JPH056094Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] This invention relates to the improvement of a mold for resin encapsulation molding, for example, for encapsulating electronic components such as ICs, diodes, and capacitors with resin materials. It is something.

[Conventional technology]

2. Description of the Related Art Conventionally, transfer molding molds have been used to seal and mold electronic components with thermosetting resin materials and the like.

The mold usually includes a fixed upper mold, a movable lower mold placed opposite the upper mold, and a cavity for resin-sealing electronic components placed opposite the PL (parting line) surfaces of both molds. , a pot for supplying resin material disposed on either side of the two molds, a plunger for pressurizing the resin material fitted into the pot, and a car that communicates between the pot and both the upper and lower cavities.・Equipped with a passageway for transferring molten resin material consisting of runners and gates.

Resin-sealing molding of electronic components using such a molding die is performed, for example, as follows.

First, when opening the molds of both molds, the lead frame etc. on which electronic components are mounted is fitted into the predetermined position of the setting groove formed on the PL surface of the lower mold, and in this state, the lower mold is moved upward to open both molds. Clamp the mold.

Next, a resin material is supplied into the pot, and
The resin material is heated by heaters provided in both molds and pressurized by plungers, so that the molten resin material is injected and filled into both the upper and lower cavities from the pot through a transfer passage.

Next, after the required cure time, both molds are opened again, and the lead frames set on the PL surfaces of both molds are released using upper and lower ejector pins. At this time, the cured resin molded bodies (mold packages) in both cavities that seal the electronic components and the cured resin molded bodies in the transfer passage are to be released from the molds at the same time as the lead frame is released. become.

[Problem that the invention attempts to solve]

By the way, in the above-mentioned conventional molds or resin encapsulation molding equipment equipped with the same, for example, there is a trend toward smaller package shapes for electronic components to be encapsulated, continuous automation of each resin molding process, etc. At the same time, the overall structure and configuration of the molding equipment, etc. has become more complex and more precise.
Therefore, the following problems have been pointed out.

In other words, if there is any difficulty in handling the operation, maintenance, inspection, etc. of the molding equipment, etc., or if a problem occurs in any one of the continuous automated molding processes, this may cause problems in other molding processes. There are problems such as causing new molding defects in the process.

For example, after resin encapsulation molding of the electronic components mentioned above, resin burrs and other foreign matter tend to remain on the PL surface of both molds, so cleaning is performed to remove foreign matter from the PL surface every time the resin molding process is completed. However, if this process is incomplete, it will cause serious problems in resin molding, such as the inability to efficiently perform the mold clamping process for both molds, the transfer process of molten resin material, etc. will occur.

Furthermore, in order to efficiently produce resin-sealed molded electronic components, it is necessary to continuously automate each resin molding process. However, this is based on the premise that each resin molding process is performed reliably, so in order to achieve high efficiency production of this type of product, for example, each resin molding process must be performed reliably. There is a need to individually arrange various detection mechanisms to confirm whether or not this is being done. Therefore, the current situation is that the overall structure and configuration of the mold or the resin encapsulation molding device equipped with the mold is becoming more complex and highly precise, which leads to economical problems such as higher costs. There is a problem.

The present invention aims at simplifying the overall structure of a mold for resin encapsulation molding, thereby simplifying its handling, and by configuring the mold structure into a simple split mold for resin molding on its PL surface. Easily and reliably performs the cleaning process to remove residual foreign matter inside the cavity and the transfer path for molten resin material, and also facilitates and reliably releases (protrudes) the cured resin inside the cavity and transfer path. By doing so, the purpose is to reliably solve the conventional problems as described above.

[Means for solving problems]

In order to solve the above-mentioned conventional problems, the mold for resin-sealing electronic components according to the present invention includes a fixed side template (upper template 3) and a movable side opposite to the fixed template. It is composed of a template (lower template 6), and an intermediate template (middle template 7) that is removably fitted to both the templates 3 and 6 of the fixed template and the movable template. , one plane part 8 ₁ and side wall surface part 8 ₂ constituting the cavity 8 are formed on the template 3 on one side of the fixed template 3 and the movable template 6, and the intermediate template 7 is provided with the above-mentioned one. The other cavity side wall portion 10 1 is formed to communicate with the cavity side wall portion 8 ₂ of one side, and the mold plate 6 on the other side is formed with a cavity side wall portion 10 ₁ that communicates with the cavity side wall portion 10 ₁ of the intermediate mold plate 7. This is characterized in that a flat portion ₁₇₁ of the cavity 10 is formed.

Further, the resin sealing mold according to the present invention includes a fixed side template (upper template 3), a movable side template (lower template 6) provided opposite to the fixed template 3, It is composed of an intermediate mold plate (middle mold plate 7) that is removably fitted to both the mold plates 3 and 6 of the fixed mold plate and the movable mold plate, and the fixed mold plate 3 and the movable mold plate 6 One plane part 8 ₁ and side wall part 8 ₂ constituting the cavity 8 are formed on one side of the template 3, and
The side wall surface portion 1 of the other cavity communicates with the side wall surface portion 8 ₂ of the one cavity in the intermediate template 7.
0 ₁ and the side wall surface portion 10 ₁ to form a fitting recess 16 that communicates with the opening, and a projection that is fitted into the fitting recess 16 of the intermediate template 7 in either of the templates 6 on the other side. The projecting body 17 is characterized in that the protruding body 17 is formed with the other cavity plane portion 17 ₁ that communicates with the cavity side wall surface portion 10 ₁ of the intermediate mold plate 7.

Further, the resin sealing mold according to the present invention is characterized in that a hole 14 ₃ for protruding the cured resin molded body 24 is formed in the passage 14 for transferring the molten resin material described above. It is.

[Effect]

The mold according to the present invention is a simple divided mold consisting of three mold plates: a fixed mold plate 3, a movable mold plate 6, and an intermediate mold plate 7 that is removably fitted to both the mold plates 3 and 6. The resin molding cavities 8 and 10 and the passage 14 for transporting the molten resin material communicating with the cavities can each be configured by a fitting combination of these three mold plates. .

In addition, the combination of molds using the three mold plates described above is
This can be done automatically and reliably at the time of mold clamping.

Therefore, the overall configuration of the mold for resin sealing molding or the molding device equipped with the same can be simplified, and since the structure of the mold is a simple split type, the resin on the PL surface of the mold can be simplified. Inside molding cavities 8 and 10 and passage 14 for transferring molten resin material
It is possible to easily and reliably carry out a cleaning process to remove residual foreign matter inside the cavity, and furthermore, to easily and reliably perform the mold release function of the cured resin molded body in the cavity and the transfer passage.

〔Example〕

Next, the present invention will be explained based on embodiment figures.

FIG. 1 shows the main parts of a resin encapsulation molding apparatus equipped with a molding die according to the present invention, and FIG.
The main parts of the molding die are shown.

The resin sealing molding device includes an upper mold plate (fixed mold plate) fixed to an upper mold plate mounting base 2 on the side of an upper fixed platen 1.
3, a lower mold plate (movable mold plate) 6 fixed to the lower mold plate mounting base 5 on the lower movable platen 4 side, and a lower mold plate (movable mold plate) 6 that is removably fitted to both the upper and lower mold plates 3 and 6. It consists of three templates: medium-sized plate (intermediate template) 7.

Further, on the PL surface of the upper mold plate 3, there are holes 9 for engagement with the flat portion 8 ₁ and the side wall surface portion 8 ₂ of the upper cavity 8, and a positioning set pin 13 of the lead frame 11, which will be described later. It is formed.

Further, the above-mentioned medium-sized plate 7 includes a side wall surface portion 10 ₁ of the lower cavity 10 that communicates with the side wall surface portion 8 ₂ of the upper cavity 8, and an upper portion PL of the lower cavity 10.
Groove 1 for setting lead frame 11 provided on the surface
2, a set pin 13 for positioning the lead frame 11 standing in the setting groove 12, and a passage 14 for transferring the molten resin material consisting of a cull (not shown), a runner ₁₄₁ , and a gate ₁₄₂ . has been done. Furthermore, holes 14 ₃ are provided in the lower surface of the transfer passageway 14 at required locations, which are penetrated in the vertical direction.

Further, both the cavities 8 and 10 of the upper mold plate 3 and the middle mold plate 7 described above have a depth necessary for resin-sealing the electronic components 15 (and other parts to be sealed) on the lead frame 11. is formed.

Furthermore, a fitting recess 16 is formed in the lower surface of the side wall surface portion 10 ₁ of the medium plate 7 described above, and is connected to the side of the lower mold plate 6 that communicates with the side wall surface portion 10 ₁ .

Further, the PL surface of the lower mold plate 6 described above is formed in a shape corresponding to the lower PL surface of the middle mold plate 7. That is, the lower mold plate 6 includes the middle mold plate 7.
A protrusion 17 for fitting into the fitting recess 16 in the same, and a joint surface 18 for joining to the lower surface hole 14 ₃ in the transfer passage 14.
etc. are formed respectively. In addition, the protrusion 17
When fitted into the fitting recess 16 of the medium-sized plate 7, the upper surface portion (plane portion) 17 ₁ of the protrusion 17 is in continuous communication with the side wall surface portion 10 ₁ of the lower cavity 10 of the medium-sized plate 7 described above. It is provided so as to constitute the lower surface portion of the lower cavity.

Further, between the middle plate 7 and the lower plate 6, there is provided fitting means 19 for auxiliary positioning of the two, if necessary.

Further, pots 20 for supplying resin material are arranged on the upper mold plate mounting base 2, and furthermore, plungers 21 for pressurizing the resin material in the pots 20 are respectively arranged on the upper fixed platen 1. It is arranged.

Hereinafter, a case will be described in which the electronic component 15 on the lead frame 11 is molded with resin in the configuration of the above-described embodiment.

First, when opening the mold (each template) shown in FIG. 7, setting groove 1
2 to fit and set. At this time, the lead frame 11 is set at a predetermined position via the positioning set pin 13 provided upright in the groove 12.

Next, the medium plate 7, on which the required number of lead frames 11 are fitted and set, is fitted onto the upper surface of the lower plate 6 (see FIG. 2). This fitting between the two is performed by joining and integrating the lower PL surface of the middle plate 7 and the PL surface of the lower plate 6. In addition, at this time, the lower fitting recess 16 of the former and the protrusion 17 of the latter
At the same time, the lower surface hole 14 ₃ in the transfer passage of the former and the joint surface 18 of the latter are joined. Further, since the two are reliably integrated in the above-mentioned fitted/connected state, the above-described positioning fitting means 19 is not necessarily required, but when the fitting means 19 is used together, for example,
There are advantages such as the ability to utilize the guiding action when the two are fitted and joined, or the function of maintaining the fitted and joined state of the two.

Next, in the above-described state, the lower movable platen 4 is moved upward to perform mold clamping (FIG. 2) for joining the upper PL surface of the middle mold plate 7 and the PL surface of the upper mold plate 3.
At this time, the positioning set pins 13 of the middle plate 7 are fitted into the holes 9 of the upper plate 3, and the electronic components 15 (and other sealed parts) on the lead frame 11 are It is inserted into a predetermined position in both upper and lower cavities 8 and 10 constituted by templates 3, 7, and 6.

Next, a resin material is supplied into the pot 20, and this is heated and melted by heaters (not shown) provided on both the upper and lower mold plates, etc., and when this is pressurized by the plunger 21, the molten resin is The material is injected into the upper and lower cavities 8, 10 from the pot 20 through the transfer passage 14, and the electronic components 15 and the like on the lead frame 11 set in the cavities 8, 10 are sealed.

Next, after a required cure time, the lower movable platen 4 is moved down to separate the middle plate 7 and the upper die plate 3 and open the molds. At this time, the resin molded body 22 hardened in the cavity 8 of the upper mold plate 3 is taken out downward via the lead frame 11 etc. that are locked to the middle mold plate 7, as shown in FIG. Therefore, it is easily released from the mold. Further, when the lower movable platen 4 is moved downward in this manner, the middle plate 7 can be removed from the lower plate 6 by the reverse procedure to the above-mentioned procedure.
Both the mold plate 6 and the lower mold plate 6 can be opened. Therefore, the middle plate 7 can be easily separated and removed from between the upper and lower mold plates 3 and 6 with the lead frame 11 etc. attached thereto after resin seal molding.

As described above, the upper and lower middle mold plates 7 that are separated and removed from between the upper and lower mold plates 3 and 6 include the lead frame 11 after resin sealing molding and the resin molding that has been cured within the cavity 10 of the middle mold plate 7. The body 23 and the hardened resin molded body 24 are installed in the transport passages 14 (14 ₁ to 14 ₃ ), but these things are
Ejector member 2 as shown by the chain line in FIG.
5 or the like, the mold can be easily released from the medium plate 7.

That is, on the upper surface of this ejector member 25,
an ejector pin 25 ₁ that fits into the lower cavity 10 (side wall surface portion 10 ₁ ) from the fitting recess 16 of the medium plate 7 and projects the cured resin molded body 23 in the lower cavity upward; Ejector pins 25 ₂ and the like are provided, respectively, for fitting into the ejection holes 14 ₃ of the medium-sized plate and ejecting the cured resin moldings 24 in the holes upward. Therefore, the medium-sized plate 7 is placed on the upper surface of the ejector member 25 installed on a table or the like, and the fitting recess 16 and the protrusion hole 14 ₃ are connected to the ejector of the ejector member 25. Pin 25 ₁ , 25 ₂
Align the position with the middle plate 7, and in that state,
By pressing down, the lead frame 11 attached to the medium plate and the cavity 1 are removed.
As schematically illustrated in FIG. 3, the cured resin molded body 23 in the transfer passage 14 and the cured resin molded body 24 in the transfer passage 14 can be easily released.

When the resin molding process described above is completed, and before starting the next process, a cleaning process is carried out to remove foreign matter remaining on the surface of the mold (each template 3, 7, 6) as described above. It will be done.

This cleaning process is usually performed by manual means or by mechanical means using devices equipped with brush members, but each of the templates 3,
Since the molds 7 and 6 can be separated individually when the mold is opened, the cleaning process for each mold plate surface can be carried out efficiently, reliably, and easily.

In addition, cavities 8 and 1 are made up of a pot 20 and three mold plates: an upper mold plate 3, a middle mold plate 7, and a lower mold plate 6.
The transfer passage 14 disposed between the transfer passage 14 and the transfer passage 14 may be formed on any PL surface of the three template plates, and therefore, for example, as shown in FIG. It is also possible to adopt a configuration in which the passage 14 is arranged on the PL surface of both the upper mold plate 3 and the middle mold plate 7. In this case, a normal ejector pin 26 is attached to the runner section in the passage.
It is possible to adopt a configuration in which

Further, as described above, by providing the fitting means 19 for positioning between the middle plate 7 and the lower plate 6, the two die plates 7 and 6 can be surely integrated. When adopting a configuration that allows for
Each can be configured as a smooth surface. Therefore, in this case, the fitting recess 16 of the medium-sized plate described above
Since the formation of the protrusion 17 on the lower mold plate can be omitted,
There are advantages in that the structure of each template can be further simplified and the cleaning process for both templates can be performed more efficiently.

The present invention is not limited to the above-mentioned embodiments, and other configurations may be arbitrarily changed or selected as necessary without departing from the spirit of the present invention. It is possible.

For example, in each of the above embodiments, the molten resin material transfer passage 1 consisting of the cull runner gate
4, but from this transfer passage the runner 14 ₁
There is no problem in adopting a runnerless type configuration in which . In this case, a multi-plunger type configuration including a plurality of required pots and plungers can be adopted.

In addition, in each of the above embodiment figures, the pot 20
Although a configuration is shown in which the plunger 21 is disposed on the upper mold plate 3 side, it is also possible to have the opposite configuration in which the plunger 21 is disposed on the lower mold plate 6 side.

Further, although the auxiliary positioning fitting means 19 provided between the middle plate 7 and the lower plate 6 is not necessarily required as described above, the same type of positioning fitting means 19 is provided between the middle plate 7 and the lower plate 6. For example, a configuration may be adopted in which it is disposed between both the middle plate 7 and the upper plate 3, or between all three of these plates.

Further, as mentioned above, the protrusion 17 of the lower mold plate may be provided so as to constitute the lower surface part of the lower cavity 10 of the middle mold plate, which is continuous with the side wall surface part 10 ₁ of the lower cavity 10 of the middle mold plate. For example, when the fitting recesses 16 in the medium-sized plate 7 are formed individually corresponding to the lower cavities 10,
The protrusion 17 may be formed in a corresponding protrusion shape, and if the fitting recess 16 is formed as a continuous groove along the arrangement direction of the lower cavity 10, the above-mentioned The protrusion 17 may be formed in a corresponding protrusion shape.

In addition, the arrangement of the three mold plates, the upper mold plate 3, the middle mold plate 7, and the lower mold plate 6, is changed, for example, to an arrangement in which they are upside down from the layout shown in the embodiment drawings. The arrangement position can be selected arbitrarily.

In addition, the arrangement of these three templates is as follows:
For example, it may be used by disposing them in the left and right horizontal directions.

Further, it is also possible to arbitrarily select which of the upper mold plate and the lower mold plate should be the fixed side or the movable side.

[Effect of idea]

According to the configuration of the present invention, it is possible to simplify the overall configuration of a mold for resin sealing molding or a molding apparatus equipped with the same, and to facilitate the handling thereof.

In addition, by configuring the mold structure as a simple split type, the cleaning process for removing residual foreign matter from the resin molding cavity and the molten resin material transfer passage on the PL surface can be easily and reliably performed. can be achieved.

In addition, it is possible to easily and reliably release the cured resin molded product in the cavity and the transfer passage, which is an excellent practical solution that can reliably solve the conventional problems mentioned above. It has the following effects.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway front view showing the main parts of a resin encapsulation molding apparatus equipped with a mold according to the present invention. FIG. 2 is a partially cutaway longitudinal sectional front view showing the main parts of the mold according to the present invention, and shows the mold in a clamped state. FIG. 3 is an explanatory diagram of the resin molding action using the mold according to the present invention and the mold release action of the cured resin molded product, showing the open state of the main part of the mold and the release of the cured resin molded product. This is a schematic representation of the type state. Fourth
The figure shows another embodiment of the mold according to the present invention, and is a partially cutaway longitudinal sectional front view of the main part of the mold. Explanation of symbols, 1...Upper fixed plate, 2...Upper template mounting base, 3...Upper template (fixed template), 4...
...Lower movable plate, 5...Base for mounting lower mold plate, 6...
...Lower template (movable template), 7...Middle template (intermediate template), 8...Upper cavity, 8 ₁ ...Plane part, 8 ₂
. . . side wall surface portion, 9 _. Transfer passage, 14 ₁ ...
...Runner, 14 ₂ ...Gate, 14 ₃ ...Hole, 1
5...Electronic component, 16...Fitting recess, 17...Protrusion, 17 ₁ ...Top surface part (plane part), 18...Joint surface, 19...Fitting means for positioning, 20... Pot, 21...Plunger, 22...Resin molded body,
23...Resin molded body, 24...Resin molded body, 25
... Ejector member, 25 ₁ ... Ejector pin, 25 ₂ ... Ejector pin, 26 ... Ejector pin.

Claims (1)

[Scope of Claim for Utility Model Registration] (1) A template on the fixed side, a template on the movable side installed opposite to the fixed template, and a device that can be attached to and removed from both the template surfaces of the fixed template and the movable template. an intermediate template that can be fitted freely, and one plane part and a side wall part that constitute a cavity are formed on one template of either the fixed template or the movable template; The intermediate mold plate is formed with another cavity side wall portion that communicates with the one cavity side wall portion, and the other mold plate is formed with another cavity flat portion that communicates with the cavity side wall portion of the intermediate mold plate. A mold for resin-sealing molding of electronic components, characterized in that the mold is configured by forming. (2) A template on the fixed side, a template on the movable side opposite to the fixed template, and an intermediate template that is detachably fitted to both the template surfaces of the fixed template and the movable template. and one plane part and side wall surface part constituting a cavity are formed on one template of the fixed template and the movable template, and one of the cavities is formed on the intermediate template. Forming a fitting recess with a communication opening in the other side wall surface of the cavity that communicates with the side wall surface, and fitting the mold plate on the other side into the fitting recess of the intermediate template. A mold for resin-sealing an electronic component, characterized in that a protrusion is formed therein, and the protrusion is formed with another cavity plane portion that communicates with the cavity side wall surface portion of the intermediate template. . (3) The mold for resin-sealing electronic components according to claim (1) or claim (2), wherein a hole for protruding the cured resin molded body is formed in the passage for transferring the molten resin material.