MY186027A - Cmp compositions and methods for polishing rigid disk surfaces - Google Patents
Cmp compositions and methods for polishing rigid disk surfacesInfo
- Publication number
- MY186027A MY186027A MYPI2016002071A MYPI2016002071A MY186027A MY 186027 A MY186027 A MY 186027A MY PI2016002071 A MYPI2016002071 A MY PI2016002071A MY PI2016002071 A MYPI2016002071 A MY PI2016002071A MY 186027 A MY186027 A MY 186027A
- Authority
- MY
- Malaysia
- Prior art keywords
- methods
- polishing
- rigid disk
- disk surfaces
- cmp compositions
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
A chemical mechanical polishing (CMP) method for polishing a nickel phosphorus (NiP) substrate comprises abrading a surface of the substrate with an acidic CMP composition. The CMP composition comprises a colloidal silica abrasive suspended in an aqueous carrier containing a nickel complexing agent (e.g., glycine, N-hydroxyethylenediaminetriacetic acid), polyvinyl alcohol, polystyrenesulfonic acid-co-maleic acid, and optionally an oxidizing agent. (Fig.1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462007021P | 2014-06-03 | 2014-06-03 | |
PCT/US2015/033964 WO2015187820A1 (en) | 2014-06-03 | 2015-06-03 | Cmp compositions and methods for polishing rigid disk surfaces |
Publications (1)
Publication Number | Publication Date |
---|---|
MY186027A true MY186027A (en) | 2021-06-15 |
Family
ID=54767312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016002071A MY186027A (en) | 2014-06-03 | 2015-06-03 | Cmp compositions and methods for polishing rigid disk surfaces |
Country Status (4)
Country | Link |
---|---|
MY (1) | MY186027A (en) |
SG (1) | SG11201610441SA (en) |
TW (1) | TWI563073B (en) |
WO (1) | WO2015187820A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201809942WA (en) * | 2016-06-07 | 2018-12-28 | Cabot Microelectronics Corp | Chemical-mechanical processing slurry and methods for processing a nickel substrate surface |
EP3584298B1 (en) * | 2017-02-17 | 2022-12-28 | Fujimi Incorporated | Polishing method using a polishing composition |
KR102649676B1 (en) | 2017-03-14 | 2024-03-21 | 가부시키가이샤 후지미인코퍼레이티드 | Polishing composition, method for producing the same, polishing method using the same, and method for producing a substrate |
TWI747122B (en) | 2019-01-11 | 2021-11-21 | 美商Cmc材料股份有限公司 | Dual additive composition for polishing memory hard disks exhibiting edge roll off |
WO2020196370A1 (en) * | 2019-03-26 | 2020-10-01 | 株式会社フジミインコーポレーテッド | Polishing composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6299795B1 (en) * | 2000-01-18 | 2001-10-09 | Praxair S.T. Technology, Inc. | Polishing slurry |
US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
US8247326B2 (en) * | 2008-07-10 | 2012-08-21 | Cabot Microelectronics Corporation | Method of polishing nickel-phosphorous |
KR101359092B1 (en) * | 2009-11-11 | 2014-02-05 | 가부시키가이샤 구라레 | Slurry for chemical mechanical polishing and polishing method for substrate using same |
US10407594B2 (en) * | 2011-03-22 | 2019-09-10 | Basf Se | Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine |
US9039914B2 (en) * | 2012-05-23 | 2015-05-26 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous-coated memory disks |
-
2015
- 2015-05-26 TW TW104116834A patent/TWI563073B/en active
- 2015-06-03 MY MYPI2016002071A patent/MY186027A/en unknown
- 2015-06-03 WO PCT/US2015/033964 patent/WO2015187820A1/en active Application Filing
- 2015-06-03 SG SG11201610441SA patent/SG11201610441SA/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI563073B (en) | 2016-12-21 |
TW201546255A (en) | 2015-12-16 |
SG11201610441SA (en) | 2017-01-27 |
WO2015187820A1 (en) | 2015-12-10 |
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