TW201613440A - Double-sided metal foil laminate manufacturing method, printed circuit board manufacturing method, multi-layer laminate manufacturing method and multi-layer printed circuit board manufacturing method - Google Patents

Double-sided metal foil laminate manufacturing method, printed circuit board manufacturing method, multi-layer laminate manufacturing method and multi-layer printed circuit board manufacturing method

Info

Publication number
TW201613440A
TW201613440A TW104123431A TW104123431A TW201613440A TW 201613440 A TW201613440 A TW 201613440A TW 104123431 A TW104123431 A TW 104123431A TW 104123431 A TW104123431 A TW 104123431A TW 201613440 A TW201613440 A TW 201613440A
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
printed circuit
layer
metal foil
Prior art date
Application number
TW104123431A
Other languages
Chinese (zh)
Other versions
TWI556701B (en
Inventor
Hiroyuki Fukusumi
Masaya Koyama
Minoru Uno
Original Assignee
Panasonic Ip Man Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Ip Man Co Ltd filed Critical Panasonic Ip Man Co Ltd
Publication of TW201613440A publication Critical patent/TW201613440A/en
Application granted granted Critical
Publication of TWI556701B publication Critical patent/TWI556701B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

The present invention provides a double-sided metal foil laminate manufacturing method, a printed circuit board manufacturing method, a multi-layer laminate manufacturing method and a multi-layer printed circuit board manufacturing method. The double-sided metal foil laminate manufacturing method comprises: sandwiching a first prepreg layer between a first metal foil and a second metal foil to form a laminate, followed by heating and pressing the laminate for formation after subjecting the laminate to a pre-heating treatment.
TW104123431A 2014-09-26 2015-07-20 Method for manufacturing double-sided metal foil laminated board, method for manufacturing printed circuit board, method for manufacturing multilayer laminated sheet, and method for manufacturing multilayer printed circuit board TWI556701B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014197089A JP5954675B2 (en) 2014-09-26 2014-09-26 Method for producing double-sided metal-clad laminate, method for producing printed wiring board, method for producing multilayer laminate, and method for producing multilayer printed wiring board

Publications (2)

Publication Number Publication Date
TW201613440A true TW201613440A (en) 2016-04-01
TWI556701B TWI556701B (en) 2016-11-01

Family

ID=55610016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104123431A TWI556701B (en) 2014-09-26 2015-07-20 Method for manufacturing double-sided metal foil laminated board, method for manufacturing printed circuit board, method for manufacturing multilayer laminated sheet, and method for manufacturing multilayer printed circuit board

Country Status (4)

Country Link
JP (1) JP5954675B2 (en)
KR (1) KR101671120B1 (en)
CN (1) CN105472895B (en)
TW (1) TWI556701B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6735505B2 (en) * 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 Printed wiring board, printed circuit board, prepreg
TWI775905B (en) * 2017-07-25 2022-09-01 日商松下知識產權經營股份有限公司 Manufacturing method of multi-layered printed wiring board
CN109451655B (en) * 2018-11-16 2023-12-19 深圳市正基电子有限公司 Method for producing PCB control panel body size and warping and structure thereof
CN110370781B (en) * 2019-07-01 2021-07-06 黄瑞有 Copper-clad plate rubberizing drying device
CN220785102U (en) * 2021-05-13 2024-04-16 株式会社村田制作所 Laminated substrate and antenna substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214413A (en) * 1988-02-20 1989-08-28 Matsushita Electric Works Ltd Manufacture of electrical laminate
JPH03197042A (en) * 1989-12-26 1991-08-28 Dainippon Ink & Chem Inc Preparation of laminated sheet
JPH04262320A (en) * 1991-02-15 1992-09-17 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of electrical laminated plate
JP3198796B2 (en) * 1993-06-25 2001-08-13 富士電機株式会社 Mold module
JP2001334542A (en) * 2000-05-26 2001-12-04 Sumitomo Bakelite Co Ltd Method for manufacturing laminated sheet
JP3882739B2 (en) * 2002-10-25 2007-02-21 新神戸電機株式会社 Manufacturing method of metal foil clad laminate with inner layer circuit
CN102404934B (en) * 2010-09-09 2015-01-14 富葵精密组件(深圳)有限公司 Circuit board substrate and manufacturing method thereof
JP6226232B2 (en) * 2012-11-12 2017-11-08 パナソニックＩｐマネジメント株式会社 Metal-clad laminate, metal-clad laminate production method, printed wiring board, multilayer printed wiring board

Also Published As

Publication number Publication date
JP2016068277A (en) 2016-05-09
CN105472895B (en) 2018-05-04
CN105472895A (en) 2016-04-06
KR101671120B1 (en) 2016-10-31
JP5954675B2 (en) 2016-07-20
TWI556701B (en) 2016-11-01
KR20160037070A (en) 2016-04-05

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