WO2023281759A1 - Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé - Google Patents
Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé Download PDFInfo
- Publication number
- WO2023281759A1 WO2023281759A1 PCT/JP2021/026044 JP2021026044W WO2023281759A1 WO 2023281759 A1 WO2023281759 A1 WO 2023281759A1 JP 2021026044 W JP2021026044 W JP 2021026044W WO 2023281759 A1 WO2023281759 A1 WO 2023281759A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- treated
- layer
- treatment layer
- treated copper
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 179
- 239000011889 copper foil Substances 0.000 title claims abstract description 164
- 239000010410 layer Substances 0.000 claims description 104
- 239000002335 surface treatment layer Substances 0.000 claims description 66
- 239000011347 resin Substances 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 52
- 238000011282 treatment Methods 0.000 claims description 47
- 238000007788 roughening Methods 0.000 claims description 41
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 20
- 229910052721 tungsten Inorganic materials 0.000 claims description 20
- 239000010937 tungsten Substances 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 6
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 description 52
- 238000007747 plating Methods 0.000 description 42
- 239000000243 solution Substances 0.000 description 41
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 29
- 238000009713 electroplating Methods 0.000 description 22
- 239000010949 copper Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 18
- 239000000203 mixture Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 14
- 239000006087 Silane Coupling Agent Substances 0.000 description 14
- 230000008878 coupling Effects 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 238000009826 distribution Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 229910000077 silane Inorganic materials 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 238000005259 measurement Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000011701 zinc Substances 0.000 description 11
- 239000007788 liquid Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 8
- 229910018605 Ni—Zn Inorganic materials 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 6
- 208000012868 Overgrowth Diseases 0.000 description 5
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 150000003658 tungsten compounds Chemical class 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000004873 anchoring Methods 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000002500 effect on skin Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- QWMFKVNJIYNWII-UHFFFAOYSA-N 5-bromo-2-(2,5-dimethylpyrrol-1-yl)pyridine Chemical compound CC1=CC=C(C)N1C1=CC=C(Br)C=N1 QWMFKVNJIYNWII-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010731 rolling oil Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004532 chromating Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- -1 methacryloxy Chemical group 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Cette feuille de cuivre traitée en surface a une feuille de cuivre et une couche traitée en surface formée sur au moins une surface de la feuille de cuivre. La couche traitée en surface a un Sku de 2,50-4,50 et un Str de 0,20 à 0,40.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/026044 WO2023281759A1 (fr) | 2021-07-09 | 2021-07-09 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
| CN202280013720.4A CN117120670A (zh) | 2021-07-09 | 2022-01-14 | 表面处理铜箔、覆铜积层板及印刷配线板 |
| PCT/JP2022/001215 WO2023281773A1 (fr) | 2021-07-09 | 2022-01-14 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/026044 WO2023281759A1 (fr) | 2021-07-09 | 2021-07-09 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023281759A1 true WO2023281759A1 (fr) | 2023-01-12 |
Family
ID=84800501
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/026044 WO2023281759A1 (fr) | 2021-07-09 | 2021-07-09 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
| PCT/JP2022/001215 WO2023281773A1 (fr) | 2021-07-09 | 2022-01-14 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2022/001215 WO2023281773A1 (fr) | 2021-07-09 | 2022-01-14 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117120670A (fr) |
| WO (2) | WO2023281759A1 (fr) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06169169A (ja) * | 1992-11-19 | 1994-06-14 | Nikko Guurudo Foil Kk | 印刷回路用銅箔及びその製造方法 |
| WO2010110092A1 (fr) * | 2009-03-27 | 2010-09-30 | 日鉱金属株式会社 | Feuille de cuivre pour carte de circuit imprimé et son procédé de production |
| WO2013047272A1 (fr) * | 2011-09-30 | 2013-04-04 | Jx日鉱日石金属株式会社 | Feuille de cuivre excellente en ce qui concerne l'adhésion avec une résine, son procédé de fabrication et plaque à circuits imprimés ou matière d'électrode négative de batterie utilisant une feuille de cuivre électrolytique |
| JP2014506202A (ja) * | 2010-12-14 | 2014-03-13 | スリーエム イノベイティブ プロパティズ カンパニー | 像及びそれを作製する方法 |
| WO2014081041A1 (fr) * | 2012-11-26 | 2014-05-30 | Jx日鉱日石金属株式会社 | Feuille de cuivre électrolytique traitée en surface, stratifié et carte de circuit imprimé |
| JP2014139336A (ja) * | 2012-09-11 | 2014-07-31 | Jx Nippon Mining & Metals Corp | キャリア付き銅箔 |
| WO2018110579A1 (fr) * | 2016-12-14 | 2018-06-21 | 古河電気工業株式会社 | Feuille de cuivre traitée en surface et stratifié cuivré |
| WO2018207786A1 (fr) * | 2017-05-09 | 2018-11-15 | Ｊｘ金属株式会社 | Feuille de cuivre électrolytique, stratifié cuivré, carte de circuit imprimé, leurs procédés de production, dispositif électronique et son procédé de production |
| JP2021085095A (ja) * | 2019-11-27 | 2021-06-03 | 長春石油化學股▲分▼有限公司 | 電解銅箔ならびにそれを含む電極およびリチウムイオン電池 |
| WO2021157362A1 (fr) * | 2020-02-04 | 2021-08-12 | 三井金属鉱業株式会社 | Feuille de cuivre traitée par rugosification, feuille de cuivre avec support, carte stratifiée cuivrée, et carte de circuit imprimé |
-
2021
- 2021-07-09 WO PCT/JP2021/026044 patent/WO2023281759A1/fr unknown
-
2022
- 2022-01-14 WO PCT/JP2022/001215 patent/WO2023281773A1/fr unknown
- 2022-01-14 CN CN202280013720.4A patent/CN117120670A/zh active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06169169A (ja) * | 1992-11-19 | 1994-06-14 | Nikko Guurudo Foil Kk | 印刷回路用銅箔及びその製造方法 |
| WO2010110092A1 (fr) * | 2009-03-27 | 2010-09-30 | 日鉱金属株式会社 | Feuille de cuivre pour carte de circuit imprimé et son procédé de production |
| JP2014506202A (ja) * | 2010-12-14 | 2014-03-13 | スリーエム イノベイティブ プロパティズ カンパニー | 像及びそれを作製する方法 |
| WO2013047272A1 (fr) * | 2011-09-30 | 2013-04-04 | Jx日鉱日石金属株式会社 | Feuille de cuivre excellente en ce qui concerne l'adhésion avec une résine, son procédé de fabrication et plaque à circuits imprimés ou matière d'électrode négative de batterie utilisant une feuille de cuivre électrolytique |
| JP2014139336A (ja) * | 2012-09-11 | 2014-07-31 | Jx Nippon Mining & Metals Corp | キャリア付き銅箔 |
| WO2014081041A1 (fr) * | 2012-11-26 | 2014-05-30 | Jx日鉱日石金属株式会社 | Feuille de cuivre électrolytique traitée en surface, stratifié et carte de circuit imprimé |
| WO2018110579A1 (fr) * | 2016-12-14 | 2018-06-21 | 古河電気工業株式会社 | Feuille de cuivre traitée en surface et stratifié cuivré |
| WO2018207786A1 (fr) * | 2017-05-09 | 2018-11-15 | Ｊｘ金属株式会社 | Feuille de cuivre électrolytique, stratifié cuivré, carte de circuit imprimé, leurs procédés de production, dispositif électronique et son procédé de production |
| JP2021085095A (ja) * | 2019-11-27 | 2021-06-03 | 長春石油化學股▲分▼有限公司 | 電解銅箔ならびにそれを含む電極およびリチウムイオン電池 |
| WO2021157362A1 (fr) * | 2020-02-04 | 2021-08-12 | 三井金属鉱業株式会社 | Feuille de cuivre traitée par rugosification, feuille de cuivre avec support, carte stratifiée cuivrée, et carte de circuit imprimé |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117120670A (zh) | 2023-11-24 |
| WO2023281773A1 (fr) | 2023-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI776049B (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| JP7114499B2 (ja) | 表面処理銅箔、銅張積層板及びプリント配線板 | |
| TW202122642A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| TWI747088B (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| TWI749827B (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| WO2023281759A1 (fr) | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé | |
| WO2022154102A1 (fr) | Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé | |
| WO2023281774A1 (fr) | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé | |
| WO2023281778A1 (fr) | Feuille de cuivre traitée en surface, carte stratifiée plaquée de cuivre et carte de circuit imprimé | |
| WO2023281777A1 (fr) | Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé | |
| WO2024070247A1 (fr) | Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé | |
| WO2024070245A1 (fr) | Feuille de cuivre traitée en surface, plaque de stratifié revêtue de cuivre et carte de circuit imprimé | |
| WO2024070248A1 (fr) | Feuille de cuivre traitée en surface, stratifié plaqué cuivre et carte de circuit imprimé | |
| WO2024070246A1 (fr) | Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé | |
| WO2023281775A1 (fr) | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé | |
| WO2023281776A1 (fr) | Feuille de cuivre traitée en surface, plaque stratifiée plaquée de cuivre et carte de circuit imprimé | |
| TW202413736A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| TW202415155A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| TW202413724A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| TW202415156A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21949391 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |