MY175638A - Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectic and polysilicon films. - Google Patents

Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectic and polysilicon films.

Info

Publication number
MY175638A
MY175638A MYPI2015002194A MYPI2015002194A MY175638A MY 175638 A MY175638 A MY 175638A MY PI2015002194 A MYPI2015002194 A MY PI2015002194A MY PI2015002194 A MYPI2015002194 A MY PI2015002194A MY 175638 A MY175638 A MY 175638A
Authority
MY
Malaysia
Prior art keywords
polishing composition
aqueous
dielectic
silicon oxide
containing silicon
Prior art date
Application number
MYPI2015002194A
Other languages
English (en)
Inventor
Jea-Ju Chu
Yuzhuo Li
Shyam Sundar Venkataraman
Harvey Wayne Pinder
Wei Lan William Chiu
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of MY175638A publication Critical patent/MY175638A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/18—Other polishing compositions based on non-waxy substances on other substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI2015002194A 2010-09-08 2011-09-05 Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectic and polysilicon films. MY175638A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38071910P 2010-09-08 2010-09-08

Publications (1)

Publication Number Publication Date
MY175638A true MY175638A (en) 2020-07-03

Family

ID=44773986

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015002194A MY175638A (en) 2010-09-08 2011-09-05 Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectic and polysilicon films.

Country Status (11)

Country Link
US (1) US20130168348A1 (https=)
EP (1) EP2428541B1 (https=)
JP (1) JP5965906B2 (https=)
KR (1) KR101906135B1 (https=)
CN (1) CN103080256B (https=)
IL (1) IL224645A (https=)
MY (1) MY175638A (https=)
RU (1) RU2573672C2 (https=)
SG (2) SG10201606566SA (https=)
TW (1) TWI525164B (https=)
WO (1) WO2012032451A1 (https=)

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KR102296085B1 (ko) 2019-07-01 2021-09-01 남기호 스마트 트램폴린 및 스마트 트램폴린을 이용한 건강관리 시스템
JP7803851B2 (ja) * 2019-09-04 2026-01-21 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー ポリシリコンｃｍｐ用組成物および方法
TWI767355B (zh) * 2019-10-24 2022-06-11 美商慧盛材料美國責任有限公司 高氧化物移除速率的淺溝隔離化學機械平坦化組合物、系統及方法
JP7803675B2 (ja) * 2020-10-05 2026-01-21 花王株式会社 酸化珪素膜用研磨液組成物
JP7777017B2 (ja) * 2021-03-30 2025-11-27 株式会社フジミインコーポレーテッド 研磨用組成物、及び窒化ケイ素を選択的に除去する方法
CN113549399B (zh) * 2021-08-03 2022-02-15 万华化学集团电子材料有限公司 适用于硅片粗抛光的化学机械抛光组合物及其应用
KR102773634B1 (ko) * 2022-04-13 2025-02-25 에스케이엔펄스 주식회사 반도체 공정용 조성물 및 이를 이용한 반도체 소자의 연마방법
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Also Published As

Publication number Publication date
JP5965906B2 (ja) 2016-08-10
EP2428541A1 (en) 2012-03-14
KR101906135B1 (ko) 2018-10-10
WO2012032451A1 (en) 2012-03-15
IL224645A (en) 2017-11-30
JP2013540849A (ja) 2013-11-07
TWI525164B (zh) 2016-03-11
CN103080256A (zh) 2013-05-01
SG10201606566SA (en) 2016-09-29
US20130168348A1 (en) 2013-07-04
RU2013115237A (ru) 2014-10-20
SG11201606187RA (en) 2016-09-29
TW201226491A (en) 2012-07-01
RU2573672C2 (ru) 2016-01-27
CN103080256B (zh) 2015-06-24
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