MY193800A - Photosensitive resin laminate and method for manufacturing same - Google Patents

Photosensitive resin laminate and method for manufacturing same

Info

Publication number
MY193800A
MY193800A MYUI2020002645A MYUI2020002645A MY193800A MY 193800 A MY193800 A MY 193800A MY UI2020002645 A MYUI2020002645 A MY UI2020002645A MY UI2020002645 A MYUI2020002645 A MY UI2020002645A MY 193800 A MY193800 A MY 193800A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
laminate
resin laminate
composition layer
Prior art date
Application number
MYUI2020002645A
Inventor
Yoshitaka Kamochi
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY193800A publication Critical patent/MY193800A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Provided is a laminate having a photosensitive resin composition provided on a base film, the photosensitive resin composition being capable of exhibiting both solubility in a developing solution, i.e., developing performance and adhesion performance with respect to a substrate, particularly a copper substrate. A photosensitive resin laminate provided with a support film and a photosensitive resin composition layer containing a photosensitive resin composition formed on the support film, wherein the photosensitive resin laminate is characterized in that: the photosensitive resin composition contains (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) a photopolymerization initiator, and (D) iron atoms; and the iron atom content of the photosensitive resin composition layer is 0.01-10 ppm inclusive with respect to the photosensitive resin composition layer.
MYUI2020002645A 2018-01-18 2019-01-15 Photosensitive resin laminate and method for manufacturing same MY193800A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018006341 2018-01-18
JP2018098049 2018-05-22
PCT/JP2019/000935 WO2019142786A1 (en) 2018-01-18 2019-01-15 Photosensitive resin laminate and method for manufacturing same

Publications (1)

Publication Number Publication Date
MY193800A true MY193800A (en) 2022-10-27

Family

ID=67301750

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2020002645A MY193800A (en) 2018-01-18 2019-01-15 Photosensitive resin laminate and method for manufacturing same

Country Status (6)

Country Link
JP (3) JP7057794B2 (en)
KR (2) KR102505387B1 (en)
CN (1) CN111527450B (en)
MY (1) MY193800A (en)
TW (2) TWI774909B (en)
WO (1) WO2019142786A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL311594A (en) 2021-09-29 2024-05-01 Fujifilm Corp Actinic ray-sensitive or radiation-sensitive resin composition and method for producing resist pattern

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100567641B1 (en) * 1996-06-06 2006-07-19 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 A method for reducing the metal ion content of aminoaromatic chromophores and using it for the synthesis of bottom antireflective coatings for low photoresist metals.
JPH10123707A (en) * 1996-10-17 1998-05-15 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition and its use
JP3766288B2 (en) * 2000-03-31 2006-04-12 株式会社東芝 Composite member manufacturing method and electronic package
US20020127494A1 (en) * 2001-03-08 2002-09-12 Sturni Lance C. Process for preparing a multi-layer circuit assembly
JP4080364B2 (en) * 2002-03-29 2008-04-23 大日本印刷株式会社 Radical generator and photosensitive resin composition
JP2004045490A (en) * 2002-07-09 2004-02-12 Fuji Photo Film Co Ltd Method for manufacturing metal oxide structure using photosensitive resin transfer material
JP4259855B2 (en) * 2002-11-26 2009-04-30 旭化成エレクトロニクス株式会社 Photosensitive resin composition
JP2004306018A (en) * 2003-03-26 2004-11-04 Sumitomo Bakelite Co Ltd Method for forming photosensitive resin film on metal, semiconductor device and display element
JP4422562B2 (en) * 2004-06-15 2010-02-24 富士フイルム株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP2006039231A (en) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd Method for manufacturing photoelectric wiring consolidated board
JP2006243564A (en) * 2005-03-04 2006-09-14 Fuji Photo Film Co Ltd Photosensitive composition and photosensitive film, and permanent pattern and method for forming the same
CN101652715B (en) * 2007-04-04 2012-05-02 旭化成电子材料株式会社 Photosensitive resin composition and laminate
JP2009072964A (en) * 2007-09-19 2009-04-09 Asahi Kasei Chemicals Corp Method for manufacturing laminated body for printing
CN102428406B (en) * 2009-05-20 2014-09-03 旭化成电子材料株式会社 Photosensitive resin composition
TWI491981B (en) * 2009-11-04 2015-07-11 Sumitomo Chemical Co Coloring the photosensitive resin composition
JP2011213782A (en) * 2010-03-31 2011-10-27 Fujifilm Corp Method for producing polymer solution and method for purifying polymer
KR20140005929A (en) 2011-01-25 2014-01-15 히타치가세이가부시끼가이샤 Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for manufacturing printed wiring board
JP2013057902A (en) * 2011-09-09 2013-03-28 Asahi Kasei E-Materials Corp Photosensitive resin composition and photosensitive resin laminate
TWI585521B (en) * 2012-06-28 2017-06-01 Fujifilm Corp Photosensitive resin composition, cured product, method for producing the same, resin pattern production method, cured film, liquid crystal display device, organic EL display device, and touch panel display device
JPWO2014080908A1 (en) * 2012-11-26 2017-01-05 東レ株式会社 Negative photosensitive resin composition
JP6118086B2 (en) * 2012-12-03 2017-04-19 富士フイルム株式会社 Dispersion composition, photosensitive resin composition, cured product and manufacturing method thereof, resin pattern manufacturing method, cured film, organic EL display device, liquid crystal display device, and touch panel display device
CN105122137B (en) * 2013-03-28 2020-02-07 东丽株式会社 Photosensitive resin composition, protective film or insulating film, touch panel, and method for producing same
JP2015049508A (en) 2014-02-24 2015-03-16 住友ベークライト株式会社 Photosensitive resin material and resin film
KR20150108744A (en) * 2014-03-18 2015-09-30 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board
JP5686217B1 (en) * 2014-04-30 2015-03-18 住友ベークライト株式会社 Photosensitive resin material and resin film
JP6673196B2 (en) 2014-05-13 2020-03-25 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
KR102412748B1 (en) 2014-05-13 2022-06-24 쇼와덴코머티리얼즈가부시끼가이샤 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and process for producing printed wiring board
TWI671343B (en) * 2014-06-27 2019-09-11 日商富士軟片股份有限公司 Thermosetting resin composition, cured film, method for producing cured film, and semiconductor device
US10338468B2 (en) * 2014-09-24 2019-07-02 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device
JP2016110691A (en) * 2014-12-01 2016-06-20 大日本印刷株式会社 Method for manufacturing conductive substrate and conductive substrate
CN106483760B (en) * 2015-09-02 2019-11-12 东京应化工业株式会社 Photosensitive composite, its manufacturing method, the forming method of film, viscosity increase suppressing method, Photoepolymerizationinitiater initiater and its manufacturing method
JP2017097060A (en) * 2015-11-19 2017-06-01 住友ベークライト株式会社 Photosensitive resin composition and production method of photosensitive resin pattern
JP6858591B2 (en) * 2016-03-01 2021-04-14 株式会社Dnpファインケミカル Coloring compositions for color filters, color filters and display devices

Also Published As

Publication number Publication date
KR102680360B1 (en) 2024-07-01
KR20220061260A (en) 2022-05-12
TW201932981A (en) 2019-08-16
TW202041971A (en) 2020-11-16
KR102505387B1 (en) 2023-03-02
JPWO2019142786A1 (en) 2020-09-17
KR20200086743A (en) 2020-07-17
WO2019142786A1 (en) 2019-07-25
TWI774909B (en) 2022-08-21
CN111527450A (en) 2020-08-11
JP2024051000A (en) 2024-04-10
JP2022058739A (en) 2022-04-12
JP7057794B2 (en) 2022-04-20
CN111527450B (en) 2023-08-08

Similar Documents

Publication Publication Date Title
MY187481A (en) Photosensitive resin composition
MY186932A (en) Photosensitive resin composition
MX2018005702A (en) Multilayer structure and related method of manufacture for electronics.
MY174577A (en) Photosensitive resin composition and photosensitive resin laminate
TW201129667A (en) Fabricating method of film adhesive, adhesive sheet, semiconductor device and fabricating method thereof
BR112018010834A2 (en) film and method for producing a movie
MY158488A (en) Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using them
TW200506540A (en) Composition for forming sub-layer film for lithography comprising compound having protected carboxyl group
TW200628309A (en) Antistatic adhesion type optical film and image display
TW200501229A (en) Exposure method and exposure apparatus, and manufacturing method of device
TW200726796A (en) Prepreg, method for making the prepreg, substrate and semiconductor device
TW201612643A (en) Pattern forming method, protective film forming composition, and manufacturing method of electronic device
MY176799A (en) Photosensitive resin element
WO2015103394A3 (en) A metal thin film resistor and process
TW200605169A (en) Circuit device and process for manufacture thereof
TW200641543A (en) Underlayer coating forming composition for lithography containing compound having protected carboxy group
TW200628952A (en) Method for manufacturing array board for display device
EP3919981A4 (en) Actinic light-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, and electronic device manufacturing method
TW200744442A (en) Flexibile substrates with electromagnetic shielding capability
TW200723354A (en) Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof
TW200608118A (en) Photosensitive resin composition, spacers for a display panel and display panel
WO2018070801A3 (en) Multilayered carrier film, element transfer method using same, and electronic product manufacturing method for manufacturing electronic product by using same element transfer method
MY196018A (en) Lead Frame and Method for Manufacturing Same
SG10201708893XA (en) Sheet, tape, and semiconductor device manufacturing method
TW200713589A (en) Method of TFT manufacturing and a base-board substrate structure