JPS609891A - 銅の電着方法 - Google Patents
銅の電着方法Info
- Publication number
- JPS609891A JPS609891A JP59119716A JP11971684A JPS609891A JP S609891 A JPS609891 A JP S609891A JP 59119716 A JP59119716 A JP 59119716A JP 11971684 A JP11971684 A JP 11971684A JP S609891 A JPS609891 A JP S609891A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper plating
- substrate
- electrodeposition
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50121283A | 1983-06-10 | 1983-06-10 | |
| US501212 | 1983-06-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS609891A true JPS609891A (ja) | 1985-01-18 |
| JPS6112037B2 JPS6112037B2 (enExample) | 1986-04-05 |
Family
ID=23992566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59119716A Granted JPS609891A (ja) | 1983-06-10 | 1984-06-11 | 銅の電着方法 |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS609891A (enExample) |
| AU (1) | AU559896B2 (enExample) |
| BR (1) | BR8402812A (enExample) |
| CA (1) | CA1255622A (enExample) |
| DE (1) | DE3421017A1 (enExample) |
| ES (1) | ES8601337A1 (enExample) |
| FR (1) | FR2547836A1 (enExample) |
| GB (1) | GB2141141B (enExample) |
| IT (1) | IT1177790B (enExample) |
| NL (1) | NL8401842A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006009079A (ja) * | 2004-06-25 | 2006-01-12 | Hitachi Ltd | プリント配線板の製造方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7556722B2 (en) | 1996-11-22 | 2009-07-07 | Metzger Hubert F | Electroplating apparatus |
| US8298395B2 (en) | 1999-06-30 | 2012-10-30 | Chema Technology, Inc. | Electroplating apparatus |
| DE10261852B3 (de) * | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad |
| ATE507327T1 (de) * | 2006-01-06 | 2011-05-15 | Enthone | Elektrolyt und verfahren zur abscheidung einer matten metallschicht |
| US9243339B2 (en) | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2882209A (en) * | 1957-05-20 | 1959-04-14 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
| NL291575A (enExample) * | 1962-04-16 | |||
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
| ZA708430B (en) * | 1970-02-12 | 1971-09-29 | Udylite Corp | Electrodeposition of copper from acidic baths |
| DE2028803C3 (de) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymere Phenazoniumverbindungen |
| US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| GB1526076A (en) * | 1975-03-11 | 1978-09-27 | Oxy Metal Industries Corp | Electrodeposition of copper |
| CA1105045A (en) * | 1977-05-04 | 1981-07-14 | Hans G. Creutz (Deceased) | Electrodeposition of copper |
| DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
| US4272335A (en) * | 1980-02-19 | 1981-06-09 | Oxy Metal Industries Corporation | Composition and method for electrodeposition of copper |
| US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
-
1984
- 1984-06-04 AU AU29034/84A patent/AU559896B2/en not_active Ceased
- 1984-06-06 DE DE19843421017 patent/DE3421017A1/de active Granted
- 1984-06-07 CA CA000456109A patent/CA1255622A/en not_active Expired
- 1984-06-08 ES ES533253A patent/ES8601337A1/es not_active Expired
- 1984-06-08 IT IT48356/84A patent/IT1177790B/it active
- 1984-06-08 BR BR8402812A patent/BR8402812A/pt unknown
- 1984-06-08 NL NL8401842A patent/NL8401842A/nl not_active Application Discontinuation
- 1984-06-08 FR FR8409045A patent/FR2547836A1/fr active Pending
- 1984-06-11 JP JP59119716A patent/JPS609891A/ja active Granted
- 1984-06-11 GB GB08414863A patent/GB2141141B/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006009079A (ja) * | 2004-06-25 | 2006-01-12 | Hitachi Ltd | プリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2141141B (en) | 1987-01-07 |
| ES533253A0 (es) | 1985-10-16 |
| JPS6112037B2 (enExample) | 1986-04-05 |
| IT8448356A0 (it) | 1984-06-08 |
| GB2141141A (en) | 1984-12-12 |
| AU559896B2 (en) | 1987-03-26 |
| BR8402812A (pt) | 1985-05-21 |
| DE3421017C2 (enExample) | 1987-08-27 |
| IT8448356A1 (it) | 1985-12-08 |
| GB8414863D0 (en) | 1984-07-18 |
| DE3421017A1 (de) | 1984-12-13 |
| IT1177790B (it) | 1987-08-26 |
| ES8601337A1 (es) | 1985-10-16 |
| AU2903484A (en) | 1984-12-13 |
| NL8401842A (nl) | 1985-01-02 |
| CA1255622A (en) | 1989-06-13 |
| FR2547836A1 (fr) | 1984-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4110176A (en) | Electrodeposition of copper | |
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| US4272335A (en) | Composition and method for electrodeposition of copper | |
| US3769182A (en) | Bath and method for electrodepositing tin and/or lead | |
| US3770598A (en) | Electrodeposition of copper from acid baths | |
| GB2273941A (en) | Polyether additives for copper electroplating baths | |
| JPS6362595B2 (enExample) | ||
| CA1104152A (en) | Nitrogen and sulfur compositions and acid copper plating baths | |
| US4036711A (en) | Electrodeposition of copper | |
| JPH02141596A (ja) | ジンケート型亜鉛合金メッキ浴 | |
| JPH0319309B2 (enExample) | ||
| ES2348207T3 (es) | Solución electrolítica de cobre y lámina de cobre electrolítico producida a partir de la misma. | |
| US5849171A (en) | Acid bath for copper plating and process with the use of this combination | |
| JPH01283400A (ja) | 亜鉛−ニッケル合金電気めっき液 | |
| JPS609891A (ja) | 銅の電着方法 | |
| US4036710A (en) | Electrodeposition of copper | |
| JPH07157890A (ja) | 酸性銅めっき浴及びこれを使用するめっき方法 | |
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| US3940320A (en) | Electrodeposition of copper | |
| CA1075695A (en) | Alkaline zinc electroplating baths and additive compositions therefor | |
| US4100040A (en) | Electrodeposition of bright zinc utilizing aliphatic ketones | |
| JPS6013090A (ja) | 銅めっき浴組成物及び使用方法 | |
| JP5005849B2 (ja) | アルカリ性亜鉛及び亜鉛合金めっき浴 | |
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