JPS63193814A - Mold for transfer molding - Google Patents
Mold for transfer moldingInfo
- Publication number
- JPS63193814A JPS63193814A JP2661787A JP2661787A JPS63193814A JP S63193814 A JPS63193814 A JP S63193814A JP 2661787 A JP2661787 A JP 2661787A JP 2661787 A JP2661787 A JP 2661787A JP S63193814 A JPS63193814 A JP S63193814A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- mold
- valve
- air vent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001721 transfer moulding Methods 0.000 title description 2
- 239000011347 resin Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011800 void material Substances 0.000 abstract 2
- 238000005266 casting Methods 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、トランスファモールド金型に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a transfer mold die.
最近の樹脂モールドの量産化につれて、多数個取り成形
を行うためにトランスファモールド金型内のキャビティ
数が多くなって来た。With the recent mass production of resin molds, the number of cavities in transfer molds has increased in order to perform multi-cavity molding.
第3図は従来のトランスファモールド金型の一例の縦断
面図である。FIG. 3 is a longitudinal sectional view of an example of a conventional transfer mold die.
上金型4と下金型5を組み合わせて形成されたキャビテ
ィ10にリードフレーム8の一つに載置された半導体チ
ップ7を挿入する。A semiconductor chip 7 mounted on one of the lead frames 8 is inserted into a cavity 10 formed by combining the upper mold 4 and the lower mold 5.
キャビティ10に圧入樹脂を注入するランナ6及びゲー
ト9と、キャビティ10の空気の逃げ道のエアベント3
bも同時に形成されている。A runner 6 and a gate 9 for injecting press-fit resin into the cavity 10, and an air vent 3 as an escape route for air from the cavity 10.
b is also formed at the same time.
上述した従来のトランスファモールド金型は、各キャビ
ティ10のエアベント3bが同一寸法で外部に開口され
た状態であり、樹脂圧火元に近いキャビティには、末端
部にあるキャビティよりも、樹脂圧入初期に樹脂量が著
しく多く注入されるため、キャビティの位置によって樹
脂工大条件が不均一となるという問題があった。In the conventional transfer mold mold described above, the air vents 3b of each cavity 10 have the same dimensions and are open to the outside, and the cavities closer to the resin compression source have a higher initial pressure than the cavities at the end. Since a significantly large amount of resin is injected into the cavity, there is a problem in that resin engineering conditions become non-uniform depending on the position of the cavity.
特に樹脂圧火元に近いキャビティは、樹脂が満なされた
後までも末端部のキャビティに樹脂が充満されるまでの
間は保持圧がかからない状態なので成形樹脂の内部にボ
イドやふくれが発生するという問題があった。In particular, cavities close to the resin compression source are in a state where no holding pressure is applied even after the resin is filled until the end cavity is filled with resin, resulting in voids and blisters inside the molded resin. There was a problem.
本発明の目的は、圧入樹脂の初期注入量を均一に調整で
き、品質の良い成形樹脂の得られるトランスファモール
ド金型を提供することにある。An object of the present invention is to provide a transfer molding die that can uniformly adjust the initial injection amount of press-fitting resin and that can produce molded resin of good quality.
本発明のトランスファモールド金型は、(A)注入樹脂
をランナに受けキャビティを通りエアベントに抜ける複
数の樹脂通路が形成されている上下一対の金型、
(B)前記エアベントの少なくとも二つに設けられ、前
記エアベントを通る空気の流量を調整する弁、
を含んで構成されている。The transfer mold mold of the present invention includes (A) a pair of upper and lower molds in which a plurality of resin passages are formed for receiving injected resin in a runner and passing through a cavity and exiting to an air vent; (B) a mold provided in at least two of the air vents; and a valve that adjusts the flow rate of air passing through the air vent.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.
エアベント3aに垂直になるように、弁1とその弁駆動
装置2を上金型4と下金型5に設けた以外は第3図の金
型と同一である。The mold is the same as the mold shown in FIG. 3 except that the valve 1 and its valve driving device 2 are provided in the upper mold 4 and the lower mold 5 so as to be perpendicular to the air vent 3a.
次に、本実施例の動作を説明する。Next, the operation of this embodiment will be explained.
第1図に示すように、上下一対の弁1がリードフレーム
8を挟んで閉じられている場合は、ランナ6aから樹脂
圧入されても、キャビティ10aの空気はエアベント3
aを通って外部に逃げられないので、弁駆動装置2によ
り弁1を上下してエアベント3aを通る空気量を調整す
ることによって、ランナ6aからキャビティ10aに圧
入される樹脂の量を制御できる。As shown in FIG. 1, when the pair of upper and lower valves 1 are closed with the lead frame 8 in between, even if the resin is press-fitted from the runner 6a, the air in the cavity 10a will flow to the air vent 3.
Since the resin cannot escape to the outside through the air vent 3a, the amount of resin press-fitted from the runner 6a into the cavity 10a can be controlled by moving the valve 1 up and down using the valve drive device 2 to adjust the amount of air passing through the air vent 3a.
第2図(a)〜(b)は本実施例を説明するための樹脂
圧入工程順に示した金型の横断面である。FIGS. 2(a) to 2(b) are cross sections of a mold shown in order of resin press-fitting steps to explain this embodiment.
第2図(a)に示すように、樹脂圧入の初期工程では弁
1がエアベント3aを閉じておく。As shown in FIG. 2(a), the valve 1 closes the air vent 3a during the initial step of resin press-fitting.
圧入樹脂が樹脂溜のカル12からランナ6aを通って、
樹脂圧大兄に近いキャビティ10aから順に、末端のキ
ャビティ10bへ樹脂を圧入してゆくが、圧入量のラン
ナ6aから3組迄は、弁1によってエアベント3aが閉
じられているので、注入抵抗が上り樹脂の圧入量が従来
の1/2〜115に制限されるが、末端の2組は第3図
と同一金型なので従来よりも高い圧力でキャビティ10
bに樹脂が圧入される。The press-fit resin passes from the cull 12 of the resin reservoir through the runner 6a,
Resin is press-fitted into the cavities 10b at the end in order from the cavity 10a closest to the resin press-in area, but since the air vents 3a are closed by the valve 1 from the runners 6a to 3, the injection resistance increases. The amount of resin press-in is limited to 1/2 to 115 compared to the conventional one, but since the two sets at the end are the same mold as in Figure 3, the cavity 10 is injected with a higher pressure than the conventional one.
Resin is press-fitted into b.
従って、圧入量のキャビティ10aの樹脂11aと末端
のキャビティ10bの樹脂11bの圧入状芯はほぼ均一
に近づく9
次に、第2図(b)に示すように、末端のキャビティ1
0bに樹脂が圧入された約10秒後に弁1を開いて圧入
量キャビティ10aの空気をエアベント3aを通じて外
部に逃がし、キャビティ1 ’Oaの注入抵抗を下げて
、急速に樹脂圧入を行うが、どのキャビティにも樹脂が
満されて、約10秒の保持圧がかかるために、成形樹脂
の内部ボイドやふくれの発生が無くなる。Therefore, the press-fit cores of the resin 11a in the cavity 10a and the resin 11b in the end cavity 10b become almost uniform.9 Next, as shown in FIG.
Approximately 10 seconds after the resin is press-fitted into Oa, valve 1 is opened to release the air in the press-in cavity 10a to the outside through the air vent 3a, lowering the injection resistance in cavity 1'Oa, and rapidly press-fitting the resin. Since the cavity is also filled with resin and a holding pressure of about 10 seconds is applied, internal voids and bulges in the molded resin are eliminated.
本実施例の弁1は、複数個を同時に開閉作動したが、各
キャビティごとの弁駆動装置2を操作して弁1の開閉の
程度や時間を個別に設定して空気の流量を密に調整する
こともできる。Although a plurality of valves 1 in this embodiment were operated to open and close at the same time, the flow rate of air was precisely adjusted by operating the valve drive device 2 for each cavity to individually set the opening/closing degree and time of the valve 1. You can also.
以上説明したように本発明は、キャビティのエアベント
に弁を設けることにより、各キャビティの圧入樹脂の状
態を均一とすることができ、内部ボイドやふくれの無い
成形樹脂が得られるという効果がある9As explained above, the present invention has the effect that by providing a valve in the air vent of each cavity, the condition of the press-fitted resin in each cavity can be made uniform, and molded resin without internal voids or blisters can be obtained.
第1図は本発明の一実施例の縦断面図、第2図(a)〜
(b)は本実施例を説明するための樹脂圧入工程順に示
した金型の横断面図、第3図は従来のトランスファモー
ルド金型の一例の縦断面図である。
1・・・弁、2・・・弁駆動装置、3a、3b・・・エ
アベント、4・・・上金型、5・・・下金型、6a、6
b・・・ランナ、7・・・半導体チップ、8・・・リー
ドフレーム、9・・・ゲート、10a、10b・・・キ
ャビティ、11a、llb・・・樹脂、12・・・カル
。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2(a)-
(b) is a cross-sectional view of a mold shown in the order of resin press-fitting steps for explaining this embodiment, and FIG. 3 is a vertical cross-sectional view of an example of a conventional transfer mold mold. DESCRIPTION OF SYMBOLS 1... Valve, 2... Valve drive device, 3a, 3b... Air vent, 4... Upper mold, 5... Lower mold, 6a, 6
b...Runner, 7...Semiconductor chip, 8...Lead frame, 9...Gate, 10a, 10b...Cavity, 11a, llb...Resin, 12...Cal.
Claims (1)
ントに抜ける複数の樹脂通路が形成されている上下一対
の金型、 (B)前記エアベントの少なくとも二つに設けられ、前
記エアベントを通る空気の流量を調整する弁、 を含むことを特徴とするトランスファモールド金型。[Scope of Claims] (A) A pair of upper and lower molds in which a plurality of resin passages are formed for receiving injected resin in a runner and passing through a cavity and exiting to an air vent; (B) a mold provided in at least two of the air vents, A transfer mold mold comprising: a valve that adjusts the flow rate of air passing through an air vent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2661787A JPS63193814A (en) | 1987-02-06 | 1987-02-06 | Mold for transfer molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2661787A JPS63193814A (en) | 1987-02-06 | 1987-02-06 | Mold for transfer molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63193814A true JPS63193814A (en) | 1988-08-11 |
JPH0554412B2 JPH0554412B2 (en) | 1993-08-12 |
Family
ID=12198443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2661787A Granted JPS63193814A (en) | 1987-02-06 | 1987-02-06 | Mold for transfer molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63193814A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0684648A3 (en) * | 1994-05-24 | 1995-12-27 | Sharp Kk | |
JP2012200996A (en) * | 2011-03-25 | 2012-10-22 | Nec Corp | Injection molder and injection molding method |
JP2014213573A (en) * | 2013-04-26 | 2014-11-17 | 重夫 関根 | Air vent valve device and injection molding mold |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0728192U (en) * | 1993-10-30 | 1995-05-23 | 木村新株式会社 | Supporting equipment for furniture |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5087166U (en) * | 1973-12-17 | 1975-07-24 | ||
JPS5215564A (en) * | 1975-07-28 | 1977-02-05 | Asahi Dow Ltd | Mold for injection molding of foamed synthetic resin |
-
1987
- 1987-02-06 JP JP2661787A patent/JPS63193814A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5087166U (en) * | 1973-12-17 | 1975-07-24 | ||
JPS5215564A (en) * | 1975-07-28 | 1977-02-05 | Asahi Dow Ltd | Mold for injection molding of foamed synthetic resin |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0684648A3 (en) * | 1994-05-24 | 1995-12-27 | Sharp Kk | |
JP2012200996A (en) * | 2011-03-25 | 2012-10-22 | Nec Corp | Injection molder and injection molding method |
JP2014213573A (en) * | 2013-04-26 | 2014-11-17 | 重夫 関根 | Air vent valve device and injection molding mold |
Also Published As
Publication number | Publication date |
---|---|
JPH0554412B2 (en) | 1993-08-12 |
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