NL191267C - Inrichting voor het met plasma bewerken van een substraat. - Google Patents

Inrichting voor het met plasma bewerken van een substraat.

Info

Publication number
NL191267C
NL191267C NL8102172A NL8102172A NL191267C NL 191267 C NL191267 C NL 191267C NL 8102172 A NL8102172 A NL 8102172A NL 8102172 A NL8102172 A NL 8102172A NL 191267 C NL191267 C NL 191267C
Authority
NL
Netherlands
Prior art keywords
substrate
plasma processing
plasma
processing
Prior art date
Application number
NL8102172A
Other languages
English (en)
Dutch (nl)
Other versions
NL191267B (nl
NL8102172A (nl
Original Assignee
Nippon Telegraph & Telephone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5787780A external-priority patent/JPS56155535A/ja
Priority claimed from JP1898681A external-priority patent/JPS57133636A/ja
Application filed by Nippon Telegraph & Telephone filed Critical Nippon Telegraph & Telephone
Publication of NL8102172A publication Critical patent/NL8102172A/nl
Publication of NL191267B publication Critical patent/NL191267B/xx
Application granted granted Critical
Publication of NL191267C publication Critical patent/NL191267C/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/826—Coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
NL8102172A 1980-05-02 1981-05-01 Inrichting voor het met plasma bewerken van een substraat. NL191267C (nl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP5787780A JPS56155535A (en) 1980-05-02 1980-05-02 Film forming device utilizing plasma
JP5787780 1980-05-02
JP1898681A JPS57133636A (en) 1981-02-13 1981-02-13 Film forming device utilizing plasma at low temperature
JP1898681 1981-02-13

Publications (3)

Publication Number Publication Date
NL8102172A NL8102172A (nl) 1981-12-01
NL191267B NL191267B (nl) 1994-11-16
NL191267C true NL191267C (nl) 1995-04-18

Family

ID=26355770

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8102172A NL191267C (nl) 1980-05-02 1981-05-01 Inrichting voor het met plasma bewerken van een substraat.

Country Status (6)

Country Link
US (1) US4401054A (xx)
CA (1) CA1159012A (xx)
DE (1) DE3117252C2 (xx)
FR (1) FR2481838A1 (xx)
GB (1) GB2076587B (xx)
NL (1) NL191267C (xx)

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* Cited by examiner, † Cited by third party
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DE3117252A1 (de) 1982-08-12
GB2076587A (en) 1981-12-02
CA1159012A (en) 1983-12-20
US4401054A (en) 1983-08-30
FR2481838A1 (fr) 1981-11-06
FR2481838B1 (xx) 1984-09-07
NL191267B (nl) 1994-11-16
DE3117252C2 (de) 1992-03-12
NL8102172A (nl) 1981-12-01

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