JPS61139036A - Apparatus for injecting resin into resin-sealed electronic part - Google Patents

Abstract

PURPOSE:To enable a variety of products to be produced even in a small quantity without loosing the advantages of the transfer molding process, by constructing cavity parts so as to be mounted removably for obviating the need of exchanging basic molds. CONSTITUTION:Four runners 15 are extended from a resin injecting portion 14 disposed at the center and each runner is provided, on and around both sides thereof, with recesses 16 for receiving cavity parts. The cavity parts are respectively provided with cavities having different configurations, according to production ratios of various packages to be produced, and these cavity parts are removably mounted in the recesses 16. The lower mold is thus constructed so that each cavity part 17-20 can be exchanged easily and rapidly, while the upper mold is also constructed in a similar manner. According to such construction, several types of products can be produced in one play only by setting the cavity parts 17-20 in the recesses 16, as required for producing the products in the respective production ratios.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application> The present invention relates to a resin encapsulation device for electronic components such as semiconductor m-sized circuits that are encapsulated with resin by a transfer molding method.

<Prior Art> Transfer molding is usually used in the resin sealing process when molding plastic snack packages such as semiconductor integrated circuits. Figure 5 is a schematic diagram of an example of a transfer molding machine, where 1 and 2 are upper and lower fixed plates, 3 is a support, 4 is a floating plate, 5° and 6 are upper and lower molds that serve as mating molds, The upper mold 5 is attached to the lower part of the fixed plate 1, and the lower mold 6
is attached to the upper part of a floating board 4 that moves up and down using the main pillar 3 as a guide. 7 is a plunger for injecting resin;
8 is a transfer cylinder for actuating this plunger 7; 9
Float! A mold opening/closing cylinder that raises and lowers a lower mold 6 via a glJ board 4. The transfer cylinder 8 and the mold opening/closing cylinder 9 are connected to a hydraulic pump 12 through a transfer valve 10 and a mold opening/closing valve 11, respectively, and are sealed with resin during molding. After loading the cleaving element for stopping, the lower mold 6 is raised by the mold opening/closing cylinder 9 to close the mold, and then the plunger 7 is actuated by the transfer cylinder 8 to inject the resin.

In the case of the transfer molding method as shown in Part B, the resin is injected under pressure into a mold with the element set in the cavity beforehand, so a large amount of elements can be encapsulated at one time. For example, the mold contains 100
~300 cavities are formed.

However, conventionally, these many cavities in one mold are for packages of the same type, so although it is possible to encapsulate a large number of packages at once, only one type of package can be produced.

In addition, the mold itself is usually integrated with the press machine and is quite heavy, so it is extremely troublesome to replace the mold depending on the type of product. Each model is dedicated to one type of machine. Therefore, resin-sealed electronic components that can be produced in large quantities, such as general-purpose I
Suitable for cases like C.

However, for full custom ICs or semi-custom ICs such as gate arrays, the number of package bins and the format vary depending on the user's requirements, and the quantity is often small. For this reason, if you prepare a dedicated machine for each type of machine as mentioned above to handle such cases, the cost will be 99% higher. This configuration is not suitable for high-mix, low-volume production, and the mold cost is quite high. The cost will also increase.

<Problems to be Solved by the Invention> As mentioned above, the present invention requires a dedicated machine equipped with an expensive mold for each type of product, and the number and shape of the bottles are different, and the production is difficult. This method was developed in view of the problem that it is not suitable for resin-sealed electronic components, which cannot be manufactured in large quantities, without sacrificing the advantages of the transfer molding method, such as being able to encapsulate a large amount at one time and requiring a small number of man-hours. It is an object of the present invention to provide a resin enclosing device that can cope with high-mix, low-volume production without causing a significant increase in cost, if necessary.

Means for Solving the Problems In order to achieve the above object, the resin encapsulation device for resin-sealed electronic components according to the present invention is a resin encapsulation device for electronic components that performs four-finger sealing by a transfer molding method. The apparatus is characterized in that a mounting part for mounting the cavity part is provided near the runner formed in the mold body, and a cavity part having a cavity is detachably mounted to this mounting part, and in addition to the above. Furthermore, a jig is attached to the resin injection part of the mold body to temporarily prevent the resin from flowing into some of the runners.

<Example>゛ Embodiments of the present invention will be described below based on the drawings.

FIG. 1 ial is a plan view of the lower mold of the mating molds installed in the press machine, showing the state before the cavity part is set, and FIG. 1 bl shows the state after the cavity part is set. 13 is a mold body, and unlike conventional molds, cavities are not directly formed in the mold. That is,
In the illustrated example, four runners 15 extend from the central resin injection part 14, and recesses 16 are formed near both sides of each runner 15 as mounting parts for mounting the cavity part. A cavity portion in which a cavity of each type is formed is removably attached to each recess 16 according to the production ratio of each package. For example, as shown in FIG. 1 (bl), there are three cavity parts 17 each having a cavity 17a for a 16-bin DIP (dual-in-line package), and two cavity parts 18 each having a cavity 18a for a 40-bin DIP. , 4
One cavity section 19 having a cavity 19a for 0-bin FP, and 2fM cavity sections 20 having a cavity 20a for 64-bin FP are set. FIG. 2 is an enlarged view of the cavity portion 19 in FIG.

When resin-sealing semiconductor integrated circuits, etc., only the mold body 13 as described above is set in a press machine,
Depending on the production ratio of each product, the desired cavity parts 17 to 20 are set in each recess 16 as shown in Fig. 1 fbl, and then normal transfer molding can be performed. You can make products. When the production ratio of each product changes, instead of replacing the mold as in the past, only the cavity part needs to be replaced, making it easy to handle changes in product design.

In this way, since the structure allows only the cavity part to be replaced without changing the mold body 13 and the press machine, the ratio of the number of cavities can be changed depending on the production volume ratio of each product, and The production quantity can be adjusted by unit), and it can also handle high-mix, low-volume production. In addition, there is no need to prepare the entire mold including the base for each type of product, and only the cavity part can be made in advance, and the number of presses is not used as a dedicated machine for each type, so the total production volume is reduced. Initial costs can also be lowered since the minimum number of units required is sufficient. Furthermore, since it is only necessary to remove the cavity part, the work is extremely simple compared to the conventional work of replacing the entire mold, and even if the product type is changed, the effort required for setup is reduced.

Moreover, it is also possible to manufacture one type of product with one machine, as in the past.

In other words, if the same cavity is installed in each concave portion 16, it is possible to produce one product of each type as in the past, and even a special-purpose machine can be used.

Figure 3 shows the case where, as mentioned above, by replacing the cavity part, it is possible to cope with high-mix low-volume production, and in addition, in addition to this, it is also possible to perform iM9 when the production volume itself is not large. This figure shows the structure of the above-described resin injection part 14 of the mold body 13 and an unnecessary part of the runner 15.
A ring-shaped jig 21 is attached thereto to kill. In the illustrated example, the ring-shaped jig 21 is provided with communication ports 22 at three locations that communicate with each runner 15, and the resin is not allowed to flow into one of the four runners 15. It looks like it can't be stopped. Figure 4 (al
and (bl) show other specific examples of the above-mentioned ring-shaped jig 21, in which two runners 15f! (material) are used, and the formation positions of the communication ports 22 are set differently. This is an example in which the ring-shaped jig 21 can be used to stop the flow of resin into some of the runners 15 when the production of bulls is low. It is also possible to adjust the production amount depending on the situation.

<Effects of the Invention> As shown in (A) below, according to the resin-sealing apparatus for resin-sealed IL-type electronic components of the present invention, the cavity part is structured to be detachable without changing the base of the mold. , without sacrificing the advantages of the transfer molding method, it can easily be used for high-mix, low-volume production, and the initial cost is low, requiring little effort to change product types, so there is no significant increase in costs. In addition, we installed a jig in the resin injection part to stop the resin from flowing into some of the lunches, making it easy to make adjustments when the production volume of bulls is low, allowing for high-mix, low-volume production. It has the advantage that it is suitable for the following cases.

[Brief explanation of the drawing]

Figure 1 (al and (bl) are plan views of the state before and after setting the cavity section of the lower mold body, showing an embodiment of the resin-sealing apparatus for resin-sealed electronic components of the present invention; is a partially enlarged perspective view of FIG.
al and tbl are plan views showing other examples of ring-shaped braces,
FIG. 5C is a schematic diagram of an example of a transfer molding machine. In the drawings, 13 is a mold body, 14 is a resin injection part, 15 is a runner, 16 is a recessed part, 17 to 20 are cavity parts, 17a to 20a are cavities, 21 is a ring-shaped jig, and 22 is a communication port.

Claims (2)

[Claims] (1) A resin encapsulation device for electronic components that performs resin encapsulation using a transfer molding method, in which a mounting part for mounting a cavity part is provided near a runner formed in the mold body, and the cavity is mounted in this mounting part. 1. A resin-sealing device for a resin-sealed electronic component, characterized in that a cavity portion having a cavity portion is detachably attached thereto. (2) A resin encapsulating device for electronic components that performs resin encapsulation using a transfer molding method, in which a mounting part for mounting a cavity part is provided near a runner formed in a mold body, and a cavity part is attached to this mounting part. The resin seal is characterized in that a cavity portion having a mold body is removably attached thereto, and a jig is attached to the resin injection portion of the mold body for stopping the flow of resin into some of the runners. Resin encapsulation equipment for static electronic components.