NL1011241C2 - Werkwijze voor het vervaardigen van een micro-aandrijver voor een inktjetkop. - Google Patents
Werkwijze voor het vervaardigen van een micro-aandrijver voor een inktjetkop. Download PDFInfo
- Publication number
- NL1011241C2 NL1011241C2 NL1011241A NL1011241A NL1011241C2 NL 1011241 C2 NL1011241 C2 NL 1011241C2 NL 1011241 A NL1011241 A NL 1011241A NL 1011241 A NL1011241 A NL 1011241A NL 1011241 C2 NL1011241 C2 NL 1011241C2
- Authority
- NL
- Netherlands
- Prior art keywords
- plate
- oxide
- oxide piezoelectric
- portions
- photoresist film
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 177
- 238000005530 etching Methods 0.000 claims abstract description 74
- 238000000059 patterning Methods 0.000 claims abstract description 62
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 27
- 238000010030 laminating Methods 0.000 claims abstract description 22
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 71
- 239000011248 coating agent Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 32
- 239000000919 ceramic Substances 0.000 claims description 31
- 238000005245 sintering Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 21
- 239000002002 slurry Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 13
- 238000004090 dissolution Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 70
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 88
- 239000000243 solution Substances 0.000 description 28
- 238000012545 processing Methods 0.000 description 11
- 238000003754 machining Methods 0.000 description 10
- 238000007650 screen-printing Methods 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 239000012487 rinsing solution Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007792 gaseous phase Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910003781 PbTiO3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/016—Method or apparatus with etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980005096A KR100540644B1 (ko) | 1998-02-19 | 1998-02-19 | 마이크로 엑츄에이터 제조방법 |
| KR19980005096 | 1998-02-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL1011241A1 NL1011241A1 (nl) | 1999-08-20 |
| NL1011241C2 true NL1011241C2 (nl) | 2000-08-22 |
Family
ID=19533349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL1011241A NL1011241C2 (nl) | 1998-02-19 | 1999-02-08 | Werkwijze voor het vervaardigen van een micro-aandrijver voor een inktjetkop. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6256849B1 (zh) |
| JP (1) | JPH11277754A (zh) |
| KR (1) | KR100540644B1 (zh) |
| CN (1) | CN1096358C (zh) |
| DE (1) | DE19859498C2 (zh) |
| GB (1) | GB2334483B (zh) |
| NL (1) | NL1011241C2 (zh) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6975296B1 (en) * | 1991-06-14 | 2005-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving the same |
| US6242289B1 (en) * | 1995-09-08 | 2001-06-05 | Semiconductor Energy Laboratories Co., Ltd. | Method for producing semiconductor device |
| JP3328609B2 (ja) * | 1998-12-30 | 2002-09-30 | 三星電子株式会社 | インクジェットプリンタヘッドアクチュエータ及びその製造方法 |
| US6351057B1 (en) * | 1999-01-25 | 2002-02-26 | Samsung Electro-Mechanics Co., Ltd | Microactuator and method for fabricating the same |
| KR100370638B1 (ko) * | 1999-07-13 | 2003-02-05 | 삼성전기주식회사 | 무진동판 압전/전왜 마이크로 액츄에이터 및 그 제조방법 |
| JP3389987B2 (ja) * | 1999-11-11 | 2003-03-24 | セイコーエプソン株式会社 | インクジェット式記録ヘッド及びその製造方法 |
| JP2001171133A (ja) | 1999-12-10 | 2001-06-26 | Samsung Electro Mech Co Ltd | インクジェットプリンタヘッドの製造方法 |
| JP2001260352A (ja) * | 2000-03-21 | 2001-09-25 | Matsushita Electric Ind Co Ltd | インクジェットヘッド及びその製造方法 |
| JP2002086725A (ja) * | 2000-07-11 | 2002-03-26 | Matsushita Electric Ind Co Ltd | インクジェットヘッド、その製造方法及びインクジェット式記録装置 |
| KR20020050894A (ko) * | 2000-12-22 | 2002-06-28 | 윤종용 | 피에조 어레이의 균일한 표면 및 최대 변위 구현방법 |
| JP2003046160A (ja) * | 2001-04-26 | 2003-02-14 | Matsushita Electric Ind Co Ltd | 圧電素子，アクチュエータ及びインクジェットヘッド |
| JP4434537B2 (ja) * | 2001-08-27 | 2010-03-17 | パナソニック株式会社 | 圧電機能部品 |
| US7050878B2 (en) | 2001-11-22 | 2006-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductror fabricating apparatus |
| US7133737B2 (en) | 2001-11-30 | 2006-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer |
| CN1248287C (zh) * | 2001-11-30 | 2006-03-29 | 株式会社半导体能源研究所 | 半导体设备的制造方法 |
| US7214573B2 (en) * | 2001-12-11 | 2007-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device that includes patterning sub-islands |
| JP3992976B2 (ja) | 2001-12-21 | 2007-10-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4030758B2 (ja) * | 2001-12-28 | 2008-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7052117B2 (en) | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
| JP2004066496A (ja) * | 2002-08-01 | 2004-03-04 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
| KR20040018764A (ko) * | 2002-08-27 | 2004-03-04 | 현대계전엔지니어링(주) | 2-포트 측정을 위한 박막형 공진기의 전극 및 그제조방법 |
| TW553837B (en) * | 2002-09-23 | 2003-09-21 | Nanodynamics Inc | Piezoelectric inkjet head and formation method of vibration layer thereof |
| US7111928B2 (en) * | 2003-05-23 | 2006-09-26 | Kyocera Corporation | Piezoelectric ink jet head |
| US7281778B2 (en) | 2004-03-15 | 2007-10-16 | Fujifilm Dimatix, Inc. | High frequency droplet ejection device and method |
| US8491076B2 (en) | 2004-03-15 | 2013-07-23 | Fujifilm Dimatix, Inc. | Fluid droplet ejection devices and methods |
| KR100612800B1 (ko) * | 2004-06-10 | 2006-08-18 | 한국과학기술연구원 | 전계에 의한 응력발생을 감소시킬 수 있도록 구성된 압전적층 액추에이터 |
| JP4447974B2 (ja) * | 2004-06-28 | 2010-04-07 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
| DE102004059965A1 (de) * | 2004-12-13 | 2006-06-14 | Epcos Ag | Dünnschichtresonator und Verfahren zur Herstellung eines Vielschichtbauelements |
| US8708441B2 (en) | 2004-12-30 | 2014-04-29 | Fujifilm Dimatix, Inc. | Ink jet printing |
| JP2007050636A (ja) * | 2005-08-19 | 2007-03-01 | Fujifilm Corp | 液体吐出ヘッドおよび画像記録装置ならびに液体吐出ヘッドの製造方法 |
| JP4911669B2 (ja) * | 2005-12-13 | 2012-04-04 | 富士フイルム株式会社 | 圧電アクチュエータ、液体吐出ヘッドの製造方法及び液体吐出ヘッド並びに画像形成装置 |
| JP5038065B2 (ja) * | 2006-09-08 | 2012-10-03 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
| US7935264B2 (en) * | 2006-09-08 | 2011-05-03 | Canon Kabushiki Kaisha | Liquid discharge head and method of manufacturing the same |
| JP4296441B2 (ja) * | 2006-10-11 | 2009-07-15 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法 |
| US7988247B2 (en) | 2007-01-11 | 2011-08-02 | Fujifilm Dimatix, Inc. | Ejection of drops having variable drop size from an ink jet printer |
| JP4784611B2 (ja) | 2008-01-31 | 2011-10-05 | ブラザー工業株式会社 | 圧電アクチュエータの製造方法及び液体移送装置の製造方法 |
| JP5754129B2 (ja) * | 2010-03-11 | 2015-07-29 | セイコーエプソン株式会社 | 圧電素子、圧電センサー、電子機器、および圧電素子の製造方法 |
| CN102906891A (zh) * | 2010-05-26 | 2013-01-30 | 日本碍子株式会社 | 压电元件的制造方法 |
| CN104417065B (zh) * | 2013-09-10 | 2016-03-02 | 珠海赛纳打印科技股份有限公司 | 喷墨头制造方法、喷墨头及打印设备 |
| JP2015150713A (ja) * | 2014-02-12 | 2015-08-24 | セイコーエプソン株式会社 | 液体噴射ヘッド、及び、液体噴射装置 |
| JP5757354B2 (ja) * | 2014-04-09 | 2015-07-29 | ブラザー工業株式会社 | 圧電アクチュエータの製造方法及び液体移送装置の製造方法 |
| CN104015485B (zh) * | 2014-04-24 | 2016-03-30 | 大连理工大学 | 液体喷头制造方法、液体喷头和打印装置 |
| US9755139B2 (en) * | 2014-06-30 | 2017-09-05 | Texas Instruments Incorporated | Piezoeletric wet etch process with reduced resist lifting and controlled undercut |
| CN107175885A (zh) * | 2016-03-13 | 2017-09-19 | 康代有限公司 | 用于将油墨打印在衬底上的打印机和方法 |
| IT201700010342A1 (it) * | 2017-01-31 | 2018-07-31 | St Microelectronics Srl | Dispositivo mems includente un attuatore piezoelettrico con un volume ridotto |
| GB2571361B (en) * | 2018-03-02 | 2020-04-22 | Novosound Ltd | Ultrasound array transducer manufacturing |
| JP2022052115A (ja) * | 2020-09-23 | 2022-04-04 | セイコーエプソン株式会社 | 圧電アクチュエーターの製造方法、圧電アクチュエーターおよびロボット |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0786345A2 (en) * | 1996-01-26 | 1997-07-30 | Seiko Epson Corporation | Ink jet recording head and manufacturing method therefor |
| EP0791459A2 (en) * | 1996-02-22 | 1997-08-27 | Seiko Epson Corporation | Ink-jet recording head, ink-jet recording apparatus using the same, and method for producing ink-jet recording head |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54142085A (en) * | 1978-04-27 | 1979-11-05 | Seiko Instr & Electronics Ltd | Piezoelectric oscillator |
| JPS5586118A (en) * | 1978-12-23 | 1980-06-28 | Fujitsu Ltd | Alignment mark formation |
| JPH021996A (ja) * | 1988-06-10 | 1990-01-08 | Fuji Electric Co Ltd | 圧電セラミックス用エッチング溶液 |
| GB8913090D0 (en) * | 1989-06-07 | 1989-07-26 | Ciba Geigy Ag | Method |
| SU1688113A1 (ru) * | 1989-06-21 | 1991-10-30 | Предприятие П/Я Г-4149 | Способ изготовлени записывающей головки струйного типа |
| KR950000114B1 (ko) * | 1991-12-24 | 1995-01-09 | 한국과학기술연구원 | Plzt계 경사기능 압전 액츄에이터 및 그 제조방법 |
| WO1993022140A1 (en) * | 1992-04-23 | 1993-11-11 | Seiko Epson Corporation | Liquid jet head and production thereof |
| JP3527754B2 (ja) * | 1992-04-27 | 2004-05-17 | 日本精化株式会社 | ラノリン脂肪酸類の分離法及びそれらを用いた化粧料及び外用薬 |
| DE4234237C2 (de) * | 1992-10-10 | 2000-11-30 | Bosch Gmbh Robert | Temperaturkompensierter Mikroaktor |
| US5459501A (en) * | 1993-02-01 | 1995-10-17 | At&T Global Information Solutions Company | Solid-state ink-jet print head |
| JPH07335951A (ja) * | 1994-06-14 | 1995-12-22 | Philips Japan Ltd | 圧電アクチュエータ |
| JPH08186302A (ja) * | 1994-10-31 | 1996-07-16 | Honda Motor Co Ltd | 還元性ガスに感応する圧電アクチュエータ |
| JP3192357B2 (ja) | 1995-09-29 | 2001-07-23 | シャープ株式会社 | インクジェット記録ヘッド用圧電アクチュエータ及びその製造方法 |
| US5658469A (en) * | 1995-12-11 | 1997-08-19 | Quantum Peripherals Colorado, Inc. | Method for forming re-entrant photoresist lift-off profile for thin film device processing and a thin film device made thereby |
| JPH10100405A (ja) | 1996-09-27 | 1998-04-21 | Citizen Watch Co Ltd | インクジェットプリンタヘッドとその製造方法 |
-
1998
- 1998-02-19 KR KR1019980005096A patent/KR100540644B1/ko not_active IP Right Cessation
- 1998-12-18 US US09/215,955 patent/US6256849B1/en not_active Expired - Fee Related
- 1998-12-22 DE DE19859498A patent/DE19859498C2/de not_active Expired - Fee Related
- 1998-12-22 CN CN98125864A patent/CN1096358C/zh not_active Expired - Fee Related
- 1998-12-25 JP JP10369872A patent/JPH11277754A/ja active Pending
-
1999
- 1999-02-08 NL NL1011241A patent/NL1011241C2/nl not_active IP Right Cessation
- 1999-02-10 GB GB9902909A patent/GB2334483B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0786345A2 (en) * | 1996-01-26 | 1997-07-30 | Seiko Epson Corporation | Ink jet recording head and manufacturing method therefor |
| EP0791459A2 (en) * | 1996-02-22 | 1997-08-27 | Seiko Epson Corporation | Ink-jet recording head, ink-jet recording apparatus using the same, and method for producing ink-jet recording head |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100540644B1 (ko) | 2006-02-28 |
| DE19859498C2 (de) | 2003-03-20 |
| JPH11277754A (ja) | 1999-10-12 |
| GB2334483B (en) | 2000-11-08 |
| KR19990070321A (ko) | 1999-09-15 |
| US6256849B1 (en) | 2001-07-10 |
| NL1011241A1 (nl) | 1999-08-20 |
| CN1226478A (zh) | 1999-08-25 |
| DE19859498A1 (de) | 1999-08-26 |
| CN1096358C (zh) | 2002-12-18 |
| GB2334483A (en) | 1999-08-25 |
| GB9902909D0 (en) | 1999-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NL1011241C2 (nl) | Werkwijze voor het vervaardigen van een micro-aandrijver voor een inktjetkop. | |
| EP1459900B1 (en) | Method for forming a piezoelectric actuator for an ink-jet printhead | |
| US9114613B2 (en) | Liquid-ejecting head, liquid-ejecting apparatus, and piezoelectric device | |
| JP6478266B2 (ja) | 圧電体膜利用装置 | |
| JP2007019084A (ja) | 圧電素子の製造方法及び液体噴射ヘッドの製造方法 | |
| US6254223B1 (en) | Ink jet printer head actuator and manufacturing method thereof | |
| JP4804760B2 (ja) | 積層型圧電構造体の製造方法 | |
| JPH09181368A (ja) | 積層型アクチュエータとその配線方法 | |
| JP3313531B2 (ja) | 圧電／電歪膜型素子及びその製造方法 | |
| US6530652B1 (en) | Micro actuator and ink jet printer head manufactured using the same | |
| JP2004096068A (ja) | 圧電素子、圧電アクチュエータ、及び、液体噴射ヘッド | |
| NL1011157C2 (nl) | Werkwijze voor het vervaardigen van een aandrijver van een inktjetprinterkop. | |
| JP2004336981A (ja) | 圧電アクチュエータおよびインクジェット記録ヘッド | |
| KR100289606B1 (ko) | 잉크젯 프린트헤드용 챔버판의 패터닝방법과 그에 의해 제조되는 액츄에이터 | |
| JP5168717B2 (ja) | 圧電体素子、インクジェット式記録ヘッド、及びインクジェットプリンタ | |
| KR100374589B1 (ko) | 마이크로 액츄에이터 및 이를 적용한 잉크젯 프린터 헤드 | |
| JP3666506B2 (ja) | インクジェット記録装置の製造方法 | |
| GB2345882A (en) | Forming an oxide piezoelectric element(s) and upper electrode layer(s) of an inkjet printhead microactuator using a photoresist film(s) and etching process | |
| JP2007326195A (ja) | 電極基板、静電アクチュエータ、液滴吐出ヘッド、液滴吐出装置及び静電駆動デバイス並びにそれらの製造方法 | |
| KR100327251B1 (ko) | 잉크젯 프린트헤드 액츄에이터와 그의 제조방법 | |
| JP3804415B2 (ja) | インクジェット式記録ヘッド | |
| JPH09290506A (ja) | インクジェットヘッド及びインクジェットヘッド用振動板の製造方法 | |
| EP1378364A1 (en) | Liquid discharge head and manufacturing method thereof | |
| KR100327250B1 (ko) | 잉크젯 프린트헤드의 마이크로 액츄에이터와 그의 제조방법 | |
| JPH11163434A (ja) | 圧電体素子の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20000621 |
|
| PD2B | A search report has been drawn up | ||
| SD | Assignments of patents |
Owner name: SAMSUNG ELECTRONICS CO., LTD. |
|
| VD1 | Lapsed due to non-payment of the annual fee |
Effective date: 20090901 |