JP4784611B2 - 圧電アクチュエータの製造方法及び液体移送装置の製造方法 - Google Patents
圧電アクチュエータの製造方法及び液体移送装置の製造方法 Download PDFInfo
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Description
10 圧力室
21 キャビティプレート
32 圧電アクチュエータ
41 振動層
42 圧電層
43 共通電極
44 個別電極
71 圧電層
72 圧電層
73 共通電極
74 個別電極
Claims (7)
- 金属又はシリコンからなる基材の一表面に、セラミックス材料からなる振動層を成膜する振動層成膜工程と、
前記振動層の前記基材と反対側に、圧電層を成膜する圧電層成膜工程と、
前記圧電層成膜工程よりも後に行われる工程であって、前記基材の一部を除去することで、前記基材の前記振動層とは反対側から前記振動層を臨むことのできる貫通孔を形成する貫通孔形成工程と、
前記圧電層の少なくとも前記貫通孔と対向する部分に電極を形成する電極形成工程と、
前記貫通孔形成工程よりも後に行われる工程であって、前記圧電層を加熱する加熱工程とを備えていることを特徴とする圧電アクチュエータの製造方法。 - 前記圧電層成膜工程において、前記圧電層はエアロゾルデポジション法によって成膜されることを特徴とする請求項1に記載の圧電アクチュエータの製造方法。
- 前記振動層成膜工程において、前記振動板はエアロゾルデポジション法によって成膜されることを特徴とする請求項1又は2に記載の圧電アクチュエータの製造方法。
- 前記貫通孔形成工程において、前記貫通孔はエッチングにより形成されることを特徴とする請求項1〜3のいずれかに記載の圧電アクチュエータの製造方法。
- 前記電極形成工程が、前記圧電層の前記振動層と反対側に露出する露出電極を形成する露出電極形成工程を含んでおり、
この露出電極形成工程は、前記貫通孔形成工程よりも後に行われることを特徴とする請求項4に記載の圧電アクチュエータの製造方法。 - 前記電極形成工程を、前記加熱工程よりも前に行うことを特徴とする請求項1〜5のいずれかに記載の圧電アクチュエータの製造方法。
- 金属又はシリコンからなり、圧力室が形成される圧力室プレートの一表面に、セラミックス材料からなる振動層を成膜する振動層成膜工程と、
前記振動層の前記圧力室プレートと反対側に、圧電層を成膜する圧電層成膜工程と、
前記圧電層成膜工程よりも後に行われる工程であって、前記圧力室プレートの一部を除去することで、前記基材の前記振動板とは反対側から前記振動層を臨むことのできる圧力室を形成する圧力室形成工程と、
前記圧電層の少なくとも圧力室と対向する部分に電極を形成する電極形成工程と、
前記圧力室形成工程よりも後に行われる工程であって、前記圧電層を加熱する加熱工程とを備えていることを特徴とする液体移送装置の製造方法。
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US12/364,500 US8973228B2 (en) | 2008-01-31 | 2009-02-02 | Method for producing piezoelectric actuator and method for producing liquid transport apparatus |
US14/604,225 US9623656B2 (en) | 2008-01-31 | 2015-01-23 | Method for producing piezoelectric actuator and method for producing liquid transport apparatus |
US15/454,074 US11571897B2 (en) | 2008-01-31 | 2017-03-09 | Method for producing piezoelectric actuator and method for producing liquid transport apparatus |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012144305A1 (ja) | 2011-04-18 | 2012-10-26 | コニカミノルタホールディングス株式会社 | 圧電アクチュエータおよびそれを備えたインクジェットヘッド |
JP6252013B2 (ja) | 2013-07-29 | 2017-12-27 | セイコーエプソン株式会社 | 液体吐出ヘッド、及び、液体吐出装置 |
JP2015135980A (ja) * | 2015-03-06 | 2015-07-27 | ブラザー工業株式会社 | インクジェットヘッド |
WO2018057028A1 (en) * | 2016-09-26 | 2018-03-29 | Hewlett-Packard Development Company, L.P. | Thin film stacks |
JP7215019B2 (ja) * | 2018-08-30 | 2023-01-31 | ブラザー工業株式会社 | 液体吐出ヘッド |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3634148A (en) * | 1969-02-13 | 1972-01-11 | Bethlehem Steel Corp | Method for producing nonoriented silicon electrical sheet steel |
JPS59169215A (ja) * | 1983-03-16 | 1984-09-25 | Nec Corp | 薄膜圧電振動子の製造方法 |
US4997482A (en) * | 1987-01-02 | 1991-03-05 | Dow Corning Corporation | Coating composition containing hydrolyzed silicate esters and other metal oxide precursors |
GB8902788D0 (en) * | 1989-02-08 | 1989-03-30 | Elmwood Sensors | Ceramic material and process for its production |
DE69610482T2 (de) * | 1995-07-14 | 2001-02-01 | Seiko Epson Corp | Laminierter druckkopf für das tintenstrahlaufzeichnen, herstellungsverfahren dafür und mit dem aufzeichnungskopf ausgerüsteter drucker |
US6093493A (en) * | 1997-07-03 | 2000-07-25 | Ciba Specialty Chemicals Corp. | Method for the coating or encapsulation of fluidizable substrates |
KR100540644B1 (ko) * | 1998-02-19 | 2006-02-28 | 삼성전자주식회사 | 마이크로 엑츄에이터 제조방법 |
US6254223B1 (en) * | 1998-10-21 | 2001-07-03 | Samsung Electro-Mechanics Co., Ltd | Ink jet printer head actuator and manufacturing method thereof |
JP2001024248A (ja) * | 1999-07-07 | 2001-01-26 | Samsung Electro Mech Co Ltd | 低温焼成法による多層圧電/電歪セラミックアクチュエータの製造方法及びその方法によって製造された多層圧電/電歪セラミックアクチュエータ |
KR100370638B1 (ko) * | 1999-07-13 | 2003-02-05 | 삼성전기주식회사 | 무진동판 압전/전왜 마이크로 액츄에이터 및 그 제조방법 |
JP4006562B2 (ja) | 2000-02-21 | 2007-11-14 | セイコーエプソン株式会社 | 圧電体素子、インクジェット式記録ヘッド及びこれらの製造方法並びにインクジェットプリンタ |
US6943112B2 (en) * | 2002-07-22 | 2005-09-13 | Asm Nutool, Inc. | Defect-free thin and planar film processing |
US6796637B2 (en) * | 2002-05-28 | 2004-09-28 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive film type actuator and method for manufacturing the same |
TWI222408B (en) * | 2002-12-03 | 2004-10-21 | Nanodynamics Inc | Pressure chamber of a piezoelectric ink jet print head and fabrication method thereof |
JP3952010B2 (ja) * | 2003-12-03 | 2007-08-01 | セイコーエプソン株式会社 | インクジェットヘッドの製造方法 |
JP4609182B2 (ja) | 2004-05-19 | 2011-01-12 | ブラザー工業株式会社 | 圧電アクチュエータ、この圧電アクチュエータを備えたインクジェットヘッド、及び、圧電アクチュエータの製造方法 |
EP1598191B1 (en) | 2004-05-19 | 2011-05-18 | Brother Kogyo Kabushiki Kaisha | Piezoelectric actuator, ink-jet head provided with the same, ink-jet printer and method for manufacturing piezoelectric actuator |
US7419252B2 (en) | 2004-07-13 | 2008-09-02 | Brother Kogyo Kabushiki Kaisha | Ink jet head, piezo-electric actuator, and method of manufacturing them |
JP2006054442A (ja) * | 2004-07-13 | 2006-02-23 | Brother Ind Ltd | 圧電アクチュエータ及びインクジェットヘッドの製造方法、圧電アクチュエータ及びインクジェットヘッド |
US20060012646A1 (en) | 2004-07-13 | 2006-01-19 | Brother Kogyo Kabushiki Kaisha | Piezoelectric actuator, ink jet head, and method of manufacturing them |
US7233174B2 (en) * | 2004-07-19 | 2007-06-19 | Texas Instruments Incorporated | Dual polarity, high input voltage swing comparator using MOS input transistors |
JP4868200B2 (ja) * | 2004-09-22 | 2012-02-01 | ブラザー工業株式会社 | 圧電アクチュエータおよびインクジェットヘッドの製造方法 |
US7540084B2 (en) * | 2004-09-30 | 2009-06-02 | Brother Kogyo Kabushiki Kaisha | Method for manufacturing ink-jet heads |
JP5089860B2 (ja) | 2004-12-03 | 2012-12-05 | 富士フイルム株式会社 | 圧電アクチュエータ及び液体吐出ヘッド |
JP4664054B2 (ja) * | 2004-12-09 | 2011-04-06 | 富士フイルム株式会社 | 成膜装置 |
JP4534137B2 (ja) * | 2004-12-20 | 2010-09-01 | 富士フイルム株式会社 | 液体吐出ヘッド及びその製造方法 |
JP2006261656A (ja) * | 2005-02-21 | 2006-09-28 | Brother Ind Ltd | 圧電アクチュエータおよびその製造方法 |
DE602006017457D1 (de) | 2005-02-21 | 2010-11-25 | Brother Ind Ltd | Verfahren zur Herstellung eines piezoelektrischen Aktors |
WO2006109501A1 (ja) | 2005-03-18 | 2006-10-19 | Ngk Insulators, Ltd. | 圧電素子の検査方法、検査装置及び分極処理方法 |
JP4911907B2 (ja) * | 2005-03-25 | 2012-04-04 | 京セラ株式会社 | 圧電アクチュエータ及び液体吐出装置 |
JP3903056B2 (ja) | 2005-06-20 | 2007-04-11 | キヤノン株式会社 | 圧電素子の製造方法および液体噴射記録ヘッドの製造方法 |
JP5004797B2 (ja) | 2005-06-29 | 2012-08-22 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
JP4911669B2 (ja) * | 2005-12-13 | 2012-04-04 | 富士フイルム株式会社 | 圧電アクチュエータ、液体吐出ヘッドの製造方法及び液体吐出ヘッド並びに画像形成装置 |
KR100682964B1 (ko) | 2006-02-09 | 2007-02-15 | 삼성전자주식회사 | 잉크젯 헤드의 압전 액츄에이터 형성 방법 |
JP2007251056A (ja) * | 2006-03-17 | 2007-09-27 | Fujifilm Corp | 圧電アクチュエータの製造方法、液体吐出ヘッドの製造方法、画像形成装置の製造方法、圧電アクチュエータ構造体、液体吐出ヘッドおよび画像形装置 |
JP5052810B2 (ja) | 2006-03-31 | 2012-10-17 | 富士フイルム株式会社 | 液体吐出ヘッド、画像形成装置、および、液体吐出ヘッドの製造方法 |
JP2007276151A (ja) | 2006-04-03 | 2007-10-25 | Canon Inc | インクジェットプリンタヘッド |
JP5188076B2 (ja) | 2006-04-03 | 2013-04-24 | キヤノン株式会社 | 圧電素子及びその製造方法、電子デバイス、インクジェット装置 |
JP5245107B2 (ja) | 2006-05-09 | 2013-07-24 | キヤノン株式会社 | 圧電素子、圧電アクチュエータ、インクジェット式記録ヘッド |
US7456548B2 (en) | 2006-05-09 | 2008-11-25 | Canon Kabushiki Kaisha | Piezoelectric element, piezoelectric actuator, and ink jet recording head |
US20080022294A1 (en) * | 2006-07-21 | 2008-01-24 | Perrin Stephen L | Matching users with wirelessly downloaded video and audio content |
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