PL3611294T3 - Sposób galwanizacji - Google Patents

Sposób galwanizacji

Info

Publication number
PL3611294T3
PL3611294T3 PL17905121.4T PL17905121T PL3611294T3 PL 3611294 T3 PL3611294 T3 PL 3611294T3 PL 17905121 T PL17905121 T PL 17905121T PL 3611294 T3 PL3611294 T3 PL 3611294T3
Authority
PL
Poland
Prior art keywords
electroplating method
electroplating
Prior art date
Application number
PL17905121.4T
Other languages
English (en)
Inventor
Masayuki Iimori
Ryosuke TAKEDA
Original Assignee
Ykk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ykk Corporation filed Critical Ykk Corporation
Publication of PL3611294T3 publication Critical patent/PL3611294T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/02—Slide fasteners
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44B—BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
    • A44B19/00—Slide fasteners
    • A44B19/24—Details
    • A44B19/26—Sliders
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL17905121.4T 2017-04-14 2017-05-11 Sposób galwanizacji PL3611294T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2017/015365 WO2018189901A1 (ja) 2017-04-14 2017-04-14 めっき材及びその製造方法
PCT/JP2017/017949 WO2018189916A1 (ja) 2017-04-14 2017-05-11 電気めっき方法及び装置

Publications (1)

Publication Number Publication Date
PL3611294T3 true PL3611294T3 (pl) 2024-06-24

Family

ID=63792499

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17905121.4T PL3611294T3 (pl) 2017-04-14 2017-05-11 Sposób galwanizacji

Country Status (12)

Country Link
US (2) US11236431B2 (pl)
EP (2) EP3611294B1 (pl)
JP (2) JP6722821B2 (pl)
KR (2) KR102282185B1 (pl)
CN (2) CN110475913B (pl)
BR (1) BR112019011899B1 (pl)
ES (1) ES2975060T3 (pl)
MX (2) MX2019011879A (pl)
PL (1) PL3611294T3 (pl)
RU (1) RU2718587C1 (pl)
TW (2) TWI679315B (pl)
WO (3) WO2018189901A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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CN111630210B (zh) * 2017-12-26 2022-01-25 汉玛科技股份有限公司 电镀组合机构
CN114746585B (zh) * 2019-12-24 2024-06-25 Ykk株式会社 电镀系统
EP4083273A4 (en) * 2019-12-24 2022-11-30 Ykk Corporation ELECTROPLATING DEVICE AND METHOD FOR MAKING PLATED PRODUCT
JP7520550B2 (ja) * 2020-03-31 2024-07-23 株式会社日立製作所 積層体、金属めっき液、および積層体の製造方法
KR102904551B1 (ko) * 2020-10-26 2025-12-29 삼성전기주식회사 전자 부품 회수 장치 및 이를 이용한 전자 부품 회수 방법
CN117836472A (zh) * 2021-08-06 2024-04-05 Ykk株式会社 拉链牙链带、拉链链条及拉链的制造方法、以及电镀装置
CN119072716A (zh) 2022-03-26 2024-12-03 美国亚德诺半导体公司 用于执行对象尺寸标注的方法和系统
CN115522253B (zh) * 2022-04-08 2024-08-13 深圳市山浩机械设备有限公司 一种可促进电解液流动的电镀装置
EP4663818A1 (en) * 2023-02-06 2025-12-17 Ykk Corporation Plated member and fastener stringer
US12577639B2 (en) 2023-03-13 2026-03-17 Mitsui Kinzoku Company, Limited Zinc foil and method for producing the same

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Also Published As

Publication number Publication date
BR112019011899A2 (pt) 2019-10-22
EP3611294A4 (en) 2021-01-13
KR102282185B1 (ko) 2021-07-27
EP3611294B1 (en) 2024-01-24
RU2718587C1 (ru) 2020-04-08
BR112019011972A2 (pt) 2019-11-05
KR20190087585A (ko) 2019-07-24
JP6722821B2 (ja) 2020-07-15
EP3611293A1 (en) 2020-02-19
ES2975060T3 (es) 2024-07-03
CN110462110B (zh) 2020-08-11
TW201942420A (zh) 2019-11-01
EP3611293A4 (en) 2021-02-17
US20200095700A1 (en) 2020-03-26
JPWO2018189916A1 (ja) 2019-11-07
US20200032410A1 (en) 2020-01-30
WO2018189901A1 (ja) 2018-10-18
WO2018189916A1 (ja) 2018-10-18
KR102243188B1 (ko) 2021-04-22
CN110475913A (zh) 2019-11-19
JP6793251B2 (ja) 2020-12-02
TW201842235A (zh) 2018-12-01
MX2019011879A (es) 2019-12-02
TWI691621B (zh) 2020-04-21
CN110462110A (zh) 2019-11-15
JPWO2018190202A1 (ja) 2019-11-07
WO2018190202A1 (ja) 2018-10-18
US11236431B2 (en) 2022-02-01
KR20190087586A (ko) 2019-07-24
TWI679315B (zh) 2019-12-11
MX2019010840A (es) 2019-11-18
EP3611294A1 (en) 2020-02-19
EP3611293B1 (en) 2024-01-03
CN110475913B (zh) 2020-09-01
BR112019011899B1 (pt) 2023-01-17
US11072866B2 (en) 2021-07-27

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