zur herstellung von im wesentlichen hohlzylinderförmigen giesslingen und im wesentlichen hohlzylinderförmiger giessling
TH21709A (th) ขบวนการที่มีการปรับปรุงสำหรับการขึ้นรูปที่ใช้สำหรับการหุ้มสารกึ่งตัวนำ
JPS5624111A (en) Trimming method for molding
JPS57145567A (en) Manufacture of coil by casting
ATE69908T1 (de) Elektrisches bauelement in chip-bauweise und verfahren zu seiner herstellung.
IT1246390B (it) Metodo per la fusione di un pezzo metallico comprendente parti in sottosquadro, con anima monolitica ottenuta in piu' fasi.
JPS5784152A (en) Semiconductor device
JPS5763236A (en) Molding metal mold
Bruhns Constitutive Modeling of the Inelastic Behavior of Austenitic Steel
JPS6422511A (en) Molding method

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee