NO975637L - Fjerning av materiale ved polarisert bestråling og baksidepåföring ved bestråling - Google Patents
Fjerning av materiale ved polarisert bestråling og baksidepåföring ved bestrålingInfo
- Publication number
- NO975637L NO975637L NO975637A NO975637A NO975637L NO 975637 L NO975637 L NO 975637L NO 975637 A NO975637 A NO 975637A NO 975637 A NO975637 A NO 975637A NO 975637 L NO975637 L NO 975637L
- Authority
- NO
- Norway
- Prior art keywords
- radiation
- removal
- polarized
- back application
- undesirable
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 7
- 230000005855 radiation Effects 0.000 title 2
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011261 inert gas Substances 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76819—Smoothing of the dielectric
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- High Energy & Nuclear Physics (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Drying Of Semiconductors (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Laser Beam Processing (AREA)
- Polarising Elements (AREA)
- Materials For Medical Uses (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Apparat og fremgangsmåte for selektiv fjerning av uønsket materiale fra overflaten til et substrat fremskaffer en strøm av inertgass over den uønskede materialsubstratoverflaten samtidig med bestråling av det uønskede materiale med energetiske fotoner. Oppfinnelsen muliggjør fjerning av uønsket materiale uten å endre de fysikalske egenskapene til materialet som ligger under eller er naboliggende til det fjernede, uønskede materiale. Fjerningseffektiviteten kan bli øket ved anvendelse av polariserte energetiske fotoner. Retting av en laserstråle mot baksiden av et transparent substrat kan øke effektiviteten ved fjerning.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47276295A | 1995-06-07 | 1995-06-07 | |
PCT/US1996/009331 WO1996041370A1 (en) | 1995-06-07 | 1996-06-05 | Removal of material by polarized radiation and back side application of radiation |
Publications (2)
Publication Number | Publication Date |
---|---|
NO975637D0 NO975637D0 (no) | 1997-12-04 |
NO975637L true NO975637L (no) | 1998-01-28 |
Family
ID=23876840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO975637A NO975637L (no) | 1995-06-07 | 1997-12-04 | Fjerning av materiale ved polarisert bestråling og baksidepåföring ved bestråling |
Country Status (19)
Country | Link |
---|---|
US (1) | US5958268A (no) |
EP (1) | EP0834191B1 (no) |
JP (1) | JP4089833B2 (no) |
KR (1) | KR19990022679A (no) |
CN (1) | CN100390938C (no) |
AT (1) | ATE211584T1 (no) |
AU (1) | AU5989296A (no) |
BR (1) | BR9609065A (no) |
CA (2) | CA2570713A1 (no) |
CZ (1) | CZ378297A3 (no) |
DE (1) | DE69618641T2 (no) |
EA (1) | EA199800002A1 (no) |
HU (1) | HUP9802661A2 (no) |
LV (1) | LV12080B (no) |
MX (1) | MX9709688A (no) |
MY (1) | MY121934A (no) |
NO (1) | NO975637L (no) |
TW (1) | TW284907B (no) |
WO (1) | WO1996041370A1 (no) |
Families Citing this family (94)
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-
1995
- 1995-06-24 TW TW084106499A patent/TW284907B/zh active
- 1995-09-27 MY MYPI95002884A patent/MY121934A/en unknown
-
1996
- 1996-03-01 US US08/609,449 patent/US5958268A/en not_active Expired - Fee Related
- 1996-06-05 CZ CZ973782A patent/CZ378297A3/cs unknown
- 1996-06-05 BR BR9609065A patent/BR9609065A/pt not_active Application Discontinuation
- 1996-06-05 CA CA002570713A patent/CA2570713A1/en not_active Abandoned
- 1996-06-05 EP EP96917247A patent/EP0834191B1/en not_active Expired - Lifetime
- 1996-06-05 JP JP50167497A patent/JP4089833B2/ja not_active Expired - Fee Related
- 1996-06-05 CA CA002222502A patent/CA2222502C/en not_active Expired - Fee Related
- 1996-06-05 AT AT96917247T patent/ATE211584T1/de active
- 1996-06-05 AU AU59892/96A patent/AU5989296A/en not_active Abandoned
- 1996-06-05 EA EA199800002A patent/EA199800002A1/ru unknown
- 1996-06-05 CN CNB961960698A patent/CN100390938C/zh not_active Expired - Fee Related
- 1996-06-05 HU HU9802661A patent/HUP9802661A2/hu unknown
- 1996-06-05 KR KR1019970709120A patent/KR19990022679A/ko not_active Application Discontinuation
- 1996-06-05 WO PCT/US1996/009331 patent/WO1996041370A1/en not_active Application Discontinuation
- 1996-06-05 DE DE69618641T patent/DE69618641T2/de not_active Expired - Fee Related
-
1997
- 1997-12-04 NO NO975637A patent/NO975637L/no unknown
- 1997-12-05 MX MX9709688A patent/MX9709688A/es not_active IP Right Cessation
-
1998
- 1998-01-05 LV LVP-98-01A patent/LV12080B/en unknown
Also Published As
Publication number | Publication date |
---|---|
LV12080B (en) | 1998-10-20 |
MY121934A (en) | 2006-03-31 |
WO1996041370A1 (en) | 1996-12-19 |
AU5989296A (en) | 1996-12-30 |
BR9609065A (pt) | 1999-01-26 |
ATE211584T1 (de) | 2002-01-15 |
CA2570713A1 (en) | 1996-12-19 |
CA2222502A1 (en) | 1996-12-19 |
HUP9802661A2 (hu) | 1999-03-29 |
NO975637D0 (no) | 1997-12-04 |
DE69618641T2 (de) | 2002-08-14 |
US5958268A (en) | 1999-09-28 |
KR19990022679A (ko) | 1999-03-25 |
CN1194057A (zh) | 1998-09-23 |
CA2222502C (en) | 2007-05-08 |
CZ378297A3 (cs) | 1998-06-17 |
EP0834191A1 (en) | 1998-04-08 |
MX9709688A (es) | 1998-11-30 |
CN100390938C (zh) | 2008-05-28 |
DE69618641D1 (de) | 2002-02-28 |
EA199800002A1 (ru) | 1998-08-27 |
LV12080A (lv) | 1998-06-20 |
TW284907B (en) | 1996-09-01 |
EP0834191B1 (en) | 2002-01-02 |
JP4089833B2 (ja) | 2008-05-28 |
JPH11507298A (ja) | 1999-06-29 |
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