MY193800A - Photosensitive resin laminate and method for manufacturing same - Google Patents
Photosensitive resin laminate and method for manufacturing sameInfo
- Publication number
- MY193800A MY193800A MYUI2020002645A MYUI2020002645A MY193800A MY 193800 A MY193800 A MY 193800A MY UI2020002645 A MYUI2020002645 A MY UI2020002645A MY UI2020002645 A MYUI2020002645 A MY UI2020002645A MY 193800 A MY193800 A MY 193800A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive resin
- resin composition
- laminate
- resin laminate
- composition layer
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000011342 resin composition Substances 0.000 abstract 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Provided is a laminate having a photosensitive resin composition provided on a base film, the photosensitive resin composition being capable of exhibiting both solubility in a developing solution, i.e., developing performance and adhesion performance with respect to a substrate, particularly a copper substrate. A photosensitive resin laminate provided with a support film and a photosensitive resin composition layer containing a photosensitive resin composition formed on the support film, wherein the photosensitive resin laminate is characterized in that: the photosensitive resin composition contains (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) a photopolymerization initiator, and (D) iron atoms; and the iron atom content of the photosensitive resin composition layer is 0.01-10 ppm inclusive with respect to the photosensitive resin composition layer.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018006341 | 2018-01-18 | ||
JP2018098049 | 2018-05-22 | ||
PCT/JP2019/000935 WO2019142786A1 (en) | 2018-01-18 | 2019-01-15 | Photosensitive resin laminate and method for manufacturing same |
Publications (1)
Publication Number | Publication Date |
---|---|
MY193800A true MY193800A (en) | 2022-10-27 |
Family
ID=67301750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYUI2020002645A MY193800A (en) | 2018-01-18 | 2019-01-15 | Photosensitive resin laminate and method for manufacturing same |
Country Status (6)
Country | Link |
---|---|
JP (3) | JP7057794B2 (en) |
KR (2) | KR102505387B1 (en) |
CN (1) | CN111527450B (en) |
MY (1) | MY193800A (en) |
TW (2) | TWI774909B (en) |
WO (1) | WO2019142786A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL311594A (en) | 2021-09-29 | 2024-05-01 | Fujifilm Corp | Actinic ray-sensitive or radiation-sensitive resin composition and method for producing resist pattern |
Family Cites Families (33)
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KR100567641B1 (en) * | 1996-06-06 | 2006-07-19 | 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 | A method for reducing the metal ion content of aminoaromatic chromophores and using it for the synthesis of bottom antireflective coatings for low photoresist metals. |
JPH10123707A (en) * | 1996-10-17 | 1998-05-15 | Nippon Synthetic Chem Ind Co Ltd:The | Photosensitive resin composition and its use |
JP3766288B2 (en) * | 2000-03-31 | 2006-04-12 | 株式会社東芝 | Composite member manufacturing method and electronic package |
US20020127494A1 (en) * | 2001-03-08 | 2002-09-12 | Sturni Lance C. | Process for preparing a multi-layer circuit assembly |
JP4080364B2 (en) * | 2002-03-29 | 2008-04-23 | 大日本印刷株式会社 | Radical generator and photosensitive resin composition |
JP2004045490A (en) * | 2002-07-09 | 2004-02-12 | Fuji Photo Film Co Ltd | Method for manufacturing metal oxide structure using photosensitive resin transfer material |
JP4259855B2 (en) * | 2002-11-26 | 2009-04-30 | 旭化成エレクトロニクス株式会社 | Photosensitive resin composition |
JP2004306018A (en) * | 2003-03-26 | 2004-11-04 | Sumitomo Bakelite Co Ltd | Method for forming photosensitive resin film on metal, semiconductor device and display element |
JP4422562B2 (en) * | 2004-06-15 | 2010-02-24 | 富士フイルム株式会社 | Pattern forming material, pattern forming apparatus and pattern forming method |
JP2006039231A (en) * | 2004-07-27 | 2006-02-09 | Matsushita Electric Works Ltd | Method for manufacturing photoelectric wiring consolidated board |
JP2006243564A (en) * | 2005-03-04 | 2006-09-14 | Fuji Photo Film Co Ltd | Photosensitive composition and photosensitive film, and permanent pattern and method for forming the same |
CN101652715B (en) * | 2007-04-04 | 2012-05-02 | 旭化成电子材料株式会社 | Photosensitive resin composition and laminate |
JP2009072964A (en) * | 2007-09-19 | 2009-04-09 | Asahi Kasei Chemicals Corp | Method for manufacturing laminated body for printing |
CN102428406B (en) * | 2009-05-20 | 2014-09-03 | 旭化成电子材料株式会社 | Photosensitive resin composition |
TWI491981B (en) * | 2009-11-04 | 2015-07-11 | Sumitomo Chemical Co | Coloring the photosensitive resin composition |
JP2011213782A (en) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | Method for producing polymer solution and method for purifying polymer |
KR20140005929A (en) | 2011-01-25 | 2014-01-15 | 히타치가세이가부시끼가이샤 | Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for manufacturing printed wiring board |
JP2013057902A (en) * | 2011-09-09 | 2013-03-28 | Asahi Kasei E-Materials Corp | Photosensitive resin composition and photosensitive resin laminate |
TWI585521B (en) * | 2012-06-28 | 2017-06-01 | Fujifilm Corp | Photosensitive resin composition, cured product, method for producing the same, resin pattern production method, cured film, liquid crystal display device, organic EL display device, and touch panel display device |
JPWO2014080908A1 (en) * | 2012-11-26 | 2017-01-05 | 東レ株式会社 | Negative photosensitive resin composition |
JP6118086B2 (en) * | 2012-12-03 | 2017-04-19 | 富士フイルム株式会社 | Dispersion composition, photosensitive resin composition, cured product and manufacturing method thereof, resin pattern manufacturing method, cured film, organic EL display device, liquid crystal display device, and touch panel display device |
CN105122137B (en) * | 2013-03-28 | 2020-02-07 | 东丽株式会社 | Photosensitive resin composition, protective film or insulating film, touch panel, and method for producing same |
JP2015049508A (en) | 2014-02-24 | 2015-03-16 | 住友ベークライト株式会社 | Photosensitive resin material and resin film |
KR20150108744A (en) * | 2014-03-18 | 2015-09-30 | 다이요 잉키 세이조 가부시키가이샤 | Curable resin composition, dry film, cured product and printed wiring board |
JP5686217B1 (en) * | 2014-04-30 | 2015-03-18 | 住友ベークライト株式会社 | Photosensitive resin material and resin film |
JP6673196B2 (en) | 2014-05-13 | 2020-03-25 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
KR102412748B1 (en) | 2014-05-13 | 2022-06-24 | 쇼와덴코머티리얼즈가부시끼가이샤 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and process for producing printed wiring board |
TWI671343B (en) * | 2014-06-27 | 2019-09-11 | 日商富士軟片股份有限公司 | Thermosetting resin composition, cured film, method for producing cured film, and semiconductor device |
US10338468B2 (en) * | 2014-09-24 | 2019-07-02 | Asahi Kasei Kabushiki Kaisha | Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device |
JP2016110691A (en) * | 2014-12-01 | 2016-06-20 | 大日本印刷株式会社 | Method for manufacturing conductive substrate and conductive substrate |
CN106483760B (en) * | 2015-09-02 | 2019-11-12 | 东京应化工业株式会社 | Photosensitive composite, its manufacturing method, the forming method of film, viscosity increase suppressing method, Photoepolymerizationinitiater initiater and its manufacturing method |
JP2017097060A (en) * | 2015-11-19 | 2017-06-01 | 住友ベークライト株式会社 | Photosensitive resin composition and production method of photosensitive resin pattern |
JP6858591B2 (en) * | 2016-03-01 | 2021-04-14 | 株式会社Dnpファインケミカル | Coloring compositions for color filters, color filters and display devices |
-
2019
- 2019-01-15 CN CN201980006875.3A patent/CN111527450B/en active Active
- 2019-01-15 KR KR1020207019065A patent/KR102505387B1/en active IP Right Grant
- 2019-01-15 WO PCT/JP2019/000935 patent/WO2019142786A1/en active Application Filing
- 2019-01-15 MY MYUI2020002645A patent/MY193800A/en unknown
- 2019-01-15 KR KR1020227013942A patent/KR102680360B1/en active IP Right Grant
- 2019-01-15 JP JP2019566468A patent/JP7057794B2/en active Active
- 2019-01-16 TW TW108101625A patent/TWI774909B/en active
- 2019-01-16 TW TW109126151A patent/TW202041971A/en unknown
-
2022
- 2022-01-24 JP JP2022008891A patent/JP2022058739A/en active Pending
-
2024
- 2024-02-21 JP JP2024024839A patent/JP2024051000A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR102680360B1 (en) | 2024-07-01 |
KR20220061260A (en) | 2022-05-12 |
TW201932981A (en) | 2019-08-16 |
TW202041971A (en) | 2020-11-16 |
KR102505387B1 (en) | 2023-03-02 |
JPWO2019142786A1 (en) | 2020-09-17 |
KR20200086743A (en) | 2020-07-17 |
WO2019142786A1 (en) | 2019-07-25 |
TWI774909B (en) | 2022-08-21 |
CN111527450A (en) | 2020-08-11 |
JP2024051000A (en) | 2024-04-10 |
JP2022058739A (en) | 2022-04-12 |
JP7057794B2 (en) | 2022-04-20 |
CN111527450B (en) | 2023-08-08 |
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