ATE26896T1 - Verfahren und system zum einkapseln elektronischer bauteile in kunststoff. - Google Patents

Verfahren und system zum einkapseln elektronischer bauteile in kunststoff.

Info

Publication number
ATE26896T1
ATE26896T1 AT83201115T AT83201115T ATE26896T1 AT E26896 T1 ATE26896 T1 AT E26896T1 AT 83201115 T AT83201115 T AT 83201115T AT 83201115 T AT83201115 T AT 83201115T AT E26896 T1 ATE26896 T1 AT E26896T1
Authority
AT
Austria
Prior art keywords
electronic components
plastic
encasting
mould
strip
Prior art date
Application number
AT83201115T
Other languages
English (en)
Inventor
Everardus Hendrikus Boschman
Original Assignee
Arbo Handel Ontwikkeling
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arbo Handel Ontwikkeling filed Critical Arbo Handel Ontwikkeling
Application granted granted Critical
Publication of ATE26896T1 publication Critical patent/ATE26896T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
AT83201115T 1982-08-19 1983-07-27 Verfahren und system zum einkapseln elektronischer bauteile in kunststoff. ATE26896T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8203253A NL8203253A (nl) 1982-08-19 1982-08-19 Werkwijze en inrichting voor het met kunststof omhullen van elektronische componenten.
EP83201115A EP0101630B1 (de) 1982-08-19 1983-07-27 Verfahren und System zum Einkapseln elektronischer Bauteile in Kunststoff

Publications (1)

Publication Number Publication Date
ATE26896T1 true ATE26896T1 (de) 1987-05-15

Family

ID=19840156

Family Applications (1)

Application Number Title Priority Date Filing Date
AT83201115T ATE26896T1 (de) 1982-08-19 1983-07-27 Verfahren und system zum einkapseln elektronischer bauteile in kunststoff.

Country Status (6)

Country Link
US (1) US4653993A (de)
EP (1) EP0101630B1 (de)
JP (1) JPS5952842A (de)
AT (1) ATE26896T1 (de)
DE (1) DE3371263D1 (de)
NL (1) NL8203253A (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8501393A (nl) * 1985-05-14 1986-12-01 Arbo Handel Ontwikkeling Inrichting voor het tegelijkertijd omhullen van een aantal elektronische componenten.
US4764327A (en) * 1986-01-14 1988-08-16 Mitsubishi Gas Chemical Company, Inc. Process of producing plastic-molded printed circuit boards
JPH0740573B2 (ja) * 1987-01-26 1995-05-01 株式会社東芝 半導体製造装置
US5200125A (en) * 1988-12-24 1993-04-06 T&K International Laboratory, Ltd. Method for seal molding electronic components with resin
US4927590A (en) * 1989-05-26 1990-05-22 At&T Bell Laboratories Method for encapsulating integrated circuits
US6153141A (en) * 1993-11-23 2000-11-28 Motorola, Inc. Semiconductor packaging method
JP3383701B2 (ja) * 1994-03-07 2003-03-04 松下電器産業株式会社 樹脂封入成形用金型
NL9400844A (nl) * 1994-05-24 1996-01-02 Boschman Holding Bv Werkwijze en inrichting voor het ommantelen van voorwerpen.
US5855924A (en) * 1995-12-27 1999-01-05 Siemens Microelectronics, Inc. Closed-mold for LED alphanumeric displays
JP2970569B2 (ja) * 1997-01-13 1999-11-02 日本電気株式会社 樹脂封止方法および樹脂封止金型装置
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
US6666997B2 (en) * 2001-10-02 2003-12-23 Micron Technology, Inc. Method for removing cleaning compound flash from mold vents
US7264456B2 (en) * 2001-10-10 2007-09-04 Micron Technology, Inc. Leadframe and method for reducing mold compound adhesion problems
US7323361B2 (en) * 2002-03-29 2008-01-29 Fairchild Semiconductor Corporation Packaging system for semiconductor devices
JP2004063851A (ja) * 2002-07-30 2004-02-26 Renesas Technology Corp 樹脂封止装置
WO2007119644A1 (ja) 2006-04-11 2007-10-25 Towa Corporation 電子部品の樹脂封止成形方法および電子部品の樹脂封止成形装置
US7678617B1 (en) 2006-12-21 2010-03-16 National Semiconductor Corporation Universal laminator
AT512441B1 (de) * 2012-01-18 2014-08-15 Engel Austria Gmbh Verfahren zur herstellung eines faserverbund- oder hybridbauteils

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB960097A (en) * 1960-04-14 1964-06-10 Dubilier Condenser Co 1925 Ltd Improvements in or relating to the production of encapsulated electrical components
US3471900A (en) * 1967-05-24 1969-10-14 Trw Inc Mold for encapsulating electrical components
IT982109B (it) * 1973-04-27 1974-10-21 Billi Spa Sistema di comando degli aghi per macchine da maglieria con amplifi cazione del comando imposto dalle camme
US3915780A (en) * 1973-08-02 1975-10-28 Texas Instruments Inc Extruded epoxy packaging system
US4109373A (en) * 1975-03-10 1978-08-29 General Electric Company Method for manufacturing semiconductor devices
JPS5326670A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Manufacture of semiconductor device
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
JPS54162963A (en) * 1978-06-14 1979-12-25 Mitsubishi Electric Corp Manufacture of resin-sealed semiconductor device
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
US4368168A (en) * 1978-07-17 1983-01-11 Dusan Slepcevic Method for encapsulating electrical components
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
JPS5649533A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Manufacture method of electron watch
JPS6045571B2 (ja) * 1980-06-18 1985-10-11 株式会社東芝 樹脂封止用モ−ルド装置
US4388265A (en) * 1981-12-14 1983-06-14 Kazuo Bandoh Process and apparatus for molding plastics
US4460537A (en) * 1982-07-26 1984-07-17 Motorola, Inc. Slot transfer molding apparatus and methods

Also Published As

Publication number Publication date
US4653993A (en) 1987-03-31
EP0101630A1 (de) 1984-02-29
JPS5952842A (ja) 1984-03-27
EP0101630B1 (de) 1987-04-29
NL8203253A (nl) 1984-03-16
DE3371263D1 (en) 1987-06-04

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Legal Events

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