CH616306B5 - Elektronisches modul und verfahren zu seiner herstellung. - Google Patents
Elektronisches modul und verfahren zu seiner herstellung.Info
- Publication number
- CH616306B5 CH616306B5 CH117277A CH117277A CH616306B5 CH 616306 B5 CH616306 B5 CH 616306B5 CH 117277 A CH117277 A CH 117277A CH 117277 A CH117277 A CH 117277A CH 616306 B5 CH616306 B5 CH 616306B5
- Authority
- CH
- Switzerland
- Prior art keywords
- production
- electronic module
- module
- electronic
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
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- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2401—Structure
- H01L2224/2402—Laminated, e.g. MCM-L type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/7665—Means for transporting the components to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Clocks (AREA)
- Wire Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/654,749 US4064552A (en) | 1976-02-03 | 1976-02-03 | Multilayer flexible printed circuit tape |
Publications (2)
Publication Number | Publication Date |
---|---|
CH616306GA3 CH616306GA3 (de) | 1980-03-31 |
CH616306B5 true CH616306B5 (de) | 1980-09-30 |
Family
ID=24626098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH117277A CH616306B5 (de) | 1976-02-03 | 1977-02-01 | Elektronisches modul und verfahren zu seiner herstellung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4064552A (de) |
JP (1) | JPS592378B2 (de) |
CH (1) | CH616306B5 (de) |
DE (1) | DE2703358C2 (de) |
FR (1) | FR2340666A1 (de) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4115919A (en) * | 1977-10-25 | 1978-09-26 | Amp Incorporated | Machine for press fit insertion of chip devices |
CH623452B (fr) * | 1977-12-14 | Fontainemelon Horlogerie | Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede. | |
DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
WO1982000937A1 (en) * | 1980-09-08 | 1982-03-18 | Proebsting R | Single layer burn-in tape for integrated circuit |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
JPS57145354A (en) * | 1980-11-21 | 1982-09-08 | Gao Ges Automation Org | Carrier element for ic module |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
US4472876A (en) * | 1981-08-13 | 1984-09-25 | Minnesota Mining And Manufacturing Company | Area-bonding tape |
US4386389A (en) * | 1981-09-08 | 1983-05-31 | Mostek Corporation | Single layer burn-in tape for integrated circuit |
JPS59195837A (ja) * | 1983-04-21 | 1984-11-07 | Sharp Corp | Lsiチツプボンデイング方法 |
CH654166GA3 (de) * | 1983-10-14 | 1986-02-14 | ||
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US4677528A (en) * | 1984-05-31 | 1987-06-30 | Motorola, Inc. | Flexible printed circuit board having integrated circuit die or the like affixed thereto |
US4598337A (en) * | 1984-09-17 | 1986-07-01 | Timex Corporation | Electronic circuit board for a timepiece |
US4949224A (en) * | 1985-09-20 | 1990-08-14 | Sharp Kabushiki Kaisha | Structure for mounting a semiconductor device |
US4843188A (en) * | 1986-03-25 | 1989-06-27 | Western Digital Corporation | Integrated circuit chip mounting and packaging assembly |
EP0305398B1 (de) * | 1986-05-01 | 1991-09-25 | Honeywell Inc. | Verbindungsanordnung für mehrere integrierte schaltungen |
US5036379A (en) * | 1986-10-11 | 1991-07-30 | Microelectronics And Computer Technology Corporation | Electrical interconnect tape |
US4717989A (en) * | 1987-03-30 | 1988-01-05 | Motorola Inc. | Heat sink, EMI shield and controller module assembly for a portable radio transceiver |
US4933810A (en) * | 1987-04-30 | 1990-06-12 | Honeywell Inc. | Integrated circuit interconnector |
US4914741A (en) * | 1987-06-08 | 1990-04-03 | Digital Equipment Corporation | Tape automated bonding semiconductor package |
US4829405A (en) * | 1988-03-14 | 1989-05-09 | International Business Machines Corporation | Tape automated bonding package |
US4861648A (en) * | 1988-03-14 | 1989-08-29 | Gila River Products, Inc. | Materials for laminating flexible printed circuits |
US5028983A (en) * | 1988-10-28 | 1991-07-02 | International Business Machines Corporation | Multilevel integrated circuit packaging structures |
US5106461A (en) * | 1989-04-04 | 1992-04-21 | Massachusetts Institute Of Technology | High-density, multi-level interconnects, flex circuits, and tape for tab |
US4980034A (en) * | 1989-04-04 | 1990-12-25 | Massachusetts Institute Of Technology | High-density, multi-level interconnects, flex circuits, and tape for TAB |
US5203075A (en) * | 1991-08-12 | 1993-04-20 | Inernational Business Machines | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
US5133495A (en) * | 1991-08-12 | 1992-07-28 | International Business Machines Corporation | Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween |
US5276590A (en) * | 1991-10-24 | 1994-01-04 | International Business Machines Corporation | Flex circuit electronic cards |
US5239448A (en) * | 1991-10-28 | 1993-08-24 | International Business Machines Corporation | Formulation of multichip modules |
US5350945A (en) * | 1991-12-18 | 1994-09-27 | Casio Computer Co., Ltd. | Coin-shaped integrated circuit memory device |
JPH0653277A (ja) * | 1992-06-04 | 1994-02-25 | Lsi Logic Corp | 半導体装置アセンブリおよびその組立方法 |
US6104280A (en) | 1997-10-20 | 2000-08-15 | Micron Technology, Inc. | Method of manufacturing and testing an electronic device, and an electronic device |
US6356512B1 (en) * | 1998-07-20 | 2002-03-12 | Asulab S.A. | Subassembly combining an antenna and position sensors on a same support, notably for a horological piece |
US8664030B2 (en) | 1999-03-30 | 2014-03-04 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
JP2001255833A (ja) * | 2000-03-10 | 2001-09-21 | Seiko Instruments Inc | 電子機器用表示装置 |
US7483274B2 (en) * | 2005-09-29 | 2009-01-27 | Welch Allyn, Inc. | Galvanic isolation of a signal using capacitive coupling embedded within a circuit board |
DE102005053398B4 (de) * | 2005-11-09 | 2008-12-24 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
US8884155B2 (en) | 2006-04-13 | 2014-11-11 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
US9865758B2 (en) | 2006-04-13 | 2018-01-09 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
US8729385B2 (en) | 2006-04-13 | 2014-05-20 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
US8822810B2 (en) | 2006-04-13 | 2014-09-02 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
US9006563B2 (en) | 2006-04-13 | 2015-04-14 | Solannex, Inc. | Collector grid and interconnect structures for photovoltaic arrays and modules |
US9236512B2 (en) | 2006-04-13 | 2016-01-12 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
DE102007043001A1 (de) * | 2007-09-10 | 2009-03-12 | Siemens Ag | Bandverfahren für elektronische Bauelemente, Module und LED-Anwendungen |
DE212009000025U1 (de) * | 2008-01-31 | 2010-09-23 | Global Solar Energy. Inc., Tuscon | Dünnschicht-Solarzellen-Abfolge |
US20090223555A1 (en) * | 2008-03-05 | 2009-09-10 | Stalix Llc | High Efficiency Concentrating Photovoltaic Module Method and Apparatus |
FI20085468A0 (fi) * | 2008-05-16 | 2008-05-16 | Polar Electro Oy | Sähköpiirijärjestely |
DE112009002356T5 (de) * | 2008-09-30 | 2012-01-19 | Global Solar Energy, Inc. | Dünnschicht-Solarzellenreihe |
US8169006B2 (en) * | 2008-11-29 | 2012-05-01 | Electronics And Telecommunications Research Institute | Bio-sensor chip for detecting target material |
US8759664B2 (en) | 2009-12-28 | 2014-06-24 | Hanergy Hi-Tech Power (Hk) Limited | Thin film solar cell strings |
US8929057B2 (en) * | 2011-05-25 | 2015-01-06 | Polar Electro Oy | Cover mechanism for casing |
CN104412357B (zh) | 2012-04-17 | 2017-09-22 | 环球太阳能公司 | 积体薄膜太阳能晶胞电池的互连 |
CN104937505B (zh) * | 2013-01-18 | 2017-06-13 | Eta瑞士钟表制造股份有限公司 | 用于钟表传感器的支承件 |
CN105164816B (zh) | 2013-01-28 | 2017-03-08 | 环球太阳能公司 | 光伏互连系统、装置和方法 |
US10750620B2 (en) | 2016-12-20 | 2020-08-18 | Philips Healthcare Informatics, Inc. | Flexible circuit battery attachment devices, systems, and methods |
EP3816734A1 (de) * | 2019-11-04 | 2021-05-05 | ETA SA Manufacture Horlogère Suisse | Elektronische armbanduhr mit solarzelle |
US11741822B2 (en) | 2020-05-25 | 2023-08-29 | Trackonomy Systems, Inc. | System and method of intelligent node detecting events for border protection and security |
CN114487869A (zh) * | 2020-11-12 | 2022-05-13 | 邑流微测股份有限公司 | 钮扣电池测试装置 |
WO2022126020A1 (en) * | 2020-12-12 | 2022-06-16 | Trackonomy Systems, Inc. | Flexible solar-powered wireless communication device |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3052823A (en) * | 1958-06-12 | 1962-09-04 | Rogers Corp | Printed circuit structure and method of making the same |
US3390308A (en) * | 1966-03-31 | 1968-06-25 | Itt | Multiple chip integrated circuit assembly |
US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
US3433888A (en) * | 1967-01-24 | 1969-03-18 | Electro Mechanisms Inc | Dimensionally stable flexible laminate and printed circuits made therefrom |
US3518756A (en) * | 1967-08-22 | 1970-07-07 | Ibm | Fabrication of multilevel ceramic,microelectronic structures |
DE2151765C2 (de) * | 1970-11-05 | 1983-06-16 | Honeywell Information Systems Italia S.p.A., Caluso, Torino | Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen |
US3832769A (en) * | 1971-05-26 | 1974-09-03 | Minnesota Mining & Mfg | Circuitry and method |
US3681664A (en) * | 1971-08-19 | 1972-08-01 | Jfd Electronics Corp | Trimmer capacitor for printed circuit board |
US3739232A (en) * | 1972-04-10 | 1973-06-12 | Northrop Corp | Interconnected electrical circuit board assembly and method of fabrication |
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
US3859723A (en) * | 1973-11-05 | 1975-01-14 | Microsystems Int Ltd | Bonding method for multiple chip arrays |
CA1058312A (en) * | 1975-05-29 | 1979-07-10 | Texas Instruments Incorporated | Circuit device packaging technique |
-
1976
- 1976-02-03 US US05/654,749 patent/US4064552A/en not_active Expired - Lifetime
-
1977
- 1977-01-27 DE DE2703358A patent/DE2703358C2/de not_active Expired
- 1977-01-31 JP JP52009597A patent/JPS592378B2/ja not_active Expired
- 1977-02-01 CH CH117277A patent/CH616306B5/de not_active IP Right Cessation
- 1977-02-02 FR FR7702935A patent/FR2340666A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2340666A1 (fr) | 1977-09-02 |
US4064552A (en) | 1977-12-20 |
DE2703358C2 (de) | 1983-11-24 |
CH616306GA3 (de) | 1980-03-31 |
JPS592378B2 (ja) | 1984-01-18 |
DE2703358A1 (de) | 1977-08-18 |
JPS52101469A (en) | 1977-08-25 |
FR2340666B1 (de) | 1982-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |