NL8401374A - Foto-modelleerbare dielektrische samenstellingen, werkwijze voor de bereiding daarvan en toepassing van deze samenstellingen. - Google Patents

Foto-modelleerbare dielektrische samenstellingen, werkwijze voor de bereiding daarvan en toepassing van deze samenstellingen. Download PDF

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Publication number
NL8401374A
NL8401374A NL8401374A NL8401374A NL8401374A NL 8401374 A NL8401374 A NL 8401374A NL 8401374 A NL8401374 A NL 8401374A NL 8401374 A NL8401374 A NL 8401374A NL 8401374 A NL8401374 A NL 8401374A
Authority
NL
Netherlands
Prior art keywords
polyamic acid
silicone
aromatic
radicals
radical
Prior art date
Application number
NL8401374A
Other languages
English (en)
Dutch (nl)
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of NL8401374A publication Critical patent/NL8401374A/nl

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S522/904—Monomer or polymer contains initiating group
    • Y10S522/905—Benzophenone group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Formation Of Insulating Films (AREA)
NL8401374A 1983-08-29 1984-05-01 Foto-modelleerbare dielektrische samenstellingen, werkwijze voor de bereiding daarvan en toepassing van deze samenstellingen. NL8401374A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/527,581 US4515887A (en) 1983-08-29 1983-08-29 Photopatternable dielectric compositions, method for making and use
US52758183 1983-08-29

Publications (1)

Publication Number Publication Date
NL8401374A true NL8401374A (nl) 1985-03-18

Family

ID=24102051

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8401374A NL8401374A (nl) 1983-08-29 1984-05-01 Foto-modelleerbare dielektrische samenstellingen, werkwijze voor de bereiding daarvan en toepassing van deze samenstellingen.

Country Status (9)

Country Link
US (1) US4515887A (ko)
JP (1) JPH0797214B2 (ko)
KR (1) KR900008949B1 (ko)
DE (1) DE3424216C2 (ko)
FR (1) FR2555597B1 (ko)
GB (1) GB2145728B (ko)
IE (1) IE55344B1 (ko)
MX (1) MX168017B (ko)
NL (1) NL8401374A (ko)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4690997A (en) * 1984-01-26 1987-09-01 General Electric Company Flame retardant wire coating compositions
US4837126A (en) * 1985-06-07 1989-06-06 W. R. Grace & Co. Polymer composition for photoresist application
US4717643A (en) * 1985-08-06 1988-01-05 Hercules Incorporated No thermal cure dry film solder mask
JPS62180360A (ja) * 1986-02-03 1987-08-07 ゼネラル・エレクトリツク・カンパニイ 光パタ−ン化可能なポリイミド組成物とその製法
US4782009A (en) * 1987-04-03 1988-11-01 General Electric Company Method of coating and imaging photopatternable silicone polyamic acid
US5270431A (en) * 1987-07-23 1993-12-14 Basf Aktiengesellschaft Preparation of oligomeric or polymeric radiation-reactive intermediates for solvent-structured layers
JP2626696B2 (ja) * 1988-04-11 1997-07-02 チッソ株式会社 感光性重合体
JPH01283554A (ja) * 1988-05-11 1989-11-15 Hitachi Ltd 耐熱感光性重合体組成物
DE68921052T2 (de) * 1988-12-16 1995-06-01 Hitachi Chemical Co Ltd Lichtempfindliche Kunststoffzusammensetzung und lichtempfindliches Element unter Verwendung dieser Zusammensetzung.
EP0430220B1 (en) * 1989-11-30 1997-05-07 Sumitomo Bakelite Company Limited Photosensitive resin composition and semiconductor apparatus using it
JPH04120542A (ja) * 1990-09-12 1992-04-21 Hitachi Ltd 感光性耐熱重合体組成物
JP2516276B2 (ja) * 1990-09-12 1996-07-24 住友ベークライト株式会社 感光性樹脂組成物
JPH0457376U (ko) * 1990-09-20 1992-05-18
JP2890213B2 (ja) * 1991-02-25 1999-05-10 チッソ株式会社 感光性重合体組成物及びパターンの形成方法
JP2546940B2 (ja) * 1991-11-06 1996-10-23 住友ベークライト株式会社 感光性樹脂組成物
JP2557331B2 (ja) * 1992-06-24 1996-11-27 東芝ケミカル株式会社 感光性ポリイミド組成物
JP3211108B2 (ja) * 1992-06-25 2001-09-25 チッソ株式会社 感光性樹脂組成物
JP2787531B2 (ja) * 1993-02-17 1998-08-20 信越化学工業株式会社 感光性樹脂組成物及び電子部品用保護膜
EP0622682B1 (en) * 1993-04-28 1998-03-04 Hitachi Chemical Co., Ltd. Photosensitive resin composition
US5616448A (en) * 1995-01-27 1997-04-01 Shin-Etsu Chemical Co., Ltd. Photosensitive resin composition and a process for forming a patterned polyimide film using the same
CN1061058C (zh) * 1996-01-09 2001-01-24 河北工业大学 耐热光敏聚酰亚胺
US5856065A (en) * 1996-03-27 1999-01-05 Olin Microelectronic Chemicals, Inc. Negative working photoresist composition based on polyimide primers
US5914354A (en) * 1996-08-12 1999-06-22 Shin-Etsu Chemical Co., Ltd. Radiation-sensitive resin composition
EP1012672B1 (en) * 1997-09-11 2003-08-13 Arch Specialty Chemicals, Inc. A negatively acting photoresist composition based on polyimide precursors
DE69934960T2 (de) * 1998-10-30 2007-12-06 Hitachi Chemical Dupont Microsystems Ltd. Tetracarbonsäuredianhydrid, Derivat und Herstellung davon, Polyimidvorläufer, Polyimid, Harzzusammensetzung, photoempfindliche Harzzusammensetzung, Verfahren zur Erzeugung von Prägemustern und elektronisches Bauteil
US6342333B1 (en) 1999-09-23 2002-01-29 Hitachi Chemical Dupont Microsystems, L.L.C. Photosensitive resin composition, patterning method, and electronic components
KR100490402B1 (ko) * 2002-04-16 2005-05-17 삼성전자주식회사 유기 감광체용 오버코트 형성용 조성물 및 이로부터형성된 오버코트층을 채용한 유기 감광체
KR100453046B1 (ko) * 2002-04-16 2004-10-15 삼성전자주식회사 유기 감광체용 오버코트 형성용 조성물 및 이로부터형성된 오버코트층을 채용한 유기 감광체
JP4961972B2 (ja) * 2006-03-09 2012-06-27 Ｊｎｃ株式会社 絶縁層形成用組成物および絶縁膜
KR102087261B1 (ko) * 2017-02-16 2020-03-10 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
KR102064297B1 (ko) 2017-02-16 2020-01-09 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US30186A (en) * 1860-09-25 John j
JPS532911B1 (ko) * 1971-07-09 1978-02-01
USRE30186E (en) 1974-08-02 1980-01-08 Siemens Aktiengesellschaft Method for the preparation of relief structures
US4017340A (en) * 1975-08-04 1977-04-12 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
US4140572A (en) * 1976-09-07 1979-02-20 General Electric Company Process for selective etching of polymeric materials embodying silicones therein
JPS5946380B2 (ja) * 1977-04-13 1984-11-12 株式会社日立製作所 画像の形成方法
JPS6046421B2 (ja) * 1978-03-01 1985-10-16 東レ株式会社 耐熱性感光材料
JPS5545746A (en) * 1978-09-29 1980-03-31 Hitachi Ltd Reactive polymer composition
DE2967162D1 (en) * 1978-09-29 1984-09-13 Hitachi Ltd Light-sensitive polymer composition
DE3107633A1 (de) * 1981-02-27 1982-09-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung duenner polyimidschichten"
JPS57168943A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Coating liquid for thin film formation
JPS57168942A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Photosensitive polymer composition
GB2101149A (en) * 1981-04-14 1983-01-12 Hitachi Chemical Co Ltd Process for producing polyamide acid silicon type intermediate and polyimide silicon copolymer resin
US4548891A (en) * 1983-02-11 1985-10-22 Ciba Geigy Corporation Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators
EP0119719B1 (en) * 1983-03-03 1987-05-06 Toray Industries, Inc. Radiation sensitive polymer composition

Also Published As

Publication number Publication date
GB8410771D0 (en) 1984-06-06
IE840746L (en) 1985-02-28
FR2555597B1 (fr) 1987-08-07
JPS60100143A (ja) 1985-06-04
US4515887A (en) 1985-05-07
DE3424216C2 (de) 1993-10-21
IE55344B1 (en) 1990-08-15
DE3424216A1 (de) 1985-03-07
KR850001797A (ko) 1985-04-01
GB2145728B (en) 1987-07-01
GB2145728A (en) 1985-04-03
KR900008949B1 (ko) 1990-12-15
JPH0797214B2 (ja) 1995-10-18
MX168017B (es) 1993-04-28
FR2555597A1 (fr) 1985-05-31

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Free format text: HUELS AMERICA INC. (A DELAWARE CORPORATION)

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Free format text: MICROSI, INC. (A DELAWARE CORPORATION)

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