JPH0270409A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To make mold exchange easily at the time of type switchover and increase working efficiency and production efficiency by uniforming the position shape of an ejector pin in a mold used for the mold for resin sealing at the time of resin sealing. CONSTITUTION:A top force 1 and a bottom force 2 are matched together, and resin is injected from a resin injection hole 4 in a chase block 5 to be molded and solidified in the mold of the chase block 5. The, when the top force 1 and the bottom force 2 are opened after the completion of resin sealing, a top force ejector pin 6 and a bottom force ejector pin 7 are sprung out and extruded out of the mold in order to release a resin sealing semiconductor device easily. The top force 1 and the bottom force 2 are disposed in the center of a package in order to allow the fop force ejector pin 6 and the bottom force ejector pin 7 to cover all the types at that time, and the size of the top force ejector pin 6 of the top force 1 should be the same as the size of the marking surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a semiconductor device, and particularly to a mold used for manufacturing a resin molded part.

[Prior Art] FIG. 2 is a plan view of upper and lower molds in a conventional semiconductor device manufacturing method. In the figure, (L) is the upper mold, the part that is called the front of the package, (2) is the lower mold, the part that represents the back of the package, (la), (lb)
, (lc) and (2a) , (2b) , (2
c) is an upper mold eject pin and a lower mold eject pin, which are provided to facilitate the release of the resin-sealed semiconductor device from within the device mold after resin sealing is completed, and
It serves as a stamp for mold cavity numbers, etc.

Next, the operation will be explained. Space (5) inside the mold created by combining the upper mold (1) and lower mold (2) in Figure 2
Inject resin through the resin injection port (4), mold in the mold, and when opening the upper mold (1) and lower mold (2), eject pins (la), (lb), (, 1c) or (2a) )
, (2b) and (2c) to make it easier to extrude and release from the mold.

[Problems to be solved by the invention] Conventional semiconductor device manufacturing methods are completely incompatible with each product type, such as the position of the eject pin being different depending on the product type, and when changing types, it is necessary to replace the mold body. Therefore, there were problems such as poor work efficiency and a reduction in the number of production due to stopping the equipment.

This invention was made to solve the above-mentioned problems, and it not only allows for easy mold replacement when changing types, but also increases production volume by increasing work efficiency, safety, and reducing equipment down time. The purpose of the present invention is to obtain a method for manufacturing a semiconductor device that can perform the following steps.

[Means for Solving the Problems] The method for manufacturing a semiconductor device according to the present invention unifies the position and shape of eject pins in a mold that serves as a mold when performing resin encapsulation. This makes it possible to switch types by simply replacing the .

[Function] The mold according to the present invention unifies the position and shape of the eject pin when releasing the resin-sealed semiconductor device from the mold, thereby making it possible to change types by replacing only the chase block, improving work efficiency. Not only this, but the lighter weight of the replaceable type also ensures greater safety during work than before.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
In the figure, (1) is the upper mold, (2) is the lower mold, and (3) is the mold body. The resin is injected into the chase block (5) and molded into the mold. (6) is an upper mold eject pin, (7) is a lower mold eject pin, and the resin-sealed semiconductor device is extruded from the mold by these eject pins (6) and (7).

Next, the operation will be explained. In Figure 1, the upper mold (1
) and the lower mold (2), and put the chase block (5) together.
Resin is injected from the resin injection port (4) inside, and is molded and hardened in the mold of the chase block (5). After resin sealing is completed, when the upper mold (1) and lower mold (2) are unsealed, the upper mold eject pin (6) and the lower mold eject pin are used to make it easier to release the resin-sealed semiconductor device from the mold. The pin (7) is extruded from the pop-out die. At this time, the upper mold eject pin (6) and the lower mold eject pin (7) are connected to the upper mold (S) and lower mold (S) in order to be compatible with all types.
Both are placed in the center of the package, but the upper mold (1)
Regarding this, it is necessary to make the size of the upper mold eject pin (6) equal to the size of the marking surface.

[Effects of the Invention] As described above, according to the present invention, the position and dimensions of the eject pin in the mold are configured to match the center of the package or the marking surface. It only requires one thing, and unification can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a t-plane view of upper and lower molds in an embodiment of the present invention, and FIG. 2 is a plan view of the upper mold in a conventional semiconductor device manufacturing method. In the figure, (ri is the upper mold, (2) is the lower mold, (3) is the mold body, (4) is the resin injection port, (5) is the chase block, (6) is the upper mold eject pin, ( 7) is the lower eject pin. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A semiconductor device characterized in that a mold having an eject pin standardized for all types is used in a molding process for resin-sealing a chip that performs a central function as a semiconductor mounted on a metal lead frame. Production method.