NL1011241A1 - Werkwijze voor het vervaardigen van een micro-aandrijver voor een inktjetkop. - Google Patents
Werkwijze voor het vervaardigen van een micro-aandrijver voor een inktjetkop.Info
- Publication number
- NL1011241A1 NL1011241A1 NL1011241A NL1011241A NL1011241A1 NL 1011241 A1 NL1011241 A1 NL 1011241A1 NL 1011241 A NL1011241 A NL 1011241A NL 1011241 A NL1011241 A NL 1011241A NL 1011241 A1 NL1011241 A1 NL 1011241A1
- Authority
- NL
- Netherlands
- Prior art keywords
- patterning
- oxide piezoelectric
- electrode layer
- upper electrodes
- desired pattern
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 abstract 6
- 238000000059 patterning Methods 0.000 abstract 5
- 238000005530 etching Methods 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/016—Method or apparatus with etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19980005096 | 1998-02-19 | ||
KR1019980005096A KR100540644B1 (ko) | 1998-02-19 | 1998-02-19 | 마이크로 엑츄에이터 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL1011241A1 true NL1011241A1 (nl) | 1999-08-20 |
NL1011241C2 NL1011241C2 (nl) | 2000-08-22 |
Family
ID=19533349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1011241A NL1011241C2 (nl) | 1998-02-19 | 1999-02-08 | Werkwijze voor het vervaardigen van een micro-aandrijver voor een inktjetkop. |
Country Status (7)
Country | Link |
---|---|
US (1) | US6256849B1 (nl) |
JP (1) | JPH11277754A (nl) |
KR (1) | KR100540644B1 (nl) |
CN (1) | CN1096358C (nl) |
DE (1) | DE19859498C2 (nl) |
GB (1) | GB2334483B (nl) |
NL (1) | NL1011241C2 (nl) |
Families Citing this family (47)
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US6975296B1 (en) * | 1991-06-14 | 2005-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving the same |
US6242289B1 (en) | 1995-09-08 | 2001-06-05 | Semiconductor Energy Laboratories Co., Ltd. | Method for producing semiconductor device |
JP3328609B2 (ja) * | 1998-12-30 | 2002-09-30 | 三星電子株式会社 | インクジェットプリンタヘッドアクチュエータ及びその製造方法 |
US6351057B1 (en) * | 1999-01-25 | 2002-02-26 | Samsung Electro-Mechanics Co., Ltd | Microactuator and method for fabricating the same |
KR100370638B1 (ko) * | 1999-07-13 | 2003-02-05 | 삼성전기주식회사 | 무진동판 압전/전왜 마이크로 액츄에이터 및 그 제조방법 |
JP3389987B2 (ja) | 1999-11-11 | 2003-03-24 | セイコーエプソン株式会社 | インクジェット式記録ヘッド及びその製造方法 |
JP2001171133A (ja) | 1999-12-10 | 2001-06-26 | Samsung Electro Mech Co Ltd | インクジェットプリンタヘッドの製造方法 |
JP2001260352A (ja) * | 2000-03-21 | 2001-09-25 | Matsushita Electric Ind Co Ltd | インクジェットヘッド及びその製造方法 |
JP2002086725A (ja) * | 2000-07-11 | 2002-03-26 | Matsushita Electric Ind Co Ltd | インクジェットヘッド、その製造方法及びインクジェット式記録装置 |
KR20020050894A (ko) * | 2000-12-22 | 2002-06-28 | 윤종용 | 피에조 어레이의 균일한 표면 및 최대 변위 구현방법 |
JP2003046160A (ja) * | 2001-04-26 | 2003-02-14 | Matsushita Electric Ind Co Ltd | 圧電素子,アクチュエータ及びインクジェットヘッド |
JP4434537B2 (ja) * | 2001-08-27 | 2010-03-17 | パナソニック株式会社 | 圧電機能部品 |
US7050878B2 (en) | 2001-11-22 | 2006-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductror fabricating apparatus |
KR100967824B1 (ko) * | 2001-11-30 | 2010-07-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제작방법 |
US7133737B2 (en) | 2001-11-30 | 2006-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer |
US7214573B2 (en) * | 2001-12-11 | 2007-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device that includes patterning sub-islands |
JP3992976B2 (ja) * | 2001-12-21 | 2007-10-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4030758B2 (ja) * | 2001-12-28 | 2008-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7052117B2 (en) | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
JP2004066496A (ja) * | 2002-08-01 | 2004-03-04 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
KR20040018764A (ko) * | 2002-08-27 | 2004-03-04 | 현대계전엔지니어링(주) | 2-포트 측정을 위한 박막형 공진기의 전극 및 그제조방법 |
TW553837B (en) * | 2002-09-23 | 2003-09-21 | Nanodynamics Inc | Piezoelectric inkjet head and formation method of vibration layer thereof |
US7111928B2 (en) * | 2003-05-23 | 2006-09-26 | Kyocera Corporation | Piezoelectric ink jet head |
US7281778B2 (en) | 2004-03-15 | 2007-10-16 | Fujifilm Dimatix, Inc. | High frequency droplet ejection device and method |
US8491076B2 (en) | 2004-03-15 | 2013-07-23 | Fujifilm Dimatix, Inc. | Fluid droplet ejection devices and methods |
KR100612800B1 (ko) * | 2004-06-10 | 2006-08-18 | 한국과학기술연구원 | 전계에 의한 응력발생을 감소시킬 수 있도록 구성된 압전적층 액추에이터 |
JP4447974B2 (ja) * | 2004-06-28 | 2010-04-07 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
DE102004059965A1 (de) * | 2004-12-13 | 2006-06-14 | Epcos Ag | Dünnschichtresonator und Verfahren zur Herstellung eines Vielschichtbauelements |
KR20070087223A (ko) | 2004-12-30 | 2007-08-27 | 후지필름 디마틱스, 인크. | 잉크 분사 프린팅 |
JP2007050636A (ja) * | 2005-08-19 | 2007-03-01 | Fujifilm Corp | 液体吐出ヘッドおよび画像記録装置ならびに液体吐出ヘッドの製造方法 |
JP4911669B2 (ja) * | 2005-12-13 | 2012-04-04 | 富士フイルム株式会社 | 圧電アクチュエータ、液体吐出ヘッドの製造方法及び液体吐出ヘッド並びに画像形成装置 |
JP5038065B2 (ja) * | 2006-09-08 | 2012-10-03 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
US7935264B2 (en) * | 2006-09-08 | 2011-05-03 | Canon Kabushiki Kaisha | Liquid discharge head and method of manufacturing the same |
JP4296441B2 (ja) * | 2006-10-11 | 2009-07-15 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法 |
US7988247B2 (en) | 2007-01-11 | 2011-08-02 | Fujifilm Dimatix, Inc. | Ejection of drops having variable drop size from an ink jet printer |
JP4784611B2 (ja) * | 2008-01-31 | 2011-10-05 | ブラザー工業株式会社 | 圧電アクチュエータの製造方法及び液体移送装置の製造方法 |
JP5754129B2 (ja) * | 2010-03-11 | 2015-07-29 | セイコーエプソン株式会社 | 圧電素子、圧電センサー、電子機器、および圧電素子の製造方法 |
US9240544B2 (en) * | 2010-05-26 | 2016-01-19 | Ngk Insulators, Ltd. | Method of manufacturing piezoelectric element |
CN104417065B (zh) * | 2013-09-10 | 2016-03-02 | 珠海赛纳打印科技股份有限公司 | 喷墨头制造方法、喷墨头及打印设备 |
JP2015150713A (ja) * | 2014-02-12 | 2015-08-24 | セイコーエプソン株式会社 | 液体噴射ヘッド、及び、液体噴射装置 |
JP5757354B2 (ja) * | 2014-04-09 | 2015-07-29 | ブラザー工業株式会社 | 圧電アクチュエータの製造方法及び液体移送装置の製造方法 |
CN104015485B (zh) * | 2014-04-24 | 2016-03-30 | 大连理工大学 | 液体喷头制造方法、液体喷头和打印装置 |
US9755139B2 (en) * | 2014-06-30 | 2017-09-05 | Texas Instruments Incorporated | Piezoeletric wet etch process with reduced resist lifting and controlled undercut |
TW201737771A (zh) * | 2016-03-13 | 2017-10-16 | 肯提克有限公司 | 用於將油墨列印在基材上的印表機和方法 |
IT201700010342A1 (it) * | 2017-01-31 | 2018-07-31 | St Microelectronics Srl | Dispositivo mems includente un attuatore piezoelettrico con un volume ridotto |
GB2571361B (en) * | 2018-03-02 | 2020-04-22 | Novosound Ltd | Ultrasound array transducer manufacturing |
JP2022052115A (ja) * | 2020-09-23 | 2022-04-04 | セイコーエプソン株式会社 | 圧電アクチュエーターの製造方法、圧電アクチュエーターおよびロボット |
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JPS54142085A (en) * | 1978-04-27 | 1979-11-05 | Seiko Instr & Electronics Ltd | Piezoelectric oscillator |
JPS5586118A (en) * | 1978-12-23 | 1980-06-28 | Fujitsu Ltd | Alignment mark formation |
JPH021996A (ja) * | 1988-06-10 | 1990-01-08 | Fuji Electric Co Ltd | 圧電セラミックス用エッチング溶液 |
GB8913090D0 (en) * | 1989-06-07 | 1989-07-26 | Ciba Geigy Ag | Method |
SU1688113A1 (ru) * | 1989-06-21 | 1991-10-30 | Предприятие П/Я Г-4149 | Способ изготовлени записывающей головки струйного типа |
KR950000114B1 (ko) * | 1991-12-24 | 1995-01-09 | 한국과학기술연구원 | Plzt계 경사기능 압전 액츄에이터 및 그 제조방법 |
WO1993022140A1 (en) * | 1992-04-23 | 1993-11-11 | Seiko Epson Corporation | Liquid jet head and production thereof |
JP3527754B2 (ja) * | 1992-04-27 | 2004-05-17 | 日本精化株式会社 | ラノリン脂肪酸類の分離法及びそれらを用いた化粧料及び外用薬 |
DE4234237C2 (de) * | 1992-10-10 | 2000-11-30 | Bosch Gmbh Robert | Temperaturkompensierter Mikroaktor |
US5459501A (en) * | 1993-02-01 | 1995-10-17 | At&T Global Information Solutions Company | Solid-state ink-jet print head |
JPH07335951A (ja) * | 1994-06-14 | 1995-12-22 | Philips Japan Ltd | 圧電アクチュエータ |
JPH08186302A (ja) * | 1994-10-31 | 1996-07-16 | Honda Motor Co Ltd | 還元性ガスに感応する圧電アクチュエータ |
JP3192357B2 (ja) | 1995-09-29 | 2001-07-23 | シャープ株式会社 | インクジェット記録ヘッド用圧電アクチュエータ及びその製造方法 |
US5658469A (en) * | 1995-12-11 | 1997-08-19 | Quantum Peripherals Colorado, Inc. | Method for forming re-entrant photoresist lift-off profile for thin film device processing and a thin film device made thereby |
JP3503386B2 (ja) * | 1996-01-26 | 2004-03-02 | セイコーエプソン株式会社 | インクジェット式記録ヘッド及びその製造方法 |
US6209992B1 (en) * | 1996-02-22 | 2001-04-03 | Seiko Epson Corporation | Ink-jet recording head, ink-jet recording apparatus using the same, and method for producing ink-jet recording head |
JPH10100405A (ja) | 1996-09-27 | 1998-04-21 | Citizen Watch Co Ltd | インクジェットプリンタヘッドとその製造方法 |
-
1998
- 1998-02-19 KR KR1019980005096A patent/KR100540644B1/ko not_active IP Right Cessation
- 1998-12-18 US US09/215,955 patent/US6256849B1/en not_active Expired - Fee Related
- 1998-12-22 CN CN98125864A patent/CN1096358C/zh not_active Expired - Fee Related
- 1998-12-22 DE DE19859498A patent/DE19859498C2/de not_active Expired - Fee Related
- 1998-12-25 JP JP10369872A patent/JPH11277754A/ja active Pending
-
1999
- 1999-02-08 NL NL1011241A patent/NL1011241C2/nl not_active IP Right Cessation
- 1999-02-10 GB GB9902909A patent/GB2334483B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2334483A (en) | 1999-08-25 |
KR100540644B1 (ko) | 2006-02-28 |
GB9902909D0 (en) | 1999-03-31 |
CN1096358C (zh) | 2002-12-18 |
CN1226478A (zh) | 1999-08-25 |
DE19859498A1 (de) | 1999-08-26 |
JPH11277754A (ja) | 1999-10-12 |
GB2334483B (en) | 2000-11-08 |
NL1011241C2 (nl) | 2000-08-22 |
KR19990070321A (ko) | 1999-09-15 |
US6256849B1 (en) | 2001-07-10 |
DE19859498C2 (de) | 2003-03-20 |
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