NL1000621C2 - Encapsulation of electronic components, e.g. integrated circuits - Google Patents

Encapsulation of electronic components, e.g. integrated circuits

Info

Publication number
NL1000621C2
NL1000621C2 NL1000621A NL1000621A NL1000621C2 NL 1000621 C2 NL1000621 C2 NL 1000621C2 NL 1000621 A NL1000621 A NL 1000621A NL 1000621 A NL1000621 A NL 1000621A NL 1000621 C2 NL1000621 C2 NL 1000621C2
Authority
NL
Netherlands
Prior art keywords
halves
electronic components
spaces
encapsulation
matrix
Prior art date
Application number
NL1000621A
Other languages
Dutch (nl)
Inventor
Ireneus Johannes Theodorus Pas
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Priority to NL1000621A priority Critical patent/NL1000621C2/en
Application granted granted Critical
Publication of NL1000621C2 publication Critical patent/NL1000621C2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A matrix, partic. for encapsulating electronic components with a hardenable material, contains at least two halves (2,3) with loosely coupled parts (9,10), defining at least one space (11). One of the halves contains a feed (4) for the encapsulating material which is supplied to the spaces by cut-outs in the loose parts. Also claimed are the main matrix halves, the loose parts and/or a combination of these to be used in the matrix described above. Also claimed is the method for encapsulating electronic components with the matrix described above, whereby the two halves are sepd., an amt. of hardenable material is placed in the feed and the components in the spaces. The halves are then brought together, the material pressed into the spaces and, after hardening, the halves are again sepd. and the encapsulated components removed.
NL1000621A 1995-06-21 1995-06-21 Encapsulation of electronic components, e.g. integrated circuits NL1000621C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL1000621A NL1000621C2 (en) 1995-06-21 1995-06-21 Encapsulation of electronic components, e.g. integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1000621A NL1000621C2 (en) 1995-06-21 1995-06-21 Encapsulation of electronic components, e.g. integrated circuits

Publications (1)

Publication Number Publication Date
NL1000621C2 true NL1000621C2 (en) 1996-12-24

Family

ID=19761197

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1000621A NL1000621C2 (en) 1995-06-21 1995-06-21 Encapsulation of electronic components, e.g. integrated circuits

Country Status (1)

Country Link
NL (1) NL1000621C2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1010567C2 (en) * 1998-11-16 2000-05-17 3P Licensing Bv Machine for packaging integrated circuits and other electronic components as micropellets in ball-grid arrays uses balanced fill encapsulation method
NL1011392C2 (en) * 1999-02-25 2000-08-28 3P Licensing Bv Mould tool for encapsulating electronic components, especially integrated circuits, contains replaceable product dependent mould cavity material sections

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2554378A (en) * 1947-11-29 1951-05-22 Gen Motors Corp Mold assembly
JPS61139036A (en) * 1984-12-11 1986-06-26 Sumitomo Electric Ind Ltd Apparatus for injecting resin into resin-sealed electronic part
GB2189182A (en) * 1986-04-11 1987-10-21 Michio Osada Multiple plunger injection moulding apparatus
US4767302A (en) * 1986-09-26 1988-08-30 Yazaki Corporation Exchangeable multiplunger transfer molding die apparatus
JPH0671686A (en) * 1992-08-28 1994-03-15 Fujitsu Miyagi Electron:Kk Molding resin sealing device
JPH0714866A (en) * 1993-06-23 1995-01-17 Hitachi Ltd Resin sealing equipment for semiconductor
JPH0716879A (en) * 1993-06-02 1995-01-20 M Tex Matsumura Kk Molding die for electronic component
JPH105814A (en) * 1996-06-21 1998-01-13 Ishikawajima Harima Heavy Ind Co Ltd Edging press

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2554378A (en) * 1947-11-29 1951-05-22 Gen Motors Corp Mold assembly
JPS61139036A (en) * 1984-12-11 1986-06-26 Sumitomo Electric Ind Ltd Apparatus for injecting resin into resin-sealed electronic part
GB2189182A (en) * 1986-04-11 1987-10-21 Michio Osada Multiple plunger injection moulding apparatus
US4767302A (en) * 1986-09-26 1988-08-30 Yazaki Corporation Exchangeable multiplunger transfer molding die apparatus
JPH0671686A (en) * 1992-08-28 1994-03-15 Fujitsu Miyagi Electron:Kk Molding resin sealing device
JPH0716879A (en) * 1993-06-02 1995-01-20 M Tex Matsumura Kk Molding die for electronic component
JPH0714866A (en) * 1993-06-23 1995-01-17 Hitachi Ltd Resin sealing equipment for semiconductor
JPH105814A (en) * 1996-06-21 1998-01-13 Ishikawajima Harima Heavy Ind Co Ltd Edging press

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 10, no. 332 (E - 453)<2388> 12 November 1986 (1986-11-12) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 177 (M - 818)<3525> 26 April 1989 (1989-04-26) *
PATENT ABSTRACTS OF JAPAN vol. 18, no. 317 (M - 1622) 16 June 1994 (1994-06-16) *
PATENT ABSTRACTS OF JAPAN vol. 95, no. 4 31 May 1995 (1995-05-31) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1010567C2 (en) * 1998-11-16 2000-05-17 3P Licensing Bv Machine for packaging integrated circuits and other electronic components as micropellets in ball-grid arrays uses balanced fill encapsulation method
NL1011392C2 (en) * 1999-02-25 2000-08-28 3P Licensing Bv Mould tool for encapsulating electronic components, especially integrated circuits, contains replaceable product dependent mould cavity material sections

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Effective date: 20000101