JPH03193427A - Mold for resin sealed type semiconductor device - Google Patents

Abstract

PURPOSE:To demold a molded product from a mold without applying stress by demolding a resin sealed molded product by sending compressed air in upper and lower cavities. CONSTITUTION:In such a state that a semiconductor element 6 is sealed with a resin, upper and lower molds 1, 2 are clamped. When both molds are opened, compressed air 11a is allowed to flow in the air passage 9a provided to the upper mold 1 by a compressed air supply means and a valve 10a is operated upwardly to allow the compressed air 11a to flow in an upper cavity 3. In this state, the lower mold 2 is allowed to fall. By this operation, a package 7 is demolded from the upper cavity 3. Next, compressed air 1b is sent in an air passage 9b to operate a valve 10b downwardly to be allowed to flow in a lower cavity 4. In this state, the demolding of the package 7 from the lower cavity 4 is completed. By this constitution, a molded product can be demolded without applying stress to the semiconductor element and the package.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a mold for a resin-sealed semiconductor device for sealing a semiconductor element.

[Conventional technology]

FIGS. 2(a) to (e) show 4! semiconductor elements. It is a sectional view showing a mold release process of a molded product resin-sealed with a conventional mold die for tWI sealing, and in these figures, 1 and 2 are an upper die and a lower die constituting the mold die. 3 is an upper cavity formed in the upper mold 1; 4 is an upper cavity formed in the upper mold 1;
5a and 5b are the lower cavities formed in the lower mold 2, and 5a and 5b are the cavities 3 of the upper mold 1 and the lower mold 2, respectively.
4, an ejector bin for releasing the resin-sealed package 7 from the mold; 6, a semiconductor element; 7;
8 is a package in which the semiconductor element 6 is sealed with resin, and 8 is a lead frame on which the semiconductor element 6 is mounted.

Next, the operation will be explained.

The semiconductor element 6 mounted on the lead frame 8 is shown in FIG.
-), the upper mold 1 and the lower mold 2 are sealed with resin in a closed state.

The operation of releasing the molded product from the mold is shown in Figure 2 (
As shown in b), first, the lower mold 2 is lowered and at the same time the ejector pin 5a is also lowered to separate the package 7 from the upper cavity 3. In this state, the package 7 and lead frame 8 remain on the lower mold 2. next,
As shown in FIG. 2(C), the package 7 can be separated from the lower cavity 4 by moving the ejector pin 5b provided in the lower mold 2 upward.

[Problem to be solved by the invention]

Since the conventional molding die described above is constructed as described above, stress is not applied to the semiconductor element 6 and the package 7 when the molded product is released from the upper and lower molds 1°2. I was adding it. For this reason, there are problems such as cracking or chipping of the package 7 and further malfunction of the semiconductor element 6.

This invention was made in order to solve the above-mentioned problems, and aims to obtain a molding die that can release a molded product from the mold without applying stress to the semiconductor element and package. purpose.

[Means to solve the problem]

In the mold for a resin-sealed semiconductor device according to the present invention, compressed gas is sent into the upper and lower cavities of the molded product that is resin-filled in the upper and lower cavities formed in the upper and lower molds. The required number of air passages for releasing the mold are formed in the upper and lower molds.

[Effect]

In this invention, by sending compressed air into the cavity of the mold, the resin-sealed molded product can be released from the mold without applying stress to the package.

〔Example〕

An embodiment of the invention of B will be described below with reference to the drawings.

FIGS. 1A to 1C are views showing an embodiment of the present invention, and are cross-sectional views showing steps for releasing a package in which a semiconductor element is sealed with resin using a mold.

In FIG. 1, the same reference numerals as in FIG. 2 indicate the same constituent parts, 9a and 9b are air passages formed in the upper and lower molds 1 and 2, respectively, and 10a and 10b are the same upper and lower molds 1.
, 2 are valves that also serve to prevent resin from flowing out. Also, 11a.

Compressed air 11b is sent into the air passages 9a and 9b, respectively.

Next, the operation will be explained.

As shown in FIG. 1(a), when the semiconductor element 6 is sealed with resin, the upper mold 1 and the lower mold 2 are closed. When opening the mold, as shown in Figure 1(b),
First, compressed air 11a is flowed into the air passage 9a provided in the upper mold 1 from a compressed air supply means (not shown), the valve 10a is operated upward, and the compressed air 11a is flowed into the upper cavity 3. In this state, the lower mold 2 is lowered.

By this operation, the package 7 is released from the upper cavity 3. Next, as shown in FIG. 1(C), the compressed air 11b is sent into the air passage 9b, the valve 10b is operated downward, and the compressed air 11b is flowed into the lower cavity 4. In this state, the mold release of the package 7 and the lower cavity 4 is completed.

Note that in the above embodiment, the upper cavity 3. Although one air passage 9a, 9b is provided in each of the lower cavities 4, the same effect as in the above embodiment can be obtained even if a large number of air passages are provided and compressed air is sent into each air passage.

Further, although compressed air is used in the above embodiment, the same effect is not limited to this, and similar effects can be obtained with compressed gas.

〔Effect of the invention〕

As explained above, the present invention is capable of releasing a molded product sealed with resin in the upper and lower cavities formed in the upper and lower molds by sending compressed gas into the upper and lower cavities. Since the required number of air passages are formed in the upper and lower molds, compressed gas is sent into the upper and lower cavities through these air passages, allowing molding to be performed without adding stress to the paper, semiconductor elements, and packages. The product can be released from the mold. Therefore, it is possible to obtain a resin-sealed semiconductor device without cracking or chipping of the package or malfunction of the semiconductor element.

[Brief explanation of drawings]

FIGS. 1(a) to (C) are cross-sectional views of a mold showing a mold release operation according to an embodiment of the present invention, and FIGS. 2(a) to (C)
) is a sectional view of a mold showing a conventional mold release operation. In the figure, 1 is an upper mold, 2 is a lower mold, 3 is an upper cavity, 4 is a lower cavity, 6 is a semiconductor element, 7 is a package, 8 is a lead frame, 9 a, 9 b are air passages,
10a and 10b are valves, and 11a. 11b is compressed air. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] In a molding die consisting of upper and lower molds for resin-sealing a semiconductor element mounted on a lead frame, the resin-sealed molded product is placed in the upper and lower cavities formed in the upper and lower molds. 1. A mold for a resin-sealed semiconductor device, characterized in that a required number of air passages are formed in the upper and lower molds for sending compressed gas into the upper and lower cavities to release the mold.