MY175198A - Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil - Google Patents
Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foilInfo
- Publication number
- MY175198A MY175198A MYPI2014700775A MYPI2014700775A MY175198A MY 175198 A MY175198 A MY 175198A MY PI2014700775 A MYPI2014700775 A MY PI2014700775A MY PI2014700775 A MYPI2014700775 A MY PI2014700775A MY 175198 A MY175198 A MY 175198A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- electrolytic copper
- resin
- negative electrode
- printed wiring
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/70—Carriers or collectors characterised by shape or form
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
- H01M2004/027—Negative electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011216623 | 2011-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY175198A true MY175198A (en) | 2020-06-15 |
Family
ID=47995304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2014700775A MY175198A (en) | 2011-09-30 | 2012-09-18 | Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6029590B2 (fr) |
KR (3) | KR20140054435A (fr) |
CN (1) | CN103857833B (fr) |
MY (1) | MY175198A (fr) |
TW (1) | TWI605735B (fr) |
WO (1) | WO2013047272A1 (fr) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI515342B (zh) * | 2013-09-05 | 2016-01-01 | 三井金屬鑛業股份有限公司 | 表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板 |
TWI616122B (zh) * | 2014-05-28 | 2018-02-21 | Jx Nippon Mining & Metals Corp | 表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法 |
JP6323261B2 (ja) * | 2014-08-29 | 2018-05-16 | 住友金属鉱山株式会社 | フレキシブル銅配線板の製造方法、及び、それに用いる支持フィルム付フレキシブル銅張積層板 |
JP5972486B1 (ja) * | 2014-09-05 | 2016-08-17 | 古河電気工業株式会社 | 銅箔、銅張積層板、および基板 |
KR101852671B1 (ko) * | 2015-01-21 | 2018-06-04 | 제이엑스금속주식회사 | 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법 |
CN107429417B (zh) * | 2015-03-31 | 2019-11-22 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板 |
JP6083619B2 (ja) * | 2015-07-29 | 2017-02-22 | 福田金属箔粉工業株式会社 | 低誘電性樹脂基材用処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 |
WO2017051897A1 (fr) * | 2015-09-24 | 2017-03-30 | Jx金属株式会社 | Feuille métallique, feuille métallique pourvue d'une couche de démoulage, stratifié, carte de circuit imprimé, boîtier de semi-conducteur, dispositif électronique et procédé pour la production de carte de circuit imprimé |
KR20170038969A (ko) * | 2015-09-30 | 2017-04-10 | 일진머티리얼즈 주식회사 | 표면처리동박 및 그의 제조방법 |
WO2018066113A1 (fr) * | 2016-10-06 | 2018-04-12 | 三井金属鉱業株式会社 | Procédé de production de carte de circuit imprimé multicouche |
JP7492807B2 (ja) * | 2016-12-06 | 2024-05-30 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7193915B2 (ja) * | 2017-02-03 | 2022-12-21 | Jx金属株式会社 | 表面処理銅箔並びにこれを用いた集電体、電極及び電池 |
CN111194362B (zh) * | 2017-07-24 | 2022-03-11 | 古河电气工业株式会社 | 表面处理铜箔、以及使用其的覆铜板及印刷配线板 |
CN111344435A (zh) * | 2017-11-10 | 2020-06-26 | 纳美仕有限公司 | 复合铜箔 |
JP7056167B2 (ja) * | 2018-01-23 | 2022-04-19 | 株式会社豊田自動織機 | 蓄電モジュール、及び、蓄電モジュールの製造方法 |
TWI679314B (zh) | 2018-06-07 | 2019-12-11 | 國立中興大學 | 以單一電鍍槽製備銅箔生箔同時形成粗化毛面的方法及該銅箔生箔 |
CN113795615B (zh) * | 2019-06-07 | 2024-08-02 | 古河电气工业株式会社 | 表面处理铜箔、覆铜层叠板以及印刷电路板 |
TWI719698B (zh) * | 2019-06-12 | 2021-02-21 | 金居開發股份有限公司 | 進階反轉電解銅箔及其銅箔基板 |
JP7392996B2 (ja) * | 2019-06-19 | 2023-12-06 | 金居開發股▲分▼有限公司 | アドバンスド電解銅箔及びそれを適用した銅張積層板 |
TWM608774U (zh) * | 2019-06-19 | 2021-03-11 | 金居開發股份有限公司 | 進階反轉電解銅箔及應用其的銅箔基板 |
CN112469194B (zh) * | 2020-11-27 | 2022-08-05 | 广东嘉元科技股份有限公司 | 一种高密互联电路板用低轮廓电解铜箔 |
WO2022153580A1 (fr) * | 2021-01-15 | 2022-07-21 | Jx金属株式会社 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
WO2023281759A1 (fr) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
CN115044947B (zh) * | 2022-06-17 | 2023-09-29 | 山东金宝电子有限公司 | 一种提高铜箔与树脂附着力的表面处理方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5135711A (en) | 1974-09-24 | 1976-03-26 | Komatsu Shoichi | Taisui hatsuyuseiojusurukami narabini sonoseizoho |
JPS581853B2 (ja) | 1977-06-17 | 1983-01-13 | 松下電器産業株式会社 | 選局装置 |
JP2739507B2 (ja) | 1989-10-06 | 1998-04-15 | 日鉱グールド・フォイル株式会社 | 銅箔の電解処理方法 |
JP2717911B2 (ja) | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
US5482784A (en) * | 1993-12-24 | 1996-01-09 | Mitsui Mining And Smelting Co., Ltd. | Printed circuit inner-layer copper foil and process for producing the same |
JP3476264B2 (ja) * | 1993-12-24 | 2003-12-10 | 三井金属鉱業株式会社 | プリント回路内層用銅箔およびその製造方法 |
TW317575B (fr) | 1994-01-21 | 1997-10-11 | Olin Corp | |
JP2920083B2 (ja) | 1995-02-23 | 1999-07-19 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
JP3949871B2 (ja) | 1999-12-10 | 2007-07-25 | 日本電解株式会社 | 粗化処理銅箔及びその製造方法 |
JP3306404B2 (ja) | 2000-01-28 | 2002-07-24 | 三井金属鉱業株式会社 | 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板 |
JP4475836B2 (ja) | 2000-09-25 | 2010-06-09 | イビデン株式会社 | 半導体素子の製造方法 |
JP4273309B2 (ja) * | 2003-05-14 | 2009-06-03 | 福田金属箔粉工業株式会社 | 低粗面電解銅箔及びその製造方法 |
JP2005353919A (ja) | 2004-06-11 | 2005-12-22 | Hitachi Cable Ltd | プリント配線板用銅箔の表面粗化処理方法 |
JP2005353920A (ja) | 2004-06-11 | 2005-12-22 | Hitachi Cable Ltd | プリント配線板用銅箔の表面粗化処理方法 |
JP2006210689A (ja) * | 2005-01-28 | 2006-08-10 | Fukuda Metal Foil & Powder Co Ltd | 高周波プリント配線板用銅箔及びその製造方法 |
JP4709575B2 (ja) * | 2005-04-15 | 2011-06-22 | 福田金属箔粉工業株式会社 | 銅箔の粗面化処理方法及び粗面化処理液 |
TWI434965B (zh) * | 2008-05-28 | 2014-04-21 | Mitsui Mining & Smelting Co | A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method |
KR102104161B1 (ko) * | 2009-03-27 | 2020-04-23 | 제이엑스금속주식회사 | 프린트 배선판용 동박 및 그 제조 방법 |
JP5242710B2 (ja) * | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP2011179053A (ja) * | 2010-02-26 | 2011-09-15 | Hitachi Cable Ltd | 粗化箔及びその製造方法 |
-
2012
- 2012-09-18 KR KR1020147009364A patent/KR20140054435A/ko active Application Filing
- 2012-09-18 MY MYPI2014700775A patent/MY175198A/en unknown
- 2012-09-18 WO PCT/JP2012/073839 patent/WO2013047272A1/fr active Application Filing
- 2012-09-18 KR KR1020167027466A patent/KR20160119875A/ko active Application Filing
- 2012-09-18 JP JP2013536189A patent/JP6029590B2/ja active Active
- 2012-09-18 CN CN201280048298.2A patent/CN103857833B/zh active Active
- 2012-09-18 KR KR1020187006370A patent/KR102059280B1/ko active IP Right Grant
- 2012-09-24 TW TW101134889A patent/TWI605735B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102059280B1 (ko) | 2019-12-24 |
TWI605735B (zh) | 2017-11-11 |
CN103857833B (zh) | 2018-09-07 |
JPWO2013047272A1 (ja) | 2015-03-26 |
KR20160119875A (ko) | 2016-10-14 |
KR20180026584A (ko) | 2018-03-12 |
CN103857833A (zh) | 2014-06-11 |
WO2013047272A1 (fr) | 2013-04-04 |
JP6029590B2 (ja) | 2016-11-24 |
TW201330719A (zh) | 2013-07-16 |
KR20140054435A (ko) | 2014-05-08 |
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