RU2503694C2 - Отверждаемая органополисилоксановая композиция и полупроводниковое устройство - Google Patents

Отверждаемая органополисилоксановая композиция и полупроводниковое устройство Download PDF

Info

Publication number
RU2503694C2
RU2503694C2 RU2010151563/05A RU2010151563A RU2503694C2 RU 2503694 C2 RU2503694 C2 RU 2503694C2 RU 2010151563/05 A RU2010151563/05 A RU 2010151563/05A RU 2010151563 A RU2010151563 A RU 2010151563A RU 2503694 C2 RU2503694 C2 RU 2503694C2
Authority
RU
Russia
Prior art keywords
groups
component
sio
range
silicon
Prior art date
Application number
RU2010151563/05A
Other languages
English (en)
Russian (ru)
Other versions
RU2010151563A (ru
Inventor
Такаши САГАВА
Макото ЙОШИТАКЕ
Original Assignee
Дау Корнинг Торей Ко., Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Дау Корнинг Торей Ко., Лтд. filed Critical Дау Корнинг Торей Ко., Лтд.
Publication of RU2010151563A publication Critical patent/RU2010151563A/ru
Application granted granted Critical
Publication of RU2503694C2 publication Critical patent/RU2503694C2/ru

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
RU2010151563/05A 2008-06-18 2009-06-11 Отверждаемая органополисилоксановая композиция и полупроводниковое устройство RU2503694C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008159723A JP5667740B2 (ja) 2008-06-18 2008-06-18 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2008-159723 2008-06-18
PCT/JP2009/061138 WO2009154261A1 (en) 2008-06-18 2009-06-11 Curable organopolysiloxane composition and semiconductor device

Publications (2)

Publication Number Publication Date
RU2010151563A RU2010151563A (ru) 2012-07-27
RU2503694C2 true RU2503694C2 (ru) 2014-01-10

Family

ID=40957669

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2010151563/05A RU2503694C2 (ru) 2008-06-18 2009-06-11 Отверждаемая органополисилоксановая композиция и полупроводниковое устройство

Country Status (9)

Country Link
US (1) US8846828B2 (https=)
EP (1) EP2303965B1 (https=)
JP (1) JP5667740B2 (https=)
KR (1) KR101589936B1 (https=)
CN (1) CN102066492B (https=)
MY (1) MY158361A (https=)
RU (1) RU2503694C2 (https=)
TW (1) TWI470029B (https=)
WO (1) WO2009154261A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2747992C2 (ru) * 2017-02-08 2021-05-18 ЭЛКЕМ СИЛИКОНС ЮЭсЭй КОРП. Синтактическая пена из силиконового каучука

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5972512B2 (ja) 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
CN102859728A (zh) * 2010-04-27 2013-01-02 信越化学工业株式会社 发光装置及发光装置的制造方法
JP5505991B2 (ja) * 2010-04-30 2014-05-28 信越化学工業株式会社 高接着性シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP5682257B2 (ja) * 2010-07-30 2015-03-11 三菱化学株式会社 半導体発光装置用樹脂組成物
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
JP5690571B2 (ja) * 2010-12-07 2015-03-25 株式会社ダイセル 硬化性樹脂組成物
JP6300218B2 (ja) * 2010-12-31 2018-03-28 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
JP5453326B2 (ja) * 2011-01-11 2014-03-26 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
DE102011004789A1 (de) * 2011-02-25 2012-08-30 Wacker Chemie Ag Selbsthaftende, zu Elastomeren vernetzbare Siliconzusammensetzungen
JP5522111B2 (ja) * 2011-04-08 2014-06-18 信越化学工業株式会社 シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
JP5992666B2 (ja) 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
JP5937798B2 (ja) * 2011-09-07 2016-06-22 株式会社ダイセル ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
WO2013077699A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
JP5871413B2 (ja) * 2011-11-25 2016-03-01 エルジー・ケム・リミテッド 硬化性組成物
JP2013139547A (ja) * 2011-12-05 2013-07-18 Jsr Corp 硬化性組成物、硬化物および光半導体装置
JP5652387B2 (ja) * 2011-12-22 2015-01-14 信越化学工業株式会社 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置
JP5660145B2 (ja) * 2012-04-03 2015-01-28 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
JP6435260B2 (ja) 2012-05-14 2018-12-05 モーメンティブ・パフォーマンス・マテリアルズ・インク 高屈折率材料
KR101560046B1 (ko) * 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
JP2014031394A (ja) * 2012-08-01 2014-02-20 Shin Etsu Chem Co Ltd 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
CN104619780B (zh) * 2012-09-14 2017-07-07 横滨橡胶株式会社 固化性树脂组合物
JP2014077116A (ja) * 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、それを用いてなる半導体封止材および光半導体装置
CN105452386B (zh) 2013-08-09 2018-12-11 横滨橡胶株式会社 可固化树脂组合物
US9951186B2 (en) * 2013-09-03 2018-04-24 Dow Corning Toray Co., Ltd Silicone gel composition and use thereof
JP6072662B2 (ja) * 2013-10-10 2017-02-01 信越化学工業株式会社 シリコーン樹脂組成物、該組成物を用いた積層板、及び該積層板を有するｌｅｄ装置
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
WO2015136820A1 (ja) 2014-03-12 2015-09-17 横浜ゴム株式会社 硬化性樹脂組成物
JP6324206B2 (ja) * 2014-05-16 2018-05-16 アイカ工業株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
US10005906B2 (en) 2014-06-03 2018-06-26 Dow Corning Toray Co., Ltd. Curable silicone composition, and optical semiconductor device
WO2015194159A1 (ja) * 2014-06-20 2015-12-23 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびその製造方法
WO2016022332A1 (en) * 2014-08-06 2016-02-11 Dow Corning Corporation Organosiloxane compositions and uses thereof
JP6803842B2 (ja) 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
WO2018062009A1 (ja) * 2016-09-29 2018-04-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
KR101864505B1 (ko) * 2016-11-21 2018-06-29 주식회사 케이씨씨 방열성이 우수한 실리콘 조성물
KR102216289B1 (ko) * 2016-12-20 2021-02-18 다우 실리콘즈 코포레이션 경화성 실리콘 조성물
JP7457450B2 (ja) * 2017-10-20 2024-03-28 信越化学工業株式会社 シリコーン組成物、シリコーンゴム硬化物、及び電力ケーブル
IT201800006544A1 (it) * 2018-06-21 2019-12-21 Anodo per evoluzione elettrolitica di cloro
TWI844552B (zh) 2018-09-10 2024-06-11 美商陶氏有機矽公司 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成
CN113993956B (zh) 2019-05-31 2023-11-07 陶氏东丽株式会社 固化性聚有机硅氧烷组合物以及由该固化性聚有机硅氧烷组合物的固化物形成的光学构件
JP7667734B2 (ja) 2019-05-31 2025-04-23 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、及びその硬化物からなる光学部材
JP7591035B2 (ja) * 2019-07-30 2024-11-27 エルケム・シリコーンズ・ユーエスエイ・コーポレーション 液体シリコーンゴム組成物から射出成形によりシリコーンゴム製品を製造するのに有用なプロセス及び装置組立体
JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
JP7285238B2 (ja) * 2020-08-14 2023-06-01 信越化学工業株式会社 シリコーン接着剤組成物、及びシリコーンゴム硬化物
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
CN119317683A (zh) * 2022-06-29 2025-01-14 陶氏东丽株式会社 可uv固化的有机聚硅氧烷组合物及其应用
CN115678497B (zh) * 2023-01-04 2025-05-06 北京康美特科技股份有限公司 用于微型led元件的有机硅封装胶及其封装方法与应用
CN119546705A (zh) * 2023-02-16 2025-02-28 瓦克化学股份公司 可固化聚硅氧烷组合物和包含其的密封剂

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU438286A1 (ru) * 1972-09-15 1978-02-28 Предприятие П/Я В-8415 Композици холодного отверждени
RU2115676C1 (ru) * 1996-05-20 1998-07-20 Общественное объединение "Евразийское физическое общество" Вспениваемая органосилоксановая композиция
RU2205848C2 (ru) * 1997-10-29 2003-06-10 Родиа Шими Силиконовая композиция, способная сшиваться с образованием клейкого геля и амортизатора с микросферами
WO2007056026A1 (en) * 2005-11-08 2007-05-18 Momentive Performance Materials, Inc. Silicone gel-forming compositions and hysteretic silicone gel and device comprising the gel
WO2007132910A1 (en) * 2006-05-11 2007-11-22 Dow Corning Toray Co., Ltd. Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device
WO2007148812A1 (en) * 2006-06-23 2007-12-27 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3344286B2 (ja) 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
JP3523098B2 (ja) 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
JP4009067B2 (ja) * 2001-03-06 2007-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
JP4180474B2 (ja) 2003-09-03 2008-11-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加硬化型シリコーン組成物
US20070156604A1 (en) * 2005-06-20 2007-07-05 Stanley James Method and system for constructing and using a personalized database of trusted metadata
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
US8258502B2 (en) * 2006-02-24 2012-09-04 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP5972512B2 (ja) 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU438286A1 (ru) * 1972-09-15 1978-02-28 Предприятие П/Я В-8415 Композици холодного отверждени
RU2115676C1 (ru) * 1996-05-20 1998-07-20 Общественное объединение "Евразийское физическое общество" Вспениваемая органосилоксановая композиция
RU2205848C2 (ru) * 1997-10-29 2003-06-10 Родиа Шими Силиконовая композиция, способная сшиваться с образованием клейкого геля и амортизатора с микросферами
WO2007056026A1 (en) * 2005-11-08 2007-05-18 Momentive Performance Materials, Inc. Silicone gel-forming compositions and hysteretic silicone gel and device comprising the gel
WO2007132910A1 (en) * 2006-05-11 2007-11-22 Dow Corning Toray Co., Ltd. Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device
WO2007148812A1 (en) * 2006-06-23 2007-12-27 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2747992C2 (ru) * 2017-02-08 2021-05-18 ЭЛКЕМ СИЛИКОНС ЮЭсЭй КОРП. Синтактическая пена из силиконового каучука

Also Published As

Publication number Publication date
EP2303965B1 (en) 2015-10-28
RU2010151563A (ru) 2012-07-27
JP5667740B2 (ja) 2015-02-12
US8846828B2 (en) 2014-09-30
EP2303965A1 (en) 2011-04-06
TWI470029B (zh) 2015-01-21
US20110251356A1 (en) 2011-10-13
CN102066492B (zh) 2014-02-05
JP2010001336A (ja) 2010-01-07
TW201000560A (en) 2010-01-01
CN102066492A (zh) 2011-05-18
MY158361A (en) 2016-09-30
WO2009154261A1 (en) 2009-12-23
KR101589936B1 (ko) 2016-01-29
KR20110031287A (ko) 2011-03-25

Similar Documents

Publication Publication Date Title
RU2503694C2 (ru) Отверждаемая органополисилоксановая композиция и полупроводниковое устройство
RU2503696C2 (ru) Отверждаемая органополисилоксановая композиция и полупроводниковое устройство
KR101499709B1 (ko) 경화성 오가노폴리실록산 조성물 및 반도체 장치
EP2032653B1 (en) Curable organopolysiloxane composition and semiconductor device
KR100976075B1 (ko) 경화성 오가노폴리실록산 조성물 및 당해 조성물을사용하여 제조한 반도체 장치
JP5769622B2 (ja) 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP5913538B2 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置

Legal Events

Date Code Title Description
MM4A The patent is invalid due to non-payment of fees

Effective date: 20170612