MY197618A - Photosensitive resin laminate and method for producing resist pattern - Google Patents

Photosensitive resin laminate and method for producing resist pattern

Info

Publication number
MY197618A
MY197618A MYUI2020002238A MYUI2020002238A MY197618A MY 197618 A MY197618 A MY 197618A MY UI2020002238 A MYUI2020002238 A MY UI2020002238A MY UI2020002238 A MYUI2020002238 A MY UI2020002238A MY 197618 A MY197618 A MY 197618A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
resist pattern
resin laminate
producing resist
Prior art date
Application number
MYUI2020002238A
Inventor
Yuzo Kotani
Shinichi Kunimatsu
Kosuke Inoue
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY197618A publication Critical patent/MY197618A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

A photosensitive resin laminate provided with a support film and a photosensitive resin composition layer that includes a photosensitive resin composition, wherein: the photosensitive resin composition includes (A) an alkali-soluble polymer; the support film can be separated from the photosensitive resin composition layer; and the water content included in the photosensitive resin composition layer is 0.1% by mass or more, where the total mass of the photosensitive resin composition layer is 100% by mass.
MYUI2020002238A 2017-11-06 2018-11-02 Photosensitive resin laminate and method for producing resist pattern MY197618A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017213581 2017-11-06
JP2017247494 2017-12-25
JP2018101022 2018-05-25
PCT/JP2018/040908 WO2019088268A1 (en) 2017-11-06 2018-11-02 Photosensitive resin laminate and method for producing resist pattern

Publications (1)

Publication Number Publication Date
MY197618A true MY197618A (en) 2023-06-28

Family

ID=66331931

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2020002238A MY197618A (en) 2017-11-06 2018-11-02 Photosensitive resin laminate and method for producing resist pattern

Country Status (6)

Country Link
JP (2) JP7190439B2 (en)
KR (2) KR102522749B1 (en)
CN (1) CN111316164B (en)
MY (1) MY197618A (en)
TW (1) TWI689524B (en)
WO (1) WO2019088268A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022000683A (en) * 2019-12-13 2022-01-04 旭化成株式会社 Photosensitive resin composition and transfer film using photosensitive resin composition
US20230375930A1 (en) * 2020-10-23 2023-11-23 Asahi Kasei Kabushiki Kaisha Photosensitive resin multilayer body

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330612A (en) * 1979-01-23 1982-05-18 Japan Synthetic Rubber Co., Ltd. Laminate of monolayer film of cyclized butadiene polymer and other photosensitive layer
JPH0299958A (en) * 1988-10-05 1990-04-11 Hitachi Chem Co Ltd Method for laminating photosensitive element
JP3397231B2 (en) * 1997-07-16 2003-04-14 日立化成工業株式会社 Photosensitive element
JPH11167203A (en) * 1997-12-01 1999-06-22 Nichigoo Mooton Kk Photosensitive resin composition and photosensitive element using same
JP4756181B2 (en) * 2001-09-07 2011-08-24 ニチゴー・モートン株式会社 Photosensitive resin composition and dry film using the same
TWI237656B (en) * 2002-08-28 2005-08-11 Kansai Paint Co Ltd Peelable adhesive composition
JP2004087416A (en) * 2002-08-29 2004-03-18 Nippon Paper Industries Co Ltd Transferring film for fluorescent material
CN1573545A (en) * 2003-06-20 2005-02-02 富士胶片株式会社 Light-sensitive sheet, light-sensitive layers, image pattern forming method, and wiring pattern forming method
JP2005202066A (en) * 2004-01-14 2005-07-28 Fuji Photo Film Co Ltd Light-sensitive transfer sheet, light-sensitive laminate, image pattern forming method, and wiring pattern forming method
JP2005173049A (en) * 2003-12-09 2005-06-30 Fuji Photo Film Co Ltd Dry film photoresist
JP4966528B2 (en) * 2005-09-14 2012-07-04 旭化成イーマテリアルズ株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
CN100568097C (en) * 2005-10-05 2009-12-09 旭化成电子材料株式会社 Photosensitive polymer combination and layered product
CN101401035A (en) * 2006-01-13 2009-04-01 富士胶片株式会社 Photosensitive resin composition, photosensitive transfer film, and method for pattern formation
WO2007125992A1 (en) * 2006-04-28 2007-11-08 Asahi Kasei Emd Corporation Photosensitive resin laminate
WO2008075575A1 (en) * 2006-12-19 2008-06-26 Hitachi Chemical Company, Ltd. Photosensitive element
JP4905465B2 (en) 2007-01-31 2012-03-28 日立化成工業株式会社 Photosensitive element
WO2008126526A1 (en) * 2007-04-04 2008-10-23 Asahi Kasei E-Materials Corporation Photosensitive resin composition and layered product
JP2009083482A (en) 2007-09-13 2009-04-23 Asahi Kasei Electronics Co Ltd Photosensitive resin laminate
JP2009139488A (en) * 2007-12-04 2009-06-25 Nippon Steel Chem Co Ltd Light shielding dispersion liquid, manufacturing method therefor, and photosensitive resin composition for black resist using light shielding dispersion liquid
KR101320225B1 (en) * 2008-03-21 2013-10-21 히타치가세이가부시끼가이샤 Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
WO2009125752A1 (en) 2008-04-10 2009-10-15 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, and photosensitive resin laminate comprising the same
KR101318517B1 (en) * 2008-05-30 2013-10-16 코오롱인더스트리 주식회사 Film type transfer material
CN102160163A (en) * 2008-09-22 2011-08-17 日立化成工业株式会社 Semiconductor device and method for manufacturing same
CN102331684A (en) * 2010-07-13 2012-01-25 日立化成工业株式会社 Photosensitive element, formation method of corrosion-resisting pattern, manufacture method of printing circuit wiring board and printing circuit wiring board
JP5762706B2 (en) * 2010-09-06 2015-08-12 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and method for producing cured relief pattern
WO2012090896A1 (en) * 2010-12-27 2012-07-05 東洋紡績株式会社 Photosensitive resin laminate
CN103430100B (en) * 2011-03-03 2016-08-17 日兴材料株式会社 Photosensitive polymer combination, use its photoresist, the forming method of corrosion-resisting pattern and the forming method of conductive pattern
JP5990366B2 (en) 2011-03-31 2016-09-14 旭化成株式会社 Laminated body and roll using the same
JP6046746B2 (en) * 2012-12-27 2016-12-21 旭化成株式会社 Photosensitive resin laminate roll
JP2014202971A (en) * 2013-04-08 2014-10-27 三菱樹脂株式会社 Photosensitive resin structure
JP5858197B2 (en) * 2013-10-16 2016-02-10 日立化成株式会社 Laminated body including conductive fiber, photosensitive conductive film, method for manufacturing conductive pattern, conductive pattern substrate, and touch panel
MY174577A (en) * 2013-12-26 2020-04-28 Asahi Chemical Ind Photosensitive resin composition and photosensitive resin laminate
JP6673196B2 (en) * 2014-05-13 2020-03-25 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
WO2016084868A1 (en) * 2014-11-26 2016-06-02 日立化成株式会社 Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate
JP6669742B2 (en) * 2015-06-09 2020-03-18 旭化成株式会社 Aqueous resin composition for touch panel, transfer film and cured film laminate, method for producing resin pattern, and touch panel display device

Also Published As

Publication number Publication date
WO2019088268A1 (en) 2019-05-09
KR102522749B1 (en) 2023-04-17
CN111316164A (en) 2020-06-19
TWI689524B (en) 2020-04-01
CN111316164B (en) 2023-12-29
KR20220164618A (en) 2022-12-13
JPWO2019088268A1 (en) 2020-11-26
KR20200054313A (en) 2020-05-19
JP7190439B2 (en) 2022-12-15
JP2022188113A (en) 2022-12-20
TW201925250A (en) 2019-07-01
KR102570709B1 (en) 2023-08-24

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