JPS6112037B2 - - Google Patents

Info

Publication number
JPS6112037B2
JPS6112037B2 JP59119716A JP11971684A JPS6112037B2 JP S6112037 B2 JPS6112037 B2 JP S6112037B2 JP 59119716 A JP59119716 A JP 59119716A JP 11971684 A JP11971684 A JP 11971684A JP S6112037 B2 JPS6112037 B2 JP S6112037B2
Authority
JP
Japan
Prior art keywords
copper plating
copper
carbon atoms
brightener
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59119716A
Other languages
English (en)
Japanese (ja)
Other versions
JPS609891A (ja
Inventor
Jei Komusu Danieru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of JPS609891A publication Critical patent/JPS609891A/ja
Publication of JPS6112037B2 publication Critical patent/JPS6112037B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59119716A 1983-06-10 1984-06-11 銅の電着方法 Granted JPS609891A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50121283A 1983-06-10 1983-06-10
US501212 1983-06-10

Publications (2)

Publication Number Publication Date
JPS609891A JPS609891A (ja) 1985-01-18
JPS6112037B2 true JPS6112037B2 (enExample) 1986-04-05

Family

ID=23992566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59119716A Granted JPS609891A (ja) 1983-06-10 1984-06-11 銅の電着方法

Country Status (10)

Country Link
JP (1) JPS609891A (enExample)
AU (1) AU559896B2 (enExample)
BR (1) BR8402812A (enExample)
CA (1) CA1255622A (enExample)
DE (1) DE3421017A1 (enExample)
ES (1) ES8601337A1 (enExample)
FR (1) FR2547836A1 (enExample)
GB (1) GB2141141B (enExample)
IT (1) IT1177790B (enExample)
NL (1) NL8401842A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556722B2 (en) 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US8298395B2 (en) 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
ATE507327T1 (de) * 2006-01-06 2011-05-15 Enthone Elektrolyt und verfahren zur abscheidung einer matten metallschicht
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (enExample) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
DE2028803C3 (de) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymere Phenazoniumverbindungen
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
GB2141141B (en) 1987-01-07
ES533253A0 (es) 1985-10-16
JPS609891A (ja) 1985-01-18
IT8448356A0 (it) 1984-06-08
GB2141141A (en) 1984-12-12
AU559896B2 (en) 1987-03-26
BR8402812A (pt) 1985-05-21
DE3421017C2 (enExample) 1987-08-27
IT8448356A1 (it) 1985-12-08
GB8414863D0 (en) 1984-07-18
DE3421017A1 (de) 1984-12-13
IT1177790B (it) 1987-08-26
ES8601337A1 (es) 1985-10-16
AU2903484A (en) 1984-12-13
NL8401842A (nl) 1985-01-02
CA1255622A (en) 1989-06-13
FR2547836A1 (fr) 1984-12-28

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