MY158361A - Curable organopolysiloxane composition and semiconductor device - Google Patents

Curable organopolysiloxane composition and semiconductor device

Info

Publication number
MY158361A
MY158361A MYPI2010006013A MYPI2010006013A MY158361A MY 158361 A MY158361 A MY 158361A MY PI2010006013 A MYPI2010006013 A MY PI2010006013A MY PI2010006013 A MYPI2010006013 A MY PI2010006013A MY 158361 A MY158361 A MY 158361A
Authority
MY
Malaysia
Prior art keywords
groups
curable organopolysiloxane
semiconductor device
organopolysiloxane composition
chain organopolysiloxane
Prior art date
Application number
MYPI2010006013A
Other languages
English (en)
Inventor
Takashi Sagawa
Makoto Yoshitake
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of MY158361A publication Critical patent/MY158361A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
MYPI2010006013A 2008-06-18 2009-06-11 Curable organopolysiloxane composition and semiconductor device MY158361A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008159723A JP5667740B2 (ja) 2008-06-18 2008-06-18 硬化性オルガノポリシロキサン組成物及び半導体装置

Publications (1)

Publication Number Publication Date
MY158361A true MY158361A (en) 2016-09-30

Family

ID=40957669

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010006013A MY158361A (en) 2008-06-18 2009-06-11 Curable organopolysiloxane composition and semiconductor device

Country Status (9)

Country Link
US (1) US8846828B2 (https=)
EP (1) EP2303965B1 (https=)
JP (1) JP5667740B2 (https=)
KR (1) KR101589936B1 (https=)
CN (1) CN102066492B (https=)
MY (1) MY158361A (https=)
RU (1) RU2503694C2 (https=)
TW (1) TWI470029B (https=)
WO (1) WO2009154261A1 (https=)

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JP2014077116A (ja) * 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、それを用いてなる半導体封止材および光半導体装置
CN105452386B (zh) 2013-08-09 2018-12-11 横滨橡胶株式会社 可固化树脂组合物
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KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
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WO2015194159A1 (ja) * 2014-06-20 2015-12-23 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびその製造方法
WO2016022332A1 (en) * 2014-08-06 2016-02-11 Dow Corning Corporation Organosiloxane compositions and uses thereof
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
WO2018062009A1 (ja) * 2016-09-29 2018-04-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
KR101864505B1 (ko) * 2016-11-21 2018-06-29 주식회사 케이씨씨 방열성이 우수한 실리콘 조성물
KR102216289B1 (ko) * 2016-12-20 2021-02-18 다우 실리콘즈 코포레이션 경화성 실리콘 조성물
EP3580278A1 (en) * 2017-02-08 2019-12-18 Elkem Silicones USA Corp. Silicone rubber syntactic foam
JP7457450B2 (ja) * 2017-10-20 2024-03-28 信越化学工業株式会社 シリコーン組成物、シリコーンゴム硬化物、及び電力ケーブル
IT201800006544A1 (it) * 2018-06-21 2019-12-21 Anodo per evoluzione elettrolitica di cloro
TWI844552B (zh) 2018-09-10 2024-06-11 美商陶氏有機矽公司 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成
CN113993956B (zh) 2019-05-31 2023-11-07 陶氏东丽株式会社 固化性聚有机硅氧烷组合物以及由该固化性聚有机硅氧烷组合物的固化物形成的光学构件
JP7667734B2 (ja) 2019-05-31 2025-04-23 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、及びその硬化物からなる光学部材
JP7591035B2 (ja) * 2019-07-30 2024-11-27 エルケム・シリコーンズ・ユーエスエイ・コーポレーション 液体シリコーンゴム組成物から射出成形によりシリコーンゴム製品を製造するのに有用なプロセス及び装置組立体
JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
JP7285238B2 (ja) * 2020-08-14 2023-06-01 信越化学工業株式会社 シリコーン接着剤組成物、及びシリコーンゴム硬化物
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
CN119317683A (zh) * 2022-06-29 2025-01-14 陶氏东丽株式会社 可uv固化的有机聚硅氧烷组合物及其应用
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Also Published As

Publication number Publication date
EP2303965B1 (en) 2015-10-28
RU2010151563A (ru) 2012-07-27
RU2503694C2 (ru) 2014-01-10
JP5667740B2 (ja) 2015-02-12
US8846828B2 (en) 2014-09-30
EP2303965A1 (en) 2011-04-06
TWI470029B (zh) 2015-01-21
US20110251356A1 (en) 2011-10-13
CN102066492B (zh) 2014-02-05
JP2010001336A (ja) 2010-01-07
TW201000560A (en) 2010-01-01
CN102066492A (zh) 2011-05-18
WO2009154261A1 (en) 2009-12-23
KR101589936B1 (ko) 2016-01-29
KR20110031287A (ko) 2011-03-25

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