NL8401842A - Werkwijze voor het elektrolytisch neerslaan van koper. - Google Patents

Werkwijze voor het elektrolytisch neerslaan van koper. Download PDF

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Publication number
NL8401842A
NL8401842A NL8401842A NL8401842A NL8401842A NL 8401842 A NL8401842 A NL 8401842A NL 8401842 A NL8401842 A NL 8401842A NL 8401842 A NL8401842 A NL 8401842A NL 8401842 A NL8401842 A NL 8401842A
Authority
NL
Netherlands
Prior art keywords
copper
groups
carbon atoms
alkyl
copper layer
Prior art date
Application number
NL8401842A
Other languages
English (en)
Dutch (nl)
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of NL8401842A publication Critical patent/NL8401842A/nl

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
NL8401842A 1983-06-10 1984-06-08 Werkwijze voor het elektrolytisch neerslaan van koper. NL8401842A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50121283A 1983-06-10 1983-06-10
US50121283 1983-06-10

Publications (1)

Publication Number Publication Date
NL8401842A true NL8401842A (nl) 1985-01-02

Family

ID=23992566

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8401842A NL8401842A (nl) 1983-06-10 1984-06-08 Werkwijze voor het elektrolytisch neerslaan van koper.

Country Status (10)

Country Link
JP (1) JPS609891A (enExample)
AU (1) AU559896B2 (enExample)
BR (1) BR8402812A (enExample)
CA (1) CA1255622A (enExample)
DE (1) DE3421017A1 (enExample)
ES (1) ES8601337A1 (enExample)
FR (1) FR2547836A1 (enExample)
GB (1) GB2141141B (enExample)
IT (1) IT1177790B (enExample)
NL (1) NL8401842A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556722B2 (en) 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US8298395B2 (en) 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
ATE507327T1 (de) * 2006-01-06 2011-05-15 Enthone Elektrolyt und verfahren zur abscheidung einer matten metallschicht
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (enExample) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
DE2028803C3 (de) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymere Phenazoniumverbindungen
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
GB2141141B (en) 1987-01-07
ES533253A0 (es) 1985-10-16
JPS6112037B2 (enExample) 1986-04-05
JPS609891A (ja) 1985-01-18
IT8448356A0 (it) 1984-06-08
GB2141141A (en) 1984-12-12
AU559896B2 (en) 1987-03-26
BR8402812A (pt) 1985-05-21
DE3421017C2 (enExample) 1987-08-27
IT8448356A1 (it) 1985-12-08
GB8414863D0 (en) 1984-07-18
DE3421017A1 (de) 1984-12-13
IT1177790B (it) 1987-08-26
ES8601337A1 (es) 1985-10-16
AU2903484A (en) 1984-12-13
CA1255622A (en) 1989-06-13
FR2547836A1 (fr) 1984-12-28

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BV The patent application has lapsed