RU2006110512A - Теплопроводный материал, использующий электронные наночастицы - Google Patents

Теплопроводный материал, использующий электронные наночастицы Download PDF

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Publication number
RU2006110512A
RU2006110512A RU2006110512/28A RU2006110512A RU2006110512A RU 2006110512 A RU2006110512 A RU 2006110512A RU 2006110512/28 A RU2006110512/28 A RU 2006110512/28A RU 2006110512 A RU2006110512 A RU 2006110512A RU 2006110512 A RU2006110512 A RU 2006110512A
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Russia
Prior art keywords
composition
thermal
conjugation
circuit board
printed circuit
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RU2006110512/28A
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English (en)
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Сандип Шрикант ТОНАПИ (US)
Сандип Шрикант ТОНАПИ
Хун ЧЖУН (US)
Хун ЧЖУН
Давиде Луис СИМОНЕ (US)
Давиде Луис СИМОНЕ
Реймонд Алберт ФИЛЛИОН (US)
Реймонд Алберт ФИЛЛИОН
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Дженерал Электрик Компани (US)
Дженерал Электрик Компани
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Publication of RU2006110512A publication Critical patent/RU2006110512A/ru

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Claims (10)

1. Композиция (10) для термического сопряжения, содержащая смесь из полимерной матрицы (16), по меньшей мере одного наполнителя (18) микронного размера и электропроводных наночастиц (20), где композиция (10) для термического сопряжения является неэлектропроводной.
2. Композиция (10) для термического сопряжения по п.1, в которой наполнитель (18) микронного размера выбирают из группы, состоящей из коллоидальной двуокиси кремния, плавленой двуокиси кремния, тонкоизмельченного порошка кварца, аморфной двуокиси кремния, сажи, графита, алмаза, гидратов алюминия, нитридов металлов, оксидов металлов и их комбинаций.
3. Композиция (10) для термического сопряжения по п.1, в которой электропроводные наночастицы (20) выбирают из группы, состоящей из меди, серебра, платины, палладия, золота, графита, алюминия, легированного кремния и карбида кремния.
4. Способ увеличения теплопередачи, включающий
размещение компоненты (12), создающей тепло, в контакте с неэлектропроводной композицией (10) для термического сопряжения, содержащей смесь из полимерной матрицы (16), по меньшей мере одного наполнителя (18) микронного размера и электропроводных наночастиц (20); и
размещение теплоотвода (14) в контакте с композицией (10) для термического сопряжения.
5. Электронная компонента, содержащая
компоненту (12), создающую тепло;
теплоотвод (14); и
неэлектропроводную композицию (10) для термического сопряжения, помещенную между компонентой (12), создающей тепло, и теплоотводом (14), причем неэлектропроводная композиция (10) для термического сопряжения содержит смесь из полимерной матрицы (16), по меньшей мере одного наполнителя (18) микронного размера и электропроводных наночастиц (20).
6. Способ увеличения теплопередачи, включающий
размещение компоненты (30), создающей тепло, в контакте с печатной платой (34);
контактирование компоненты (30) по меньшей мере с одним электрическим контактом печатной платы (34) с образованием электрического соединения; и
нанесение композиции (10) для термического сопряжения, содержащей смесь из полимерной матрицы (16), по меньшей мере одного наполнителя (18) микронного размера и электропроводных наночастиц (20), между компонентой (30) и печатной платой (34),
где композиция (10) для термического сопряжения инкапсулирует по меньшей мере одно электрическое соединение.
7. Способ увеличения теплопередачи, включающий
нанесение композиции (10) для термического сопряжения, содержащей смесь из полимерной матрицы (16), по меньшей мере одного наполнителя (18) микронного размера и электропроводных наночастиц (20), для полупроводниковой пластины, содержащей множество посадочных мест для кристаллов, причем посадочные места для кристаллов содержат множество электрических контактов;
размещение по меньшей мере одной паяной сферы (32) на множестве контактов;
частичное отверждение композиции (10) для термического сопряжения, так что открывается верхняя часть по меньшей мере одной паяной сферы (32);
нарезание пластины на отдельные полупроводниковые микросхемы;
размещение по меньшей мере одной полупроводниковой микросхемы на печатной плате (34), так что по меньшей мере одна паяная сфера (32) ориентирована для формирования по меньшей мере одного электрического соединения по меньшей мере с одним электрическим контактом печатной платы (34);
нагревание по меньшей мере одной полупроводниковой микросхемы и платы (34) для одновременного расплавления паяной сферы (32) и отверждения композиции (10) для термического сопряжения; и
охлаждение по меньшей мере одной полупроводниковой схемы и платы (34) для отвердевания паяной сферы (32) и схватывания композиции (10) для термического сопряжения, так что композиция (10) для термического сопряжения инкапсулирует по меньшей мере одно электрическое соединение.
8. Способ увеличения теплопередачи, включающий
нанесение композиции (10) для термического сопряжения, содержащей смесь из полимерной матрицы (16) и электропроводных наночастиц (20), для печатной платы (34);
размещение компоненты (30), создающей тепло, содержащей по меньшей мере один электрический контакт, по меньшей мере с одной паяной сферой (32), на печатной плате (34), так что по меньшей мере одна паяная сфера (32) ориентирована по меньшей мере на один электрический контакт печатной платы (34), образуя по меньшей мере одно электрическое соединение;
нагревание компоненты (30) и платы (34) для одновременного расплавления паяной сферы (32) и отверждения композиции (10) для термического сопряжения; и
охлаждение компоненты (30) и платы (34) для отвердевания паяной сферы (32) и схватывания композиции (10) для термического сопряжения, так что композиция (10) для термического сопряжения инкапсулирует по меньшей мере одно электрическое соединение.
9. Электронная компонента, содержащая
компоненту (30), создающую тепло;
печатную плату (34); и
композицию (10) для термического сопряжения, помещенную между компонентой (30), создающей тепло, и печатной платой (34), причем композиция (10) для термического сопряжения содержит смесь из полимерной матрицы (16), и электропроводных наночастиц (20).
10. Композиция с нижним заполнением, содержащая смесь из полимерной матрицы и электропроводных наночастиц (20), где композиция с нижним заполнением является неэлектропроводной.
RU2006110512/28A 2003-09-03 2004-08-05 Теплопроводный материал, использующий электронные наночастицы RU2006110512A (ru)

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