MY199738A - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- MY199738A MY199738A MYUI2021001392A MYUI2021001392A MY199738A MY 199738 A MY199738 A MY 199738A MY UI2021001392 A MYUI2021001392 A MY UI2021001392A MY UI2021001392 A MYUI2021001392 A MY UI2021001392A MY 199738 A MY199738 A MY 199738A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive resin
- resin composition
- copper
- pattern
- laminated
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/106—Esters of polycondensation macromers
- C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015179888 | 2015-09-11 | ||
| JP2015195984 | 2015-10-01 | ||
| JP2015199434 | 2015-10-07 | ||
| JP2015218912 | 2015-11-06 | ||
| JP2015257519 | 2015-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY199738A true MY199738A (en) | 2023-11-21 |
Family
ID=58239851
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYUI2021001392A MY199738A (en) | 2015-09-11 | 2016-09-07 | Photosensitive resin composition |
| MYUI2018700667A MY186932A (en) | 2015-09-11 | 2016-09-07 | Photosensitive resin composition |
| MYUI2021001391A MY200333A (en) | 2015-09-11 | 2016-09-07 | Photosensitive resin composition |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYUI2018700667A MY186932A (en) | 2015-09-11 | 2016-09-07 | Photosensitive resin composition |
| MYUI2021001391A MY200333A (en) | 2015-09-11 | 2016-09-07 | Photosensitive resin composition |
Country Status (6)
| Country | Link |
|---|---|
| JP (3) | JP6514346B2 (ja) |
| KR (3) | KR20180042842A (ja) |
| CN (3) | CN120044756A (ja) |
| MY (3) | MY199738A (ja) |
| TW (3) | TWI709815B (ja) |
| WO (1) | WO2017043544A1 (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6809873B2 (ja) * | 2015-12-28 | 2021-01-06 | 旭化成株式会社 | 積層体 |
| JP2019133143A (ja) * | 2018-01-30 | 2019-08-08 | 旭化成株式会社 | 感光性樹脂積層体及びレジストパターンの製造方法 |
| CN108205240B (zh) * | 2018-02-01 | 2021-05-07 | 浙江福斯特新材料研究院有限公司 | 一种高光敏性和优异掩孔性能的感光性树脂组合物及应用 |
| KR102655468B1 (ko) * | 2018-06-22 | 2024-04-05 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 레지스트 패턴의 형성 방법 |
| JP7422664B2 (ja) * | 2018-08-09 | 2024-01-26 | 旭化成株式会社 | 感光性樹脂組成物及びレジストパターンの形成方法 |
| JP2020076945A (ja) * | 2018-09-21 | 2020-05-21 | 旭化成株式会社 | 感光性樹脂組成物 |
| WO2021049241A1 (ja) * | 2019-09-13 | 2021-03-18 | 旭化成株式会社 | 感光性樹脂組成物、及び感光性エレメント |
| KR20250009559A (ko) * | 2019-11-11 | 2025-01-17 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 감광성 수지 적층체 |
| JP7769468B2 (ja) * | 2019-12-13 | 2025-11-13 | 旭化成株式会社 | 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム |
| CN115485621B (zh) * | 2020-04-28 | 2026-02-03 | 富士胶片株式会社 | 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法 |
| JP2020190735A (ja) * | 2020-07-14 | 2020-11-26 | 旭化成株式会社 | 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法及び導体パターン製造方法 |
| TWI818456B (zh) * | 2021-03-05 | 2023-10-11 | 日商旭化成股份有限公司 | 感光性樹脂積層體及其製造方法 |
| JP7631907B2 (ja) | 2021-03-08 | 2025-02-19 | 株式会社レゾナック | 感光性樹脂フィルム、感光性エレメント、及び、積層体の製造方法 |
| WO2023073799A1 (ja) * | 2021-10-26 | 2023-05-04 | 株式会社レゾナック | 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法 |
| KR102882784B1 (ko) * | 2022-03-31 | 2025-11-06 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 감광성 엘리먼트 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4646759B2 (ja) * | 2005-09-20 | 2011-03-09 | 旭化成イーマテリアルズ株式会社 | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
| JP4761909B2 (ja) * | 2005-10-05 | 2011-08-31 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び積層体 |
| JP2007226158A (ja) * | 2006-02-27 | 2007-09-06 | Asahi Kasei Electronics Co Ltd | ドライフィルムレジスト |
| CN101568883B (zh) * | 2006-12-27 | 2012-01-18 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法 |
| JP2008197160A (ja) * | 2007-02-08 | 2008-08-28 | Hitachi Chem Co Ltd | 半導体素子の層間絶縁膜用感光性樹脂組成物、それを用いた層間絶縁膜及び層間絶縁膜の製造方法 |
| CN101779165B (zh) | 2007-08-15 | 2014-09-24 | 旭化成电子材料株式会社 | 感光性树脂组合物及其层压体 |
| JP2011233769A (ja) | 2010-04-28 | 2011-11-17 | Mec Co Ltd | 銅配線パターンの形成方法 |
| CN106918991A (zh) * | 2010-07-13 | 2017-07-04 | 日立化成工业株式会社 | 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板 |
| KR101444044B1 (ko) * | 2010-12-16 | 2014-09-23 | 히타치가세이가부시끼가이샤 | 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
| MY179988A (en) * | 2010-12-24 | 2020-11-19 | Asahi Kasei E Mat Corporation | Photosensitive resin composition |
| JP2012226254A (ja) * | 2011-04-22 | 2012-11-15 | Asahi Kasei E-Materials Corp | ドライフィルムレジストロール |
| JP6064480B2 (ja) | 2011-10-26 | 2017-01-25 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP6113976B2 (ja) | 2012-08-29 | 2017-04-12 | 旭化成株式会社 | 感光性樹脂組成物 |
| JP2014182305A (ja) * | 2013-03-19 | 2014-09-29 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法及びプリント配線板の製造方法 |
| JP5673763B2 (ja) * | 2013-09-17 | 2015-02-18 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP6207943B2 (ja) * | 2013-09-19 | 2017-10-04 | 旭化成株式会社 | 感光性樹脂組成物及び感光性樹脂積層体 |
| JP6486672B2 (ja) * | 2013-12-20 | 2019-03-20 | 旭化成株式会社 | 感光性エレメント、及びその製造方法 |
| US10104781B2 (en) | 2013-12-27 | 2018-10-16 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| JP2015152854A (ja) * | 2014-02-18 | 2015-08-24 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法 |
| US10338468B2 (en) * | 2014-09-24 | 2019-07-02 | Asahi Kasei Kabushiki Kaisha | Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device |
| US20180051183A1 (en) * | 2016-08-17 | 2018-02-22 | Xerox Corporation | Seven-color ink set for a digital advanced lithographic imaging process |
-
2016
- 2016-09-07 KR KR1020187003696A patent/KR20180042842A/ko not_active Ceased
- 2016-09-07 KR KR1020197026060A patent/KR102443749B1/ko active Active
- 2016-09-07 WO PCT/JP2016/076342 patent/WO2017043544A1/ja not_active Ceased
- 2016-09-07 MY MYUI2021001392A patent/MY199738A/en unknown
- 2016-09-07 KR KR1020227031231A patent/KR102600211B1/ko active Active
- 2016-09-07 MY MYUI2018700667A patent/MY186932A/en unknown
- 2016-09-07 JP JP2017539202A patent/JP6514346B2/ja active Active
- 2016-09-07 CN CN202510195163.8A patent/CN120044756A/zh active Pending
- 2016-09-07 CN CN201680052525.7A patent/CN108027559B/zh active Active
- 2016-09-07 CN CN202111430178.6A patent/CN114296315B/zh active Active
- 2016-09-07 MY MYUI2021001391A patent/MY200333A/en unknown
- 2016-09-09 TW TW108118424A patent/TWI709815B/zh active
- 2016-09-09 TW TW105129243A patent/TWI691793B/zh active
- 2016-09-09 TW TW107132088A patent/TWI684067B/zh active
-
2018
- 2018-12-10 JP JP2018231215A patent/JP7026606B2/ja active Active
-
2021
- 2021-11-16 JP JP2021186549A patent/JP7340581B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201843527A (zh) | 2018-12-16 |
| KR20180042842A (ko) | 2018-04-26 |
| CN108027559A (zh) | 2018-05-11 |
| JP7340581B2 (ja) | 2023-09-07 |
| TWI684067B (zh) | 2020-02-01 |
| KR102600211B1 (ko) | 2023-11-08 |
| MY186932A (en) | 2021-08-26 |
| CN120044756A (zh) | 2025-05-27 |
| KR102443749B1 (ko) | 2022-09-15 |
| WO2017043544A1 (ja) | 2017-03-16 |
| MY200333A (en) | 2023-12-20 |
| CN114296315B (zh) | 2025-09-05 |
| TWI691793B (zh) | 2020-04-21 |
| TW201712433A (zh) | 2017-04-01 |
| CN108027559B (zh) | 2021-10-26 |
| JP2022027767A (ja) | 2022-02-14 |
| CN114296315A (zh) | 2022-04-08 |
| JP6514346B2 (ja) | 2019-05-15 |
| JP7026606B2 (ja) | 2022-02-28 |
| JPWO2017043544A1 (ja) | 2018-03-15 |
| JP2019105841A (ja) | 2019-06-27 |
| KR20220127382A (ko) | 2022-09-19 |
| TWI709815B (zh) | 2020-11-11 |
| TW201944171A (zh) | 2019-11-16 |
| KR20190105142A (ko) | 2019-09-11 |
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